| Patent | Date |
|---|
Metal Pads Over Tsv
App 20220302058 - Gao; Guilian ; et al. | 2022-09-22 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20220293567 - Uzoh; Cyprian Emeka ; et al. | 2022-09-15 |
Microelectronic Assembly From Processed Substrate
App 20220285213 - Uzoh; Cyprian Emeka ; et al. | 2022-09-08 |
Contact Structures For Direct Bonding
App 20220285303 - Mirkarimi; Laura Wills ; et al. | 2022-09-08 |
Seal for microelectronic assembly
Grant 11,417,576 - Katkar , et al. August 16, 2 | 2022-08-16 |
Structures With Through-substrate Vias And Methods For Forming The Same
App 20220246497 - Fountain, JR.; Gaius Gillman ; et al. | 2022-08-04 |
Bond Enhancement Structure In Microelectronics For Trapping Contaminants During Direct-bonding Processes
App 20220246564 - Gao; Guilian ; et al. | 2022-08-04 |
Large metal pads over TSV
Grant 11,393,779 - Gao , et al. July 19, 2 | 2022-07-19 |
Directly Bonded Structures
App 20220208723 - Katkar; Rajesh ; et al. | 2022-06-30 |
Structure With Conductive Feature And Method Of Forming Same
App 20220208702 - Uzoh; Cyprian Emeka | 2022-06-30 |
Microelectronic assembly from processed substrate
Grant 11,367,652 - Uzoh , et al. June 21, 2 | 2022-06-21 |
Processing stacked substrates
Grant 11,348,801 - Uzoh , et al. May 31, 2 | 2022-05-31 |
Systems and methods for releveled bump planes for chiplets
Grant 11,348,898 - Delacruz , et al. May 31, 2 | 2022-05-31 |
Low Temperature Bonded Structures
App 20220165692 - UZOH; Cyprian Emeka ; et al. | 2022-05-26 |
Direct-bonded LED structure contacts and substrate contacts
Grant 11,329,034 - Tao , et al. May 10, 2 | 2022-05-10 |
Direct Bonding Methods And Structures
App 20220139867 - Uzoh; Cyprian Emeka | 2022-05-05 |
Direct Bonding Methods And Structures
App 20220139869 - Gao; Guilian ; et al. | 2022-05-05 |
Interconnect Structures And Methods For Forming Same
App 20220130714 - Uzoh; Cyprian Emeka ; et al. | 2022-04-28 |
Method And Structures For Low Temperature Device Bonding
App 20220130787 - UZOH; Cyprian Emeka | 2022-04-28 |
Direct bonded stack structures for increased reliability and improved yield in microelectronics
Grant 11,296,053 - Uzoh , et al. April 5, 2 | 2022-04-05 |
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
Grant 11,296,044 - Gao , et al. April 5, 2 | 2022-04-05 |
Advanced Device Assembly Structures And Methods
App 20220097166 - Uzoh; Cyprian Emeka | 2022-03-31 |
Seal for microelectronic assembly
Grant 11,257,727 - Katkar , et al. February 22, 2 | 2022-02-22 |
Method and structures for low temperature device bonding
Grant 11,244,920 - Uzoh February 8, 2 | 2022-02-08 |
Low temperature bonded structures
Grant 11,244,916 - Uzoh , et al. February 8, 2 | 2022-02-08 |
Molded Direct Bonded And Interconnected Stack
App 20220020729 - GAO; Guilian ; et al. | 2022-01-20 |
Interconnect Structures
App 20220013456 - Uzoh; Cyprian Emeka ; et al. | 2022-01-13 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20220005784 - Gao; Guilian ; et al. | 2022-01-06 |
Interconnect structures and methods for forming same
Grant 11,195,748 - Uzoh , et al. December 7, 2 | 2021-12-07 |
Techniques For Processing Devices
App 20210375850 - Uzoh; Cyprian Emeka ; et al. | 2021-12-02 |
Laterally Unconfined Structure
App 20210366820 - UZOH; Cyprian Emeka | 2021-11-25 |
Multi-metal Contact Structure
App 20210335737 - KATKAR; Rajesh ; et al. | 2021-10-28 |
Interconnect structures
Grant 11,158,573 - Uzoh , et al. October 26, 2 | 2021-10-26 |
Molded direct bonded and interconnected stack
Grant 11,158,606 - Gao , et al. October 26, 2 | 2021-10-26 |
Reliable Hybrid Bonded Apparatus
App 20210305202 - UZOH; Cyprian Emeka ; et al. | 2021-09-30 |
Dimension Compensation Control For Directly Bonded Structures
App 20210296282 - Gao; Guilian ; et al. | 2021-09-23 |
Direct-bonded Led Arrays And Applications
App 20210288037 - Tao; Min ; et al. | 2021-09-16 |
Structures For Bonding Elements
App 20210265227 - Katkar; Rajesh ; et al. | 2021-08-26 |
Diffusion Barrier Collar For Interconnects
App 20210257253 - KATKAR; Rajesh ; et al. | 2021-08-19 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210249383 - Delacruz; Javier A. ; et al. | 2021-08-12 |
Multi-metal contact structure in microelectronic component
Grant 11,088,099 - Katkar , et al. August 10, 2 | 2021-08-10 |
