WAN; Xianjin

Patent Applications and Registrations

Patent applications and USPTO patent grants for WAN; Xianjin.The latest application filed is for "semiconductor structure and method of forming the same".

Company Profile

15.7.13

WAN; Xianjin - Wuhan CN
WAN; Xianjin - Wuhan City CN
Wan; Xianjin - Hubei CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Structure And Method Of Forming The Same App 20220216178 - WANG; Xinsheng ; et al.	2022-07-07
Method Of Forming Semiconductor Structure App 20220020725 - WANG; Xinsheng ; et al.	2022-01-20
Bonding contacts having capping layer and method for forming the same Grant 11,177,231 - Pan , et al. November 16, 2	2021-11-16
Through Array Contact Structure Of Three-dimensional Memory Device App 20210126005 - LU; Zhenyu ; et al.	2021-04-29
Bonding Contacts Having Capping Layer And Method For Forming The Same App 20210091033 - Pan; Jie ; et al.	2021-03-25
Joint Opening Structures Of Three-dimensional Memory Devices And Methods For Forming The Same App 20210074718 - LU; Zhenyu ; et al.	2021-03-11
Through array contact structure of three- dimensional memory device Grant 10,910,397 - Lu , et al. February 2, 2	2021-02-02
Joint opening structures of three-dimensional memory devices and methods for forming the same Grant 10,886,291 - Lu , et al. January 5, 2	2021-01-05
Joint opening structures of three-dimensional memory devices and methods for forming the same Grant 10,847,532 - Lu , et al. November 24, 2	2020-11-24
Semiconductor structure and method of forming the same Grant 10,818,631 - Wang , et al. October 27, 2	2020-10-27
Semiconductor structure and forming method thereof Grant 10,811,380 - Wang , et al. October 20, 2	2020-10-20
Semiconductor Processing Apparatus And Control Method Thereof App 20200208264 - PENG; Hao ; et al.	2020-07-02
Through Array Contact Structure Of Three-dimensional Memory Device App 20200152653 - LU; Zhenyu ; et al.	2020-05-14
Bonding Contacts Having Capping Layer And Method For Forming The Same App 20200051945 - Pan; Jie ; et al.	2020-02-13
Through array contact structure of three-dimensional memory device Grant 10,553,604 - Lu , et al. Fe	2020-02-04
Semiconductor Structure And Method Of Forming The Same App 20200006285 - WANG; Xinsheng ; et al.	2020-01-02
Semiconductor Structure And Method Of Forming The Same App 20200006278 - WANG; Xinsheng ; et al.	2020-01-02
Semiconductor Structure And Forming Method Thereof App 20200006277 - WANG; Xinsheng ; et al.	2020-01-02
Joint Openning Structures Of Three-dimensional Memory Devices And Methods For Forming The Same App 20190081060 - LU; Zhenyu ; et al.	2019-03-14
Through Array Contact Structure Of Three-dimensional Memory Device App 20190043879 - LU; Zhenyu ; et al.	2019-02-07

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