VISHAY GENERAL SEMICONDUCTOR, LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for VISHAY GENERAL SEMICONDUCTOR, LLC.The latest application filed is for "packaging process for plating with selective molding".

Company Profile

0.68.55

VISHAY GENERAL SEMICONDUCTOR, LLC - Malvern PA US
Vishay General Semiconductor LLC - Hauppauge NY US
Vishay General Semiconductor, LLC - Columbus NE
Vishay General Semiconductor LLC; - US
Vishay General Semiconductor LLC - Happauge NY
Vishay General Semiconductor LLC - N/A
VISHAY GENERAL SEMICONDUCTOR, LLC. - Columbus NE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Packaging process for side-wall plating with a conductive film Grant 11,450,534 - Jin , et al. September 20, 2	2022-09-20
Packaging process for plating with selective molding Grant 11,393,699 - Ding , et al. July 19, 2	2022-07-19
Packaging Process For Plating With Selective Molding App 20210375641 - DING; Huiying ; et al.	2021-12-02
Packaging Process For Side-wall Plating With A Conductive Film App 20210366729 - JIN; Longnan ; et al.	2021-11-25
Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting Grant 10,163,762 - Ding , et al. Dec	2018-12-25
Local semiconductor wafer thinning Grant 10,043,676 - Carmelo , et al. August 7, 2	2018-08-07
Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,966,429 - Chen , et al. May 8, 2	2018-05-08
Local Semiconductor Wafer Thinning App 20170110329 - Carmelo; Sanfilippo ; et al.	2017-04-20
Process for forming a planar diode using one mask Grant 9,537,017 - Wang , et al. January 3, 2	2017-01-03
Lead Frame With Conductive Clip For Mounting A Semiconductor Die With Reduced Clip Shifting App 20160365305 - Ding; Hui-Ying ; et al.	2016-12-15
Thin Bi-directional Transient Voltage Suppressor (tvs) Or Zener Diode App 20160293592 - Chen; Shih-Kuan ; et al.	2016-10-06
Gallium nitride power semiconductor device having a vertical structure Grant 9,368,584 - Chen , et al. June 14, 2	2016-06-14
Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,331,142 - Chen , et al. May 3, 2	2016-05-03
GaN-based schottky diode having large bond pads and reduced contact resistance Grant 9,281,417 - Lin March 8, 2	2016-03-08
Electrical press-fit pin for a semiconductor module Grant 9,263,820 - Mattiuzzo February 16, 2	2016-02-16
Zener diode haviing a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,202,935 - Chen , et al. December 1, 2	2015-12-01
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150340458 - Chen; Shih-Kuan ; et al.	2015-11-26
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150340431 - Chen; Shih-Kuan ; et al.	2015-11-26
Trench MOS device having a termination structure with multiple field-relaxation trenches for high voltage applications Grant 9,178,015 - Lin , et al. November 3, 2	2015-11-03
Trench Mos Device Having A Termination Structure With Multiple Field-relaxation Trenches For High Voltage Applications App 20150200250 - Lin, I; Yi-Yu ; et al.	2015-07-16
Process For Forming A Planar Diode Using One Mask App 20150179824 - Wang; Benson ; et al.	2015-06-25
Axial semiconductor package Grant 9,041,188 - Chiang , et al. May 26, 2	2015-05-26
Trench-based device with improved trench protection Grant 9,018,698 - Hsu , et al. April 28, 2	2015-04-28
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150091136 - Chen; Shih-Kuan ; et al.	2015-04-02
Low forward voltage drop transient voltage suppressor and method of fabricating Grant 8,982,524 - Kao , et al. March 17, 2	2015-03-17
GaN-based Schottky diode having dual metal, partially recessed electrode Grant 8,981,381 - Lin March 17, 2	2015-03-17
GaN-based Schottky diode having partially recessed anode Grant 8,981,528 - Lin March 17, 2	2015-03-17
Process for forming a planar diode using one mask Grant 8,975,719 - Wang , et al. March 10, 2	2015-03-10