Die Processing
App 20210233888 - Uzoh; Cyprian Emeka | 2021-07-29 |
Structures And Methods For Low Temperature Bonding Using Nanoparticles
App 20210225801 - Uzoh; Cyprian Emeka | 2021-07-22 |
Structures and methods for reliable packages
Grant 11,056,390 - Uzoh , et al. July 6, 2 | 2021-07-06 |
Stacked Dies And Methods For Forming Bonded Structures
App 20210183847 - Uzoh; Cyprian Emeka ; et al. | 2021-06-17 |
Techniques for processing devices
Grant 11,037,919 - Uzoh , et al. June 15, 2 | 2021-06-15 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210175206 - Delacruz; Javier A. ; et al. | 2021-06-10 |
Diffusion barrier collar for interconnects
Grant 11,031,285 - Katkar , et al. June 8, 2 | 2021-06-08 |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
Grant 11,011,494 - Gao , et al. May 18, 2 | 2021-05-18 |
Bonded structures
Grant 11,004,757 - Katkar , et al. May 11, 2 | 2021-05-11 |
Die processing
Grant 10,985,133 - Uzoh April 20, 2 | 2021-04-20 |
Processed Stacked Dies
App 20210104487 - UZOH; Cyprian EMEKA ; et al. | 2021-04-08 |
Direct Gang Bonding Methods And Structures
App 20210098412 - Haba; Belgacem ; et al. | 2021-04-01 |
Interconnections for a substrate associated with a backside reveal
Grant 10,957,661 - Uzoh March 23, 2 | 2021-03-23 |
Flat Metal Features For Microelectronics Applications
App 20210082754 - Uzoh; Cyprian Emeka | 2021-03-18 |
Chemical Mechanical Polishing For Hybrid Bonding
App 20210066233 - Fountain, JR.; Gaius Gillman ; et al. | 2021-03-04 |
Systems and methods for releveled bump planes for chiplets
Grant 10,910,344 - Delacruz , et al. February 2, 2 | 2021-02-02 |
Systems and methods for efficient transfer of semiconductor elements
Grant 10,896,902 - Uzoh , et al. January 19, 2 | 2021-01-19 |
Structures and methods for low temperature bonding using nanoparticles
Grant 10,892,246 - Uzoh January 12, 2 | 2021-01-12 |
Structures and methods for low temperature bonding using nanoparticles
Grant 10,886,250 - Uzoh January 5, 2 | 2021-01-05 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20200411483 - Uzoh; Cyprian Emeka ; et al. | 2020-12-31 |
Stacked dies and methods for forming bonded structures
Grant 10,879,226 - Uzoh , et al. December 29, 2 | 2020-12-29 |
Processed stacked dies
Grant 10,879,212 - Uzoh , et al. December 29, 2 | 2020-12-29 |
Processing Stacked Substrates
App 20200388503 - UZOH; Cyprian Emeka ; et al. | 2020-12-10 |
Low Temperature Bonded Structures
App 20200381389 - UZOH; Cyprian Emeka ; et al. | 2020-12-03 |
Contact structures with porous networks for solder connections, and methods of fabricating same
Grant 10,849,240 - Wang , et al. November 24, 2 | 2020-11-24 |
Techniques For Processing Devices
App 20200365575 - UZOH; Cyprian Emeka ; et al. | 2020-11-19 |
Chemical mechanical polishing for hybrid bonding
Grant 10,840,205 - Fountain, Jr. , et al. November 17, 2 | 2020-11-17 |
Flat metal features for microelectronics applications
Grant 10,840,135 - Uzoh November 17, 2 | 2020-11-17 |
Tall and fine pitch interconnects
Grant 10,818,629 - Uzoh , et al. October 27, 2 | 2020-10-27 |
Cavities containing multi-wiring structures and devices
Grant 10,813,214 - Uzoh , et al. October 20, 2 | 2020-10-20 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 10,804,151 - Uzoh , et al. October 13, 2 | 2020-10-13 |
Die Processing
App 20200321307 - Uzoh; Cyprian Emeka | 2020-10-08 |
Die tray with channels
Grant 10,796,936 - Uzoh October 6, 2 | 2020-10-06 |
Low temperature bonded structures
Grant 10,790,262 - Uzoh , et al. September 29, 2 | 2020-09-29 |
Microelectronic Assembly From Processed Substrate
App 20200243380 - UZOH; Cyprian Emeka ; et al. | 2020-07-30 |
Techniques for processing devices
Grant 10,727,219 - Uzoh , et al. | 2020-07-28 |
Direct-bonded Led Arrays And Applications
App 20200235085 - Tao; Min ; et al. | 2020-07-23 |
Die processing
Grant 10,714,449 - Uzoh | 2020-07-14 |
Processing stacked substrates
Grant 10,707,087 - Uzoh , et al. | 2020-07-07 |
Ultra high performance interposer
Grant 10,700,002 - Uzoh , et al. | 2020-06-30 |
Method And Structures For Low Temperature Device Bonding
App 20200194396 - UZOH; Cyprian Emeka | 2020-06-18 |
Microelectronic assembly from processed substrate
Grant 10,672,654 - Uzoh , et al. | 2020-06-02 |
