VERTICAL CIRCUITS, INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for VERTICAL CIRCUITS, INC..The latest application filed is for "support mounted electrically interconnected die assembly".
- VERTICAL CIRCUITS, INC. - Scotts Valley CA
Trademarks
| Patent | Date |
|---|---|
| Support mounted electrically interconnected die assembly App 20130099392 - McElrea; Simon J. S. ; et al. | 2013-04-25 |
| Semiconductor die having fine pitch electrical interconnects App 20120248607 - Barrie; Keith Lake ; et al. | 2012-10-04 |
| Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies App 20120119385 - Co; Reynaldo ; et al. | 2012-05-17 |
| Support mounted electrically interconnected die assembly Grant 8,178,978 - McElrea , et al. May 15, 2 | 2012-05-15 |
| Flat leadless packages and stacked leadless package assemblies Grant 8,159,053 - Andrews, Jr. , et al. April 17, 2 | 2012-04-17 |
| Stacked Die Assembly Having Reduced Stress Electrical Interconnects App 20110272825 - McGrath; Scott ; et al. | 2011-11-10 |
| Selective Die Electrical Insulation By Additive Process App 20110266684 - Leal; Jeffrey S. | 2011-11-03 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ; et al. | 2011-06-23 |
| Flip-chip underfill App 20110115099 - Karnezos; Marcos | 2011-05-19 |
| Semiconductor Die Separation Method App 20110101505 - Co; Reynaldo ; et al. | 2011-05-05 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2 | 2011-04-12 |
| Electrically Interconnected Stacked Die Assemblies App 20110037159 - McElrea; Simon J. S. ; et al. | 2011-02-17 |
| Flat Leadless Packages and Stacked Leadless Package Assemblies App 20110012246 - Andrews, JR.; Lawrence Douglas ; et al. | 2011-01-20 |
| Semiconductor die separation method Grant 7,863,159 - Co , et al. January 4, 2 | 2011-01-04 |
| Electrical interconnect for die stacked in zig-zag configuration App 20100327461 - Co; Reynaldo ; et al. | 2010-12-30 |
| Flat leadless packages and stacked leadless package assemblies Grant 7,843,046 - Andrews, Jr. , et al. November 30, 2 | 2010-11-30 |
| Semiconductor Die Interconnect Formed By Aerosol Application Of Electrically Conductive Material App 20100140811 - Leal; Jeffrey S. ; et al. | 2010-06-10 |
| Sensor App 20100117224 - McElrea; Simon J. S. ; et al. | 2010-05-13 |
| Three dimensional six surface conformal die coating Grant 7,705,432 - Vindasius , et al. April 27, 2 | 2010-04-27 |
| Image Sensor App 20100052087 - McElrea; Simon J. S. ; et al. | 2010-03-04 |
| Semiconductor Die Separation Method App 20090315174 - Co; Reynaldo ; et al. | 2009-12-24 |
| Support Mounted Electrically Interconnected Die Assembly App 20090230528 - McElrea; Simon J. S. ; et al. | 2009-09-17 |
| Flat Leadless Packages And Stacked Leadless Package Assemblies App 20090206458 - ANDREWS, JR.; LAWRENCE DOUGLAS ; et al. | 2009-08-20 |
| Die assembly having electrical interconnect Grant 7,535,109 - Robinson , et al. May 19, 2 | 2009-05-19 |
| Chip Scale Stacked Die Package App 20090102038 - MCELREA; SIMON J.S. ; et al. | 2009-04-23 |
| Semiconductor Die Mount By Conformal Die Coating App 20090065916 - Crane; Scott Jay ; et al. | 2009-03-12 |
| Electrical Interconnect Formed by Pulsed Dispense App 20090068790 - Caskey; Terrence ; et al. | 2009-03-12 |
| Three-dimensional Circuitry Formed On Integrated Circuit Device Using Two-dimensional Fabrication App 20080315407 - Andrews, JR.; Lawrence Douglas ; et al. | 2008-12-25 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ; et al. | 2008-12-25 |
| Electrically Interconnected Stacked Die Assemblies App 20080303131 - McElrea; Simon J.S. ; et al. | 2008-12-11 |
| Vertical Electrical Interconnect Formed On Support Prior To Die Mount App 20080224279 - Caskey; Terrence ; et al. | 2008-09-18 |
| Three Dimensional Six Surface Conformal Die Coating App 20070290377 - Vindasius; Al ; et al. | 2007-12-20 |
| Assembly Having Stacked Die Mounted On Substrate App 20070284716 - Vindasius; Al ; et al. | 2007-12-13 |
| Die Assembly Having Electrical Interconnect App 20070252262 - Robinson; Marc ; et al. | 2007-11-01 |
| Micropede stacked die component assembly Grant 7,245,021 - Vindasius , et al. July 17, 2 | 2007-07-17 |
| Stacked die BGA or LGA component assembly Grant 7,215,018 - Vindasius , et al. May 8, 2 | 2007-05-08 |
| NCAGE Code | 0CET3 | VERTICAL CIRCUITS INC. |
| NCAGE Code | 1CYA9 | VERTICAL CIRCUITS INC |
| CAGE Code | 0CET3 | VERTICAL CIRCUITS, INC. |
| CAGE Code | 1CYA9 | VERTICAL CIRCUITS INC |
| DUNS | 102670044 | VERTICAL CIRCUITS, INC. |
| SEC | 0001099500 | VERTICAL CIRCUITS INC |
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