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Semiconductor Device And Method Of Forming The Same
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Thermal via arrangement for multi-channel semiconductor device
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Thermal Via Arrangement For Multi-channel Semiconductor Device
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Method for stacked contact with low aspect ratio
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Surface treatment of metal interconnect lines
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Method for Stacked Contact with Low Aspect Ratio
App 20110092019 - Yu; Chen-Hua ; et al. | 2011-04-21 |
Stacked contact with low aspect ratio
Grant 7,880,303 - Yu , et al. February 1, 2 | 2011-02-01 |
Semiconductor device fault detection system and method
Grant 7,791,070 - Huang , et al. September 7, 2 | 2010-09-07 |
Seal ring structure for integrated circuit chips
Grant 7,777,338 - Yao , et al. August 17, 2 | 2010-08-17 |
Bond pad structure with stress-buffering layer capping interconnection metal layer
Grant 7,741,714 - Huang , et al. June 22, 2 | 2010-06-22 |
Stacked contact with low aspect ratio
App 20080191352 - Yu; Chen-Hua ; et al. | 2008-08-14 |
Method for forming an interconnection structure for ic metallization
Grant 7,291,557 - Wan , et al. November 6, 2 | 2007-11-06 |
Surface treated low-k dielectric as diffusion barrier for copper metallization
Grant 7,271,103 - Huang , et al. September 18, 2 | 2007-09-18 |
Semiconductor device fault detection system and method
App 20070096092 - Huang; Tai-Chun ; et al. | 2007-05-03 |
Structure for reducing stress-induced voiding in an interconnect of integrated circuits
App 20060108696 - Yao; Chih-Hsiang ; et al. | 2006-05-25 |
Structure for reducing stress-induced voiding in an interconnect of integrated circuits
Grant 7,042,097 - Yao , et al. May 9, 2 | 2006-05-09 |
Bond pad structure with stress-buffering layer capping interconnection metal layer
App 20060091536 - Huang; Tai-Chun ; et al. | 2006-05-04 |
Seal ring structure for integrated circuit chips
App 20060055007 - Yao; Chih-Hsiang ; et al. | 2006-03-16 |
Interconnection structure for IC metallization
App 20060057841 - Wan; Wen-Kai ; et al. | 2006-03-16 |
Methods for enhancing die saw and packaging reliability
App 20060055002 - Yao; Chih-Hsiang ; et al. | 2006-03-16 |
Surface treatment of metal interconnect lines
App 20060001160 - Wan; Wen-Kai ; et al. | 2006-01-05 |
Surface treatment of metal interconnect lines
Grant 6,955,984 - Wan , et al. October 18, 2 | 2005-10-18 |
Surface treated low-k dielectric as diffusion barrier for copper metallization
App 20050085083 - Huang, Kuei-Wu ; et al. | 2005-04-21 |
Method and pattern for reducing interconnect failures
Grant 6,831,365 - Yao , et al. December 14, 2 | 2004-12-14 |
Structure for reducing stress-induced voiding in an interconnect of integrated circuits
App 20040245639 - Yao, Chih-Hsiang ; et al. | 2004-12-09 |
Method And Pattern For Reducing Interconnect Failures
App 20040238959 - Yao, Chih-Hsiang ; et al. | 2004-12-02 |
Surface treatment of metal interconnect lines
App 20040229460 - Wan, Wen-Kai ; et al. | 2004-11-18 |
Method for forming a semiconductor device having high-K gate dielectric material
Grant 6,746,900 - Liu , et al. June 8, 2 | 2004-06-08 |
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