Structures And Methods For Low Temperature Bonding Using Nanoparticles
App 20200152598 - Uzoh; Cyprian Emeka | 2020-05-14 |
Seal For Microelectronic Assembly
App 20200140267 - Katkar; Rajesh ; et al. | 2020-05-07 |
Seal For Microelectronic Assembly
App 20200140268 - Katkar; Rajesh ; et al. | 2020-05-07 |
Interconnect Structures
App 20200126906 - UZOH; Cyprian Emeka ; et al. | 2020-04-23 |
Structures And Methods For Reliable Packages
App 20200126861 - Uzoh; Cyprian Emeka ; et al. | 2020-04-23 |
Direct-bonded LED arrays and applications
Grant 10,629,577 - Tao , et al. | 2020-04-21 |
Multiple plated via arrays of different wire heights on same substrate
Grant 10,629,567 - Uzoh , et al. | 2020-04-21 |
Multi-metal Contact Structure
App 20200105692 - KATKAR; Rajesh ; et al. | 2020-04-02 |
Systems For Pest Elimination, Suppression Or Control
App 20200093135 - NCHEKWUBE; Emeka J. ; et al. | 2020-03-26 |
Contact Structures With Porous Networks For Solder Connections, And Methods Of Fabricating Same
App 20200093008 - Wang; Liang ; et al. | 2020-03-19 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture
Grant 10,586,759 - Shen , et al. | 2020-03-10 |
Embedded graphite heat spreader for 3DIC
Grant 10,586,785 - Gao , et al. | 2020-03-10 |
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes
App 20200075520 - GAO; Guilian ; et al. | 2020-03-05 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20200075534 - GAO; Guilian ; et al. | 2020-03-05 |
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes
App 20200075533 - GAO; Guilian ; et al. | 2020-03-05 |
Low Temperature Bonded Structures
App 20200051937 - UZOH; Cyprian Emeka ; et al. | 2020-02-13 |
Systems And Methods For Efficient Transfer Of Semiconductor Elements
App 20200043910 - Uzoh; Cyprian Emeka ; et al. | 2020-02-06 |
Structures and methods for low temperature bonding using nanoparticles
Grant 10,535,626 - Uzoh Ja | 2020-01-14 |
Structures and methods for reliable packages
Grant 10,535,564 - Uzoh , et al. Ja | 2020-01-14 |
Molded Direct Bonded And Interconnected Stack
App 20200013754 - GAO; Guilian ; et al. | 2020-01-09 |
Contact structures with porous networks for solder connections, and methods of fabricating same
Grant 10,531,574 - Wang , et al. J | 2020-01-07 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,522,457 - Uzoh , et al. Dec | 2019-12-31 |
Systems and methods for releveled bump planes for chiplets
App 20190393190 - DELACRUZ; Javier A. ; et al. | 2019-12-26 |
Flat Metal Features For Microelectronics Applications
App 20190393086 - Uzoh; Cyprian Emeka | 2019-12-26 |
Die processing
Grant 10,515,925 - Uzoh Dec | 2019-12-24 |
Multi-metal contact structure
Grant 10,515,913 - Katkar , et al. Dec | 2019-12-24 |
Method and apparatus for stacking devices in an integrated circuit assembly
Grant 10,515,838 - Uzoh Dec | 2019-12-24 |
Large Metal Pads Over Tsv
App 20190385966 - GAO; Guilian ; et al. | 2019-12-19 |
Tsv As Pad
App 20190385935 - GAO; Guilian ; et al. | 2019-12-19 |
Seal for microelectronic assembly
Grant 10,508,030 - Katkar , et al. Dec | 2019-12-17 |
Die Processing
App 20190371761 - UZOH; Cyprian Emeka | 2019-12-05 |
Interconnections For A Substrate Associated With A Backside Reveal
App 20190355683 - Uzoh; Cyprian Emeka | 2019-11-21 |
Structures For Bonding Elements
App 20190348336 - Katkar; Rajesh ; et al. | 2019-11-14 |
Method and structures for heat dissipating interposers
Grant 10,475,733 - Uzoh , et al. Nov | 2019-11-12 |
Low CTE component with wire bond interconnects
Grant 10,475,726 - Katkar , et al. Nov | 2019-11-12 |
Low Temperature Bonded Structures
App 20190319007 - UZOH; Cyprian Emeka ; et al. | 2019-10-17 |
Flat metal features for microelectronics applications
Grant 10,446,441 - Uzoh Oc | 2019-10-15 |
Systems and methods for efficient transfer of semiconductor elements
Grant 10,446,532 - Uzoh , et al. Oc | 2019-10-15 |
Interposers with electrically conductive features having different porosities
Grant 10,440,822 - Lee , et al. O | 2019-10-08 |
Ultra High Performance Interposer
App 20190304904 - Uzoh; Cyprian Emeka ; et al. | 2019-10-03 |
Interconnections for a substrate associated with a backside reveal
Grant 10,418,338 - Uzoh Sept | 2019-09-17 |
High performance compliant substrate
Grant 10,410,977 - Uzoh , et al. Sept | 2019-09-10 |
Method of fabricating low CTE interposer without TSV structure
