VISWANATH; Ram S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for VISWANATH; Ram S..The latest application filed is for "no mold shelf package design and process flow for advanced package architectures".

Company Profile

6.20.28

VISWANATH; Ram S. - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
No Mold Shelf Package Design And Process Flow For Advanced Package Architectures App 20210104490 - LI; Wei ; et al.	2021-04-08
Rlink--die to die channel interconnect configurations to improve signaling Grant 10,784,204 - Aygun , et al. Sept	2020-09-22
Structures For Conducting Heat With A Packaged Device And Method Of Providing Same App 20200258759 - A1	2020-08-13
Interconnect Architecture With Silicon Interposer And Emib App 20200211969 - HOSSAIN; MD Altaf ; et al.	2020-07-02
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling App 20200066641 - AYGUN; Kemal ; et al.	2020-02-27
Integrated circuit structures with recessed conductive contacts for package on package Grant 10,424,561 - Lee , et al. Sept	2019-09-24
Printed circuit board with a recess to accommodate discrete components in a package Grant 10,187,996 - Swaminathan , et al. Ja	2019-01-22
Printed Circuit Board With A Recess To Accommodate Discrete Components In A Package App 20180270957 - Swaminathan; Rajasekaran ; et al.	2018-09-20
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package App 20180226381 - LEE; KYU-OH ; et al.	2018-08-09
Integrated circuit structures with recessed conductive contacts for package on package Grant 9,865,568 - Lee , et al. January 9, 2	2018-01-09
Cpu Package Substrates With Removable Memory Mechanical Interfaces App 20180007791 - Prakash; Mani ; et al.	2018-01-04
CPU package substrates with removable memory mechanical interfaces Grant 9,832,876 - Prakash , et al. November 28, 2	2017-11-28
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package App 20170207196 - LEE; KYU-OH ; et al.	2017-07-20
Low profile zero/low insertion force package top side flex cable connector architecture Grant 9,640,887 - Ganesan , et al. May 2, 2	2017-05-02
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,461,014 - Srinivasan , et al. October 4, 2	2016-10-04
Low Profile Zero/low Insertion Force Package Top Side Flex Cable Connector Architecture App 20160240949 - Ganesan; Sanka ; et al.	2016-08-18
3D integrated circuit package with window interposer Grant 9,391,013 - Mallik , et al. July 12, 2	2016-07-12
Cpu Package Substrates With Removable Memory Mechanical Interfaces App 20160183374 - Prakash; Mani ; et al.	2016-06-23
Low profile zero/low insertion force package top side flex cable connector architecture Grant 9,324,678 - Ganesan , et al. April 26, 2	2016-04-26
Integrated circuit connectors Grant 9,265,170 - Swaminathan , et al. February 16, 2	2016-02-16
3d Integrated Circuit Package With Window Interposer App 20150332994 - MALLIK; Debendra ; et al.	2015-11-19
3D integrated circuit package with window interposer Grant 9,129,958 - Mallik , et al. September 8, 2	2015-09-08
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20150221609 - Srinivasan; Sriram ; et al.	2015-08-06
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,064,971 - Srinivasan , et al. June 23, 2	2015-06-23
Integrated Circuit Connectors App 20150118870 - Swaminathan; Rajasekaran ; et al.	2015-04-30
Package Assembly Configurations For Multiple Dies And Associated Techniques App 20150014852 - Liu; Yueli ; et al.	2015-01-15
Low Profile Zero/low Insertion Force Package Top Side Flex Cable Connector Architecture App 20140217571 - Ganesan; Sanka ; et al.	2014-08-07
3d Integrated Circuit Package With Window Interposer App 20140191419 - Mallik; Debendra ; et al.	2014-07-10
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20140175644 - Srinivasan; Sriram ; et al.	2014-06-26
Package-on-package Interconnect Stiffener App 20130292838 - Ganesan; Sanka ; et al.	2013-11-07
Package-on-package interconnect stiffener Grant 8,513,792 - Ganesan , et al. August 20, 2	2013-08-20
Package-on-package interconnect stiffener App 20100258927 - Ganesan; Sanka ; et al.	2010-10-14
Thermal design for minimizing interface in a multi-site thermal contact condition Grant 6,888,722 - Viswanath May 3, 2	2005-05-03
Thermal design for minimizing interface in a multi-site thermal contact condition App 20040104467 - Viswanath, Ram S.	2004-06-03
Computer utilizing refrigeration for cooling Grant 6,493,223 - Viswanath , et al. December 10, 2	2002-12-10
Pickup chuck with an integral heatsink Grant 6,019,166 - Viswanath , et al. February 1, 2	2000-02-01
Pickup chuck with an integral heat pipe Grant 5,944,093 - Viswanath August 31, 1	1999-08-31

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