Double trench rectifier Grant 8,963,296 - Tsai , et al. February 24, 2	2015-02-24
Gallium Nitride Power Semiconductor Device Having A Vertical Structure App 20150014696 - Chen; Max SK ; et al.	2015-01-15
Trench DMOS device with improved termination structure for high voltage applications Grant 8,928,065 - Hsu , et al. January 6, 2	2015-01-06
Schottky Rectifier App 20140357059 - Hsu; Chih-Wei ; et al.	2014-12-04
Semiconductor device and method for manufacturing a semiconductor device Grant 8,865,526 - Chou , et al. October 21, 2	2014-10-21
Trench MOS device with improved termination structure for high voltage applications Grant 8,853,770 - Hsu , et al. October 7, 2	2014-10-07
Schottky rectifier Grant 8,816,468 - Hsu , et al. August 26, 2	2014-08-26
Double Trench Rectifier App 20140217561 - Tsai; Hung-Ping ; et al.	2014-08-07
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 8,796,840 - Chiang , et al. August 5, 2	2014-08-05
Electrical Press-fit Pin For A Semiconductor Module App 20140199861 - Mattiuzzo; Emilio	2014-07-17
GaN-BASED SCHOTTKY DIODE HAVING DUAL METAL, PARTIALLY RECESSED ELECTRODE App 20140138698 - Lin; Yih-Yin	2014-05-22
Trench-based Device With Improved Trench Protection App 20140138764 - Hsu; Chih Wei ; et al.	2014-05-22
GaN-BASED SCHOTTKY DIODE HAVING PARTIALLY RECESSED ANODE App 20140138697 - Lin; Yih-Yin	2014-05-22
Axial Semiconductor Package App 20140131842 - Chiang; Wan-Lan ; et al.	2014-05-15
Double trench rectifier Grant 8,643,152 - Tsai , et al. February 4, 2	2014-02-04
Process For Forming A Planar Diode Using One Mask App 20130313684 - Wang; Benson ; et al.	2013-11-28
Process for forming a planar diode using one mask Grant 8,525,222 - Wang , et al. September 3, 2	2013-09-03
Semiconductor Device And Method For Manufacturing A Semiconductor Device App 20130224911 - Chou; Ta-Te ; et al.	2013-08-29
Trench Dmos Device With Improved Termination Structure For High Voltage Applications App 20130168765 - Lin; Yih-Yin ; et al.	2013-07-04
Trench MOS barrier schottky (TMBS) having multiple floating gates Grant 8,461,646 - Kao June 11, 2	2013-06-11
Potted integrated circuit device with aluminum case Grant 8,426,253 - Chou , et al. April 23, 2	2013-04-23
Semiconductor device and method for manufacturing a semiconductor device Grant 8,421,214 - Chou , et al. April 16, 2	2013-04-16
Potted Integrated Circuit Device With Aluminum Case App 20120252167 - Chou; Peter ; et al.	2012-10-04
Semiconductor device having improved heat dissipation capabilities Grant 8,269,338 - Chou , et al. September 18, 2	2012-09-18
Double Trench Rectifier App 20120223421 - Tsai; Hung-Ping ; et al.	2012-09-06
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 8,252,633 - Chiang , et al. August 28, 2	2012-08-28
Low Forward Voltage Drop Transient Voltage Suppressor And Method Of Fabricating App 20120200975 - Kao; Lung-Ching ; et al.	2012-08-09
Trench Mos Barrier Schottky (tmbs) Having Multiple Floating Gates App 20120199902 - Kao; Lung-Ching	2012-08-09
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20120168932 - Chiang; Wan-Lan ; et al.	2012-07-05
Potted integrated circuit device with aluminum case Grant 8,198,709 - Chou , et al. June 12, 2	2012-06-12
Schottky Rectifier App 20120098082 - HSU; Chih-Wei ; et al.	2012-04-26
Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer Grant 8,138,597 - Chiang , et al. March 20, 2	2012-03-20
Double trench rectifier Grant 8,125,056 - Tsai , et al. February 28, 2	2012-02-28
Bridge rectifier package with heat sink Grant D654,881 - Chou , et al. February 28, 2	2012-02-28
Electronic device and lead frame Grant 8,114,709 - Chou , et al. February 14, 2	2012-02-14
Low forward voltage drop transient voltage suppressor and method of fabricating Grant 8,111,495 - Kao , et al. February 7, 2	2012-02-07
Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities Grant 8,048,714 - Chou , et al. November 1, 2	2011-11-01
Power semiconductor device having a voltage sustaining layer with a terraced trench formation of floating islands Grant 8,049,271 - Blanchard , et al. November 1, 2	2011-11-01
Trench Dmos Device With Improved Termination Structure For High Voltage Applications App 20110227151 - HSU; Chih-Wei ; et al.	2011-09-22
Trench Dmos Device With Improved Termination Structure For High Voltage Applications App 20110227152 - HSU; Chih-Wei ; et al.	2011-09-22
Subassembly That Includes A Power Semiconductor Die And A Heat Sink Having An Exposed Surface Portion Thereof App 20110171784 - Chiang; Wan-Lan ; et al.	2011-07-14
Trench Termination Structure App 20110084332 - Kao; Lung-Ching	2011-04-14
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 7,915,728 - Chiang , et al. March 29, 2	2011-03-29
Double Trench Rectifier App 20110068439 - Tsai; Hung-Ping ; et al.	2011-03-24
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20110049700 - Chiang; Wan-Lan ; et al.	2011-03-03
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 7,838,985 - Chiang , et al. November 23, 2	2010-11-23
Electronic Device And Lead Frame App 20100216283 - Chou; Peter ; et al.	2010-08-26
High breakdown voltage diode and method of forming same Grant 7,755,102 - Kao , et al. July 13, 2	2010-07-13
Electronic device and lead frame Grant 7,741,703 - Chou , et al. June 22, 2	2010-06-22
Low voltage transient voltage suppressor with tapered recess extending into substrate of device allowing for reduced breakdown voltage Grant 7,737,533 - Dai , et al. June 15, 2	2010-06-15
Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands Grant 7,736,976 - Blanchard , et al. June 15, 2	2010-06-15
Bridge rectifier package Grant D616,387 - Chou , et al. May 25, 2	2010-05-25
Semiconductor device and method for manufacturing a semiconductor device Grant 7,719,096 - Chou , et al. May 18, 2	2010-05-18
Apparatus, system and method for testing electronic elements Grant 7,671,611 - Li , et al. March 2, 2	2010-03-02
Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same Grant 7,560,355 - Kao , et al. July 14, 2	2009-07-14
Semiconductor device and method for manufacturing a semiconductor device App 20090096078 - Chou; Ta-Te ; et al.	2009-04-16
Subassembly that includes a power semiconductor die and a heat sink and method of forming same App 20090014863 - Chiang; Wan-Lan ; et al.	2009-01-15
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof App 20090014862 - Chiang; Wan-Lan ; et al.	2009-01-15
Bridge rectifier package with heat sink Grant D573,116 - Chou , et al. July 15, 2	2008-07-15
Method For Fabricating A Power Semiconductor Device Having A Voltage Sustaining Layer With A Terraced Trench Facilitating Formation Of Floating Islands App 20080142880 - Blanchard; Richard A. ; et al.	2008-06-19
Semiconductor Device Having Improved Heat Dissipation Capabilities App 20080036057 - Chou; Ta-Te ; et al.	2008-02-14
Low voltage transient voltage suppressor with reduced breakdown voltage App 20080036047 - Dai; Sheng-Huei ; et al.	2008-02-14
Secmiconductor device and method for manufacturing a semiconductor device App 20080036072 - Chou; Ta-Te ; et al.	2008-02-14
Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities App 20080036073 - Chou; Ta-Te ; et al.	2008-02-14
Semiconductor junction device having reduced leakage current and method of forming same App 20080036048 - Dai; Sheng-Huei ; et al.	2008-02-14
Low forward voltage drop transient voltage suppressor and method of fabricating App 20080013240 - Kao; Lung-Ching ; et al.	2008-01-17

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