Grant 10,396,114 - Woychik , et al. A | 2019-08-27 |
Techniques For Processing Devices
App 20190252364 - UZOH; Cyprian Emeka ; et al. | 2019-08-15 |
Method and substrates for making photovoltaic cells
Grant 10,333,014 - Uzoh , et al. | 2019-06-25 |
Ultra high performance interposer
Grant 10,332,833 - Uzoh , et al. | 2019-06-25 |
Anchoring structure of fine pitch bva
Grant 10,332,854 - Katkar , et al. | 2019-06-25 |
Stacked Dies And Methods For Forming Bonded Structures
App 20190189607 - Uzoh; Cyprian Emeka ; et al. | 2019-06-20 |
Die Processing
App 20190189588 - UZOH; Cyprian Emeka | 2019-06-20 |
Hybrid 3D/2.5D interposer
Grant 10,325,880 - Woychik , et al. | 2019-06-18 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Th
App 20190157199 - UZOH; Cyprian Emeka ; et al. | 2019-05-23 |
BVA interposer
Grant 10,297,582 - Caskey , et al. | 2019-05-21 |
Multiple Plated Via Arrays Of Different Wire Heights On Same Substrate
App 20190148344 - Uzoh; Cyprian Emeka ; et al. | 2019-05-16 |
Multiple bond via arrays of different wire heights on a same substrate
Grant 10,290,613 - Uzoh , et al. | 2019-05-14 |
Method And Structures For Heat Dissipating Interposers
App 20190139878 - Uzoh; Cyprian Emeka ; et al. | 2019-05-09 |
Low cost substrates
Grant 10,283,484 - Uzoh , et al. | 2019-05-07 |
Low stress vias
Grant 10,283,449 - Mohammed , et al. | 2019-05-07 |
Die processing
Grant 10,269,756 - Uzoh | 2019-04-23 |
Diffusion Barrier Collar For Interconnects
App 20190109042 - KATKAR; Rajesh ; et al. | 2019-04-11 |
Chemical Mechanical Polishing For Hybrid Bonding
App 20190096842 - FOUNTAIN, JR.; Gaius Gillman ; et al. | 2019-03-28 |
Interconnect Structures And Methods For Forming Same
App 20190096741 - Uzoh; Cyprian Emeka ; et al. | 2019-03-28 |
Hybrid 3d/2.5d Interposer
App 20190096849 - Woychik; Charles G. ; et al. | 2019-03-28 |
Method And Apparatus For Stacking Devices In An Integrated Circuit Assembly
App 20190088527 - Uzoh; Cyprian Emeka | 2019-03-21 |
Direct-Bonded LED Arrays and Applications
App 20190088633 - Tao; Min ; et al. | 2019-03-21 |
Microelectronic assembly with redistribution structure formed on carrier
Grant 10,211,160 - Haba , et al. Feb | 2019-02-19 |
Stacked dies and methods for forming bonded structures
Grant 10,204,893 - Uzoh , et al. Feb | 2019-02-12 |
Tall And Fine Pitch Interconnects
App 20190013287 - Uzoh; Cyprian Emeka ; et al. | 2019-01-10 |
Hybrid 3D/2.5D interposer
Grant 10,177,114 - Woychik , et al. J | 2019-01-08 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,177,086 - Uzoh , et al. J | 2019-01-08 |
Method and apparatus for stacking devices in an integrated circuit assembly
Grant 10,163,675 - Uzoh Dec | 2018-12-25 |
Method and structures for via substrate repair and assembly
Grant 10,163,757 - Uzoh Dec | 2018-12-25 |
Low Cte Component With Wire Bond Interconnects
App 20180366392 - Katkar; Rajesh ; et al. | 2018-12-20 |
Porous alumina templates for electronic packages
Grant 10,159,148 - Katkar , et al. Dec | 2018-12-18 |
Flat Metal Features for Microelectronics Applications
App 20180350674 - Uzoh; Cyprian Emeka | 2018-12-06 |
Capacitors using porous alumina structures
Grant 10,147,548 - Katkar , et al. De | 2018-12-04 |
Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture
App 20180337118 - Shen; Hong ; et al. | 2018-11-22 |
Ultra High Performance Interposer
App 20180331030 - Uzoh; Cyprian Emeka ; et al. | 2018-11-15 |
Processed stacked dies
App 20180331066 - UZOH; Cyprian Emeka ; et al. | 2018-11-15 |
Die Processing
App 20180308819 - UZOH; Cyprian Emeka | 2018-10-25 |
Multiple bond via arrays of different wire heights on a same substrate
App 20180301436 - Uzoh; Cyprian Emeka ; et al. | 2018-10-18 |
Via structure for signal equalization
Grant 10,103,093 - Sun , et al. October 16, 2 | 2018-10-16 |
Tall and fine pitch interconnects
Grant 10,103,121 - Uzoh , et al. October 16, 2 | 2018-10-16 |
Method and structures for heat dissipating interposers
Grant 10,103,094 - Uzoh , et al. October 16, 2 | 2018-10-16 |
Cavities Containing Multi-wiring Structures And Devices
App 20180295718 - Uzoh; Cyprian Emeka ; et al. | 2018-10-11 |
Conductive connections, structures with such connections, and methods of manufacture
Grant 10,090,231 - Uzoh , et al. October 2, 2 | 2018-10-02 |
