Vivalda; John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vivalda; John.The latest application filed is for "system and method for superconducting multi-chip module".

Company Profile

3.8.4

Vivalda; John - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System And Method For Superconducting Multi-chip Module App 20210408355 - Yohannes; Daniel ; et al.	2021-12-30
System and method for superconducting multi-chip module Grant 11,121,302 - Yohannes , et al. September 14, 2	2021-09-14
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Grant 10,833,243 - Tolpygo , et al. November 10, 2	2020-11-10
System And Method For Superconducting Multi-chip Module App 20200119251 - Yohannes; Daniel ; et al.	2020-04-16
Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit Grant 10,283,694 - Yohannes , et al.	2019-05-07
Method For Increasing The Integration Level Of Superconducting Electronics Circuits, And A Resulting Circuit App 20170345990 - Yohannes; Daniel ; et al.	2017-11-30
Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit Grant 9,741,918 - Yohannes , et al. August 22, 2	2017-08-22
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Grant 9,741,920 - Tolpygo , et al. August 22, 2	2017-08-22
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Grant 9,130,116 - Tolpygo , et al. September 8, 2	2015-09-08
Method For Increasing The Integration Level Of Superconducting Electronics Circuits, And A Resulting Circuit App 20150119253 - Yohannes; Daniel ; et al.	2015-04-30
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Grant 8,437,818 - Tolpygo , et al. May 7, 2	2013-05-07
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Grant 8,301,214 - Tolpygo , et al. October 30, 2	2012-10-30

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