Vandentop; Gilroy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vandentop; Gilroy.The latest application filed is for "integrated inductor structure and method of fabrication".

Company Profile

0.12.13

Vandentop; Gilroy - Tempe AZ US
Vandentop; Gilroy - Mesa AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated inductor structure and method of fabrication Grant 9,153,547 - Crawford , et al. October 6, 2	2015-10-06
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 7,576,432 - Kim , et al. August 18, 2	2009-08-18
Integrated Inductor Structure And Method Of Fabrication App 20090201113 - Crawford; Ankur Mohan ; et al.	2009-08-13
Methods and apparatus to optically couple an optoelectronic chip to a waveguide Grant 7,372,120 - George, legal representative , et al. May 13, 2	2008-05-13
Optical package Grant 7,283,699 - Lu , et al. October 16, 2	2007-10-16
Optical Devices And Methods To Construct The Same App 20070127865 - Lu; Daoqiang ; et al.	2007-06-07
Integrated Inductor Structure And Method Of Fabrication App 20070069333 - Crawford; Ankur Mohan ; et al.	2007-03-29
Optical devices and methods to construct the same Grant 7,195,941 - Lu , et al. March 27, 2	2007-03-27
Waveguide coupling mechanism Grant 7,085,449 - Braunisch , et al. August 1, 2	2006-08-01
Bumpless die and heat spreader lid module bonded to bumped die carrier Grant 7,038,316 - Hu , et al. May 2, 2	2006-05-02
Integrated inductor and method of fabrication App 20060088971 - Crawford; Ankur Mohan ; et al.	2006-04-27
Optical package App 20060067609 - Lu; Daoqiang ; et al.	2006-03-30
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20060055030 - Kim; Sarah E. ; et al.	2006-03-16
Waveguide coupling mechanism App 20060051021 - Braunisch; Henning ; et al.	2006-03-09
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 6,992,381 - Kim , et al. January 31, 2	2006-01-31
Bumpless die and heat spreader lid module bonded to bumped die carrier App 20050211749 - Hu, Chuan ; et al.	2005-09-29
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20050093138 - Kim, Sarah E. ; et al.	2005-05-05
High performance, low cost microelectronic circuit package with interposer Grant 6,888,240 - Towle , et al. May 3, 2	2005-05-03
Optical devices and methods to construct the same App 20040190831 - Lu, Daoqiang ; et al.	2004-09-30
Electronic package with integrated clock distribution structure Grant 6,720,814 - Braunisch , et al. April 13, 2	2004-04-13
Electronic package with integrated clock distribution structure App 20030201814 - Braunisch, Henning ; et al.	2003-10-30
Electronic Package With Integrated Clock Distribution Structure App 20030132789 - Braunisch, Henning ; et al.	2003-07-17
Electronic package with integrated clock distribution structure Grant 6,593,793 - Braunisch , et al. July 15, 2	2003-07-15
High performance, low cost microelectronic circuit package with interposer App 20020158335 - Towle, Steven ; et al.	2002-10-31

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