Seal for microelectronic assembly
App 20180273377 - KATKAR; Rajesh ; et al. | 2018-09-27 |
Multi-metal contact structure
App 20180269172 - KATKAR; Rajesh ; et al. | 2018-09-20 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20180233447 - UZOH; Cyprian Emeka ; et al. | 2018-08-16 |
Conductive connections, structures with such connections, and methods of manufacture
Grant 10,049,998 - Katkar , et al. August 14, 2 | 2018-08-14 |
Embedded Graphite Heat Spreader For 3dic
App 20180219001 - Gao; Guilian ; et al. | 2018-08-02 |
Structures And Methods For Low Temperature Bonding Using Nanoparticles
App 20180218998 - Uzoh; Cyprian Emeka | 2018-08-02 |
Reliable packaging and interconnect structures
Grant 10,037,940 - Uzoh , et al. July 31, 2 | 2018-07-31 |
Ultra high performance interposer
Grant 10,032,715 - Uzoh , et al. July 24, 2 | 2018-07-24 |
Low CTE component with wire bond interconnects
Grant 10,032,647 - Katkar , et al. July 24, 2 | 2018-07-24 |
Multiple bond via arrays of different wire heights on a same substrate
Grant 10,026,717 - Uzoh , et al. July 17, 2 | 2018-07-17 |
Cavities containing multi-wiring structures and devices
Grant 10,015,881 - Uzoh , et al. July 3, 2 | 2018-07-03 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture
Grant 10,014,243 - Shen , et al. July 3, 2 | 2018-07-03 |
Processing Stacked Substrates
App 20180182639 - UZOH; Cyprian Emeka ; et al. | 2018-06-28 |
Die tray with channels
App 20180182654 - UZOH; Cyprian Emeka | 2018-06-28 |
Microelectronic assembly from processed substrate
App 20180182666 - UZOH; Cyprian Emeka ; et al. | 2018-06-28 |
Processed Substrate
App 20180182665 - UZOH; Cyprian Emeka ; et al. | 2018-06-28 |
Microelectronic package with horizontal and vertical interconnections
Grant 10,008,534 - Uzoh , et al. June 26, 2 | 2018-06-26 |
Method And Substrates For Material Application
App 20180158972 - Uzoh; Cyprian Emeka ; et al. | 2018-06-07 |
Stacked die integrated circuit
Grant 9,991,231 - Woychik , et al. June 5, 2 | 2018-06-05 |
Method and Apparatus for Stacking Devices in an Integrated Circuit Assembly
App 20180130691 - Uzoh; Cyprian Emeka | 2018-05-10 |
Contact Structures With Porous Networks For Solder Connections, And Methods Of Fabricating Same
App 20180124927 - WANG; Liang ; et al. | 2018-05-03 |
Embedded graphite heat spreader for 3DIC
Grant 9,953,957 - Gao , et al. April 24, 2 | 2018-04-24 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,947,618 - Uzoh , et al. April 17, 2 | 2018-04-17 |
Interconnections for a Substrate Associated with a Backside Reveal
App 20180102331 - Uzoh; Cyprian Emeka | 2018-04-12 |
Tall and Fine Pitch Interconnects
App 20180096960 - Uzoh; Cyprian Emeka ; et al. | 2018-04-05 |
Compact semiconductor package and related methods
Grant 9,905,537 - Uzoh February 27, 2 | 2018-02-27 |
Method and substrates for material application
Grant 9,905,713 - Uzoh , et al. February 27, 2 | 2018-02-27 |
Reliable device assembly
Grant 9,893,030 - Uzoh , et al. February 13, 2 | 2018-02-13 |
Contact structures with porous networks for solder connections, and methods of fabricating same
Grant 9,888,584 - Wang , et al. February 6, 2 | 2018-02-06 |
Compositions for effective fly population suppression
Grant 9,877,487 - Nchekwube , et al. January 30, 2 | 2018-01-30 |
Conductive Connections, Structures With Such Connections, And Methods Of Manufacture
App 20180019191 - UZOH; Cyprian Emeka ; et al. | 2018-01-18 |
Flipped die stack assemblies with leadframe interconnects
Grant 9,871,019 - Prabhu , et al. January 16, 2 | 2018-01-16 |
Making multilayer 3D capacitors using arrays of upstanding rods or ridges
Grant 9,865,675 - Wang , et al. January 9, 2 | 2018-01-09 |
Polymer member based interconnect
Grant 9,865,548 - Uzoh , et al. January 9, 2 | 2018-01-09 |
Methods and structures to repair device warpage
Grant 9,859,234 - Uzoh , et al. January 2, 2 | 2018-01-02 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170374738 - Lee; Bong-Sub ; et al. | 2017-12-28 |
Porous Alumina Templates For Electronic Packages
App 20170372994 - Katkar; Rajesh ; et al. | 2017-12-28 |
Warpage reduction in structures with electrical circuitry
Grant 9,853,000 - Uzoh December 26, 2 | 2017-12-26 |
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
Grant 9,852,969 - Uzoh , et al. December 26, 2 | 2017-12-26 |
