Walker; George Frederick

Patent Applications and Registrations

Patent applications and USPTO patent grants for Walker; George Frederick.The latest application filed is for "high density integrated circuit apparatus, test probe and methods of use thereof".

Company Profile

0.24.62

Walker; George Frederick - New York NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer Grant 7,880,305 - Cheng , et al. February 1, 2	2011-02-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100052715 - Beaman; Brian Samuel ; et al.	2010-03-04
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045266 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045321 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045318 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045324 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045320 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045317 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20090315579 - Beaman; Brian Samuel ; et al.	2009-12-24
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer App 20090302454 - Cheng; Yu- Ting ; et al.	2009-12-10
High density integrated circuit apparatus, test probe and methods of use thereof Grant 7,538,565 - Beaman , et al. May 26, 2	2009-05-26
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20090128176 - Beaman; Brian Samuel ; et al.	2009-05-21
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080132094 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080129320 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080129319 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080123310 - Beaman; Brian Samuel ; et al.	2008-05-29
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080121879 - Beaman; Brian Samuel ; et al.	2008-05-29
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116913 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116915 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116916 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117612 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117611 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117613 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116914 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116912 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112144 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112149 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112147 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112146 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112148 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111568 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111569 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112145 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111570 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106284 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106282 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106281 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106283 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106285 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106872 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106291 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100318 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100317 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100316 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100324 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048697 - Beaman; Brian Samuel ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048690 - Beaman; Brian Samuel ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048691 - Beaman; Brian Samuel ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080047741 - Beaman; Brian Samuel ; et al.	2008-02-28
High density integrated circuit apparatus, test probe and methods of use thereof App 20070271781 - Beaman; Brian Samuel ; et al.	2007-11-29
Silicon chip carrier with conductive through-vias and method for fabricating same Grant 7,276,787 - Edelstein , et al. October 2, 2	2007-10-02
High density integral test probe Grant 7,276,919 - Beaman , et al. October 2, 2	2007-10-02
Silicon chip carrier with conductive through-vias and method for fabricating same App 20060027934 - Edelstein; Daniel Charles ; et al.	2006-02-09
Silicon chip carrier with conductive through-vias and method for fabricating same App 20050121768 - Edelstein, Daniel Charles ; et al.	2005-06-09
High density integrated circuit apparatus, test probe and methods of use thereof App 20050062492 - Beaman, Brian Samuel ; et al.	2005-03-24
High density area array solder microjoining interconnect structure and fabrication method Grant 6,819,000 - Magerlein , et al. November 16, 2	2004-11-16
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same Grant 6,747,472 - Magerlein , et al. June 8, 2	2004-06-08
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer App 20040089948 - Cheng, Yu-Ting ; et al.	2004-05-13
High density raised stud microjoining system and methods of fabricating the same Grant 6,732,908 - Furman , et al. May 11, 2	2004-05-11
High density area array solder microjoining interconnect structure and fabrication method App 20040084782 - Magerlein, John Harold ; et al.	2004-05-06
High density area array solder microjoining interconnect structure and fabrication method Grant 6,661,098 - Magerlein , et al. December 9, 2	2003-12-09
Method for forming Co-W-P-Au films Grant 6,646,345 - Sambucetti , et al. November 11, 2	2003-11-11
High density area array solder microjoining interconnect structure and fabrication method App 20030137058 - Magerlein, John Harold ; et al.	2003-07-24
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same App 20030136813 - Magerlein, John Harold ; et al.	2003-07-24
High density raised stud microjoining system and methods of fabricating the same App 20030136814 - Furman, Bruce Kenneth ; et al.	2003-07-24
Structural design and processes to control probe position accuracy in a wafer test probe assembly App 20030048108 - Beaman, Brian Samuel ; et al.	2003-03-13
Method for forming Co-W-P-Au films App 20020123220 - Sambucetti, Carlos Juan ; et al.	2002-09-05
Method and apparatus for in-situ testing of integrated circuit chips Grant 6,414,509 - Bhatt , et al. July 2, 2	2002-07-02
Semiconductor wafer test and burn-in Grant 6,351,134 - Leas , et al. February 26, 2	2002-02-26
High density integrated circuit apparatus, test probe and methods of use thereof App 20020014004 - Beaman, Brian Samuel ; et al.	2002-02-07
High density integral test probe and fabrication method App 20020011001 - Beaman, Brian Samuel ; et al.	2002-01-31
Semiconductor Wafer Test And Burn-in App 20020003432 - LEAS, JAMES MARC ; et al.	2002-01-10
High density integrated circuit apparatus, test probe and methods of use thereof Grant 6,334,247 - Beaman , et al. January 1, 2	2002-01-01
Method of making high density integral test probe Grant 6,332,270 - Beaman , et al. December 25, 2	2001-12-25
Method for forming Co-W-P-Au films Grant 6,323,128 - Sambucetti , et al. November 27, 2	2001-11-27
Method Of Making A High Density Integral Test Probe App 20010040460 - BEAMAN, BRIAN SAMUEL ; et al.	2001-11-15
High density integrated circuit apparatus, test probe and methods of use thereof Grant 6,300,780 - Beaman , et al. October 9, 2	2001-10-09
Radio frequency identification tag Grant 6,078,259 - Brady , et al. June 20, 2	2000-06-20
Method of making a radio frequency identification tag Grant 5,972,156 - Brady , et al. October 26, 1	1999-10-26
Dendritic powder materials for high conductivity paste applications Grant 5,958,590 - Kang , et al. September 28, 1	1999-09-28
Semiconductor wafer test and burn-in Grant 5,929,651 - Leas , et al. July 27, 1	1999-07-27
Electronic devices having metallurgies containing copper-semiconductor compounds Grant 5,855,993 - Brady , et al. January 5, 1	1999-01-05
Integral rigid chip test probe Grant 5,838,160 - Beaman , et al. November 17, 1	1998-11-17
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof Grant 5,821,763 - Beaman , et al. October 13, 1	1998-10-13
Selectively filled adhesives for semiconductor chip interconnection and encapsulation Grant 5,813,870 - Gaynes , et al. September 29, 1	1998-09-29
Radio frequency identification tag Grant 5,682,143 - Brady , et al. October 28, 1	1997-10-28

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