Interconnections for a substrate associated with a backside reveal
Grant 9,853,004 - Uzoh December 26, 2 | 2017-12-26 |
Method And Structures For Heat Dissipating Interposers
App 20170365546 - Uzoh; Cyprian Emeka ; et al. | 2017-12-21 |
Tall and fine pitch interconnects
Grant 9,842,819 - Uzoh , et al. December 12, 2 | 2017-12-12 |
Stacked Dies And Methods For Forming Bonded Structures
App 20170338214 - Uzoh; Cyprian Emeka ; et al. | 2017-11-23 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,824,974 - Gao , et al. November 21, 2 | 2017-11-21 |
Structures and methods for low temperature bonding using nanoparticles
Grant 9,818,713 - Uzoh November 14, 2 | 2017-11-14 |
Structures and Methods for Reliable Packages
App 20170309518 - Uzoh; Cyprian Emeka ; et al. | 2017-10-26 |
Conductive connections, structures with such connections, and methods of manufacture
Grant 9,793,198 - Uzoh , et al. October 17, 2 | 2017-10-17 |
Reliable packaging and interconnect structures
App 20170294376 - UZOH; Cyprian Emeka ; et al. | 2017-10-12 |
Tunable composite interposer
Grant 9,780,042 - Woychik , et al. October 3, 2 | 2017-10-03 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20170278787 - UZOH; Cyprian Emeka ; et al. | 2017-09-28 |
Interposers
Grant 9,769,923 - Lee , et al. September 19, 2 | 2017-09-19 |
Porous alumina templates for electronic packages
Grant 9,761,517 - Katkar , et al. September 12, 2 | 2017-09-12 |
Ultra High Performance Interposer
App 20170256492 - Uzoh; Cyprian Emeka ; et al. | 2017-09-07 |
Reversed build-up substrate for 2.5D
Grant 9,754,866 - Wang , et al. September 5, 2 | 2017-09-05 |
Low Stress Vias
App 20170250132 - Mohammed; Ilyas ; et al. | 2017-08-31 |
High Performance Compliant Substrate
App 20170250140 - Uzoh; Cyprian Emeka ; et al. | 2017-08-31 |
Low Cte Component With Wire Bond Interconnects
App 20170243761 - Katkar; Rajesh ; et al. | 2017-08-24 |
Thermal vias disposed in a substrate proximate to a well thereof
Grant 9,741,696 - Katkar , et al. August 22, 2 | 2017-08-22 |
Structures and methods for reliable packages
Grant 9,741,620 - Uzoh , et al. August 22, 2 | 2017-08-22 |
Multiple bond via arrays of different wire heights on a same substrate
Grant 9,728,527 - Uzoh , et al. August 8, 2 | 2017-08-08 |
Porous Alumina Templates For Electronic Packages
App 20170207159 - Katkar; Rajesh ; et al. | 2017-07-20 |
Reliable packaging and interconnect structures
Grant 9,711,401 - Uzoh , et al. July 18, 2 | 2017-07-18 |
Systems And Methods For Efficient Transfer Of Semiconductor Elements
App 20170200711 - Uzoh; Cyprian Emeka ; et al. | 2017-07-13 |
Method Of Fabricating Low Cte Interposer Without Tsv Structure
App 20170194373 - Woychik; Charles G. ; et al. | 2017-07-06 |
Structures And Methods For Low Temperature Bonding Using Nanoparticles
App 20170194279 - Uzoh; Cyprian Emeka | 2017-07-06 |
Microelectronic Package With Horizontal And Vertical Interconnections
App 20170186801 - Uzoh; Cyprian Emeka ; et al. | 2017-06-29 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,691,702 - Uzoh , et al. June 27, 2 | 2017-06-27 |
Method And Structures For Via Substrate Repair And Assembly
App 20170178958 - Uzoh; Cyprian Emeka | 2017-06-22 |
Structures for heat dissipating interposers
Grant 9,685,401 - Uzoh , et al. June 20, 2 | 2017-06-20 |
Localized sealing of interconnect structures in small gaps
Grant 9,685,420 - Katkar , et al. June 20, 2 | 2017-06-20 |
Via Structure For Signal Equalization
App 20170171003 - Sun; Zhuowen ; et al. | 2017-06-15 |
Device and method for localized underfill
Grant 9,673,124 - Wang , et al. June 6, 2 | 2017-06-06 |
Multiple bond via arrays of different wire heights on a same substrate
App 20170154875 - Uzoh; Cyprian Emeka ; et al. | 2017-06-01 |
High performance compliant substrate
Grant 9,666,514 - Uzoh , et al. May 30, 2 | 2017-05-30 |
Ultra high performance interposer
Grant 9,666,521 - Uzoh , et al. May 30, 2 | 2017-05-30 |
Hybrid 3d/2.5d Interposer
App 20170148763 - Woychik; Charles G. ; et al. | 2017-05-25 |
Low-stress vias
Grant 9,659,858 - Mohammed , et al. May 23, 2 | 2017-05-23 |
Low CTE component with wire bond interconnects
Grant 9,646,917 - Katkar , et al. May 9, 2 | 2017-05-09 |
Interconnection Substrates For Interconnection Between Circuit Modules, And Methods Of Manufacture
App 20170125331 - SHEN; Hong ; et al. | 2017-05-04 |
Anchoring Structure Of Fine Pitch Bva
App 20170117243 - Katkar; Rajesh ; et al. | 2017-04-27 |
Structures and methods for low temperature bonding using nanoparticles
Grant 9,633,971 - Uzoh April 25, 2 | 2017-04-25 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170099733 - Lee; Bong-Sub ; et al. | 2017-04-06 |
Porous alumina templates for electronic packages
Grant 9,615,451 - Katkar , et al. April 4, 2 | 2017-04-04 |
Method and structures for via substrate repair and assembly
Grant 9,607,928 - Uzoh March 28, 2 | 2017-03-28 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20170084539 - GAO; Guilian ; et al. | 2017-03-23 |
Compact Semiconductor Package And Related Methods
App 20170084582 - UZOH; Cyprian Emeka | 2017-03-23 |
Microelectronic package with horizontal and vertical interconnections
Grant 9,601,467 - Uzoh , et al. March 21, 2 | 2017-03-21 |
Thin wafer handling and known good die test method
Grant 9,601,398 - Woychik , et al. March 21, 2 | 2017-03-21 |
Microelectronic Package With Horizontal And Vertical Interconnections
App 20170069599 - Uzoh; Cyprian Emeka ; et al. | 2017-03-09 |
Microelectronic Assembly With Redistribution Structure Formed On Carrier
App 20170069575 - Haba; Belgacem ; et al. | 2017-03-09 |
Systems For Pest Elimination, Suppression Or Control
App 20170055532 - NCHEKWUBE; Emeka J. ; et al. | 2017-03-02 |
Multiple bond via arrays of different wire heights on a same substrate
Grant 9,583,456 - Uzoh , et al. February 28, 2 | 2017-02-28 |
Via structure for signal equalization
Grant 9,583,417 - Sun , et al. February 28, 2 | 2017-02-28 |
Multi-layer substrates suitable for interconnection between circuit modules
Grant 9,583,426 - Shen , et al. February 28, 2 | 2017-02-28 |
Tall And Fine Pitch Interconnects
App 20170053886 - UZOH; CYPRIAN EMEKA ; et al. | 2017-02-23 |
Structures And Methods For Low Temperature Bonding
App 20170047307 - Uzoh; Cyprian Emeka | 2017-02-16 |
Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
Grant 9,570,385 - Lee , et al. February 14, 2 | 2017-02-14 |
Interconnections For A Substrate Associated With A Backside Reveal
App 20170040268 - Uzoh; Cyprian Emeka | 2017-02-09 |
Methods And Structures To Repair Device Warpage
App 20170040270 - Uzoh; Cyprian Emeka ; et al. | 2017-02-09 |
Stacked Die Integrated Circuit
App 20170033088 - Woychik; Charles G. ; et al. | 2017-02-02 |
Method of fabricating low CTE interposer without TSV structure
Grant 9,558,964 - Woychik , et al. January 31, 2 | 2017-01-31 |
Paddle for materials processing
Grant 9,551,083 - Uzoh January 24, 2 | 2017-01-24 |
Flipped Die Stack Assemblies With Leadframe Interconnects
App 20170018485 - Prabhu; Ashok S. ; et al. | 2017-01-19 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,548,273 - Gao , et al. January 17, 2 | 2017-01-17 |
Structures And Methods For Low Temperature Bonding
App 20170012021 - Uzoh; Cyprian Emeka | 2017-01-12 |
Structures And Methods For Reliable Packages
App 20160379885 - UZOH; Cyprian Emeka ; et al. | 2016-12-29 |
Compact semiconductor package and related methods
Grant 9,524,943 - Uzoh December 20, 2 | 2016-12-20 |
Reversed Build-up Substrate For 2.5d
App 20160365302 - Wang; Liang ; et al. | 2016-12-15 |
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
App 20160343613 - Uzoh; Cyprian Emeka | 2016-11-24 |
BVA interposer
Grant 9,502,390 - Caskey , et al. November 22, 2 | 2016-11-22 |
Conductive Connections, Structures With Such Connections, And Methods Of Manufacture
App 20160336286 - KATKAR; Rajesh ; et al. | 2016-11-17 |
Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias
Grant 9,496,154 - Tosaya , et al. November 15, 2 | 2016-11-15 |
Reliable Device Assembly
App 20160329290 - Haba; Belgacem ; et al. | 2016-11-10 |
Method For Preparing Low Cost Substrates
App 20160329301 - Uzoh; Cyprian Emeka ; et al. | 2016-11-10 |
Making Multilayer 3d Capacitors Using Arrays Of Upstanding Rods Or Ridges
App 20160322456 - WANG; Liang ; et al. | 2016-11-03 |
Interconnections for a substrate associated with a backside reveal
Grant 9,484,325 - Uzoh November 1, 2 | 2016-11-01 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20160315047 - Uzoh; Cyprian Emeka ; et al. | 2016-10-27 |
Die Stacks With One Or More Bond Via Arrays Of Wire Bond Wires And With One Or More Arrays Of Bump Interconnects
App 20160307832 - Uzoh; Cyprian Emeka ; et al. | 2016-10-20 |
Reliable Packaging And Interconnect Structures
App 20160307798 - UZOH; Cyprian Emeka ; et al. | 2016-10-20 |
High Performance Compliant Substrate
App 20160307824 - Uzoh; Cyprian Emeka ; et al. | 2016-10-20 |
Warpage Reduction In Structures With Electrical Circuitry
App 20160293556 - UZOH; Cyprian Emeka | 2016-10-06 |
Thermal Vias Disposed In A Substrate Proximate To A Well Thereof
App 20160284672 - Katkar; Rajesh ; et al. | 2016-09-29 |
Low cost interposer and method of fabrication
Grant 9,455,162 - Uzoh September 27, 2 | 2016-09-27 |
Bowl-shaped solder structure
Grant 9,455,237 - Uzoh , et al. September 27, 2 | 2016-09-27 |
Vias in porous substrates
Grant 9,455,181 - Mohammed , et al. September 27, 2 | 2016-09-27 |
Tunable Composite Interposer
App 20160276296 - Woychik; Charles G. ; et al. | 2016-09-22 |
Polymer Member Based Interconnect
App 20160268205 - Uzoh; Cyprian Emeka ; et al. | 2016-09-15 |
Z-connection for a microelectronic package using electroless plating
Grant 9,443,837 - Haba , et al. September 13, 2 | 2016-09-13 |
Embedded Graphite Heat Spreader For 3dic
App 20160260687 - Gao; Guilian ; et al. | 2016-09-08 |
Reversed build-up substrate for 2.5D
Grant 9,437,536 - Wang , et al. September 6, 2 | 2016-09-06 |
Conductive connections, structures with such connections, and methods of manufacture
Grant 9,437,566 - Katkar , et al. September 6, 2 | 2016-09-06 |
High density three-dimensional integrated capacitors
Grant 9,437,557 - Mohammed , et al. September 6, 2 | 2016-09-06 |
Device And Method For Localized Underfill
App 20160254205 - WANG; Liang ; et al. | 2016-09-01 |
High strength through-substrate vias
Grant 9,433,093 - Uzoh August 30, 2 | 2016-08-30 |
Localized sealing of interconnect structures in small gaps
App 20160247778 - Katkar; Rajesh ; et al. | 2016-08-25 |
Stacked die integrated circuit
Grant 9,418,924 - Woychik , et al. August 16, 2 | 2016-08-16 |
Via in substrate with deposited layer
Grant 9,412,646 - Uzoh August 9, 2 | 2016-08-09 |
Making multilayer 3D capacitors using arrays of upstanding rods or ridges
Grant 9,412,806 - Wang , et al. August 9, 2 | 2016-08-09 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20160218057 - Lee; Bong-Sub ; et al. | 2016-07-28 |
Method of forming a reliable microelectronic assembly
Grant 9,398,700 - Uzoh , et al. July 19, 2 | 2016-07-19 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,397,038 - Uzoh , et al. July 19, 2 | 2016-07-19 |
Warpage reduction in structures with electrical circuitry
Grant 9,397,051 - Uzoh July 19, 2 | 2016-07-19 |
Reliable packaging and interconnect structures
Grant 9,385,036 - Uzoh , et al. July 5, 2 | 2016-07-05 |
Contact Structures With Porous Networks For Solder Connections, And Methods Of Fabricating Same
App 20160192496 - WANG; Liang ; et al. | 2016-06-30 |
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
Grant 9,379,074 - Uzoh , et al. June 28, 2 | 2016-06-28 |
Metal PVD-free conducting structures
Grant 9,379,008 - Uzoh , et al. June 28, 2 | 2016-06-28 |
Polymer member based interconnect
Grant 9,373,585 - Uzoh , et al. June 21, 2 | 2016-06-21 |
Compact Semiconductor Package And Related Methods
App 20160172319 - UZOH; Cyprian Emeka | 2016-06-16 |
Thermal vias disposed in a substrate proximate to a well thereof
Grant 9,368,479 - Katkar , et al. June 14, 2 | 2016-06-14 |
Method for preparing low cost substrates
Grant 9,365,947 - Uzoh , et al. June 14, 2 | 2016-06-14 |
Compositions For Effective Fly Population Suppression
App 20160157496 - NCHEKWUBE; Emeka J. ; et al. | 2016-06-09 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20160163650 - GAO; Guilian ; et al. | 2016-06-09 |
Tunable composite interposer
Grant 9,362,204 - Woychik , et al. June 7, 2 | 2016-06-07 |
Methods and structure for carrier-less thin wafer handling
Grant 9,355,905 - Uzoh , et al. May 31, 2 | 2016-05-31 |
Device and method for localized underfill
Grant 9,349,614 - Wang , et al. May 24, 2 | 2016-05-24 |
Reduced stress TSV and interposer structures
Grant 9,349,669 - Uzoh , et al. May 24, 2 | 2016-05-24 |
Substrates And Methods Of Manufacture
App 20160126174 - Shen; Hong ; et al. | 2016-05-05 |
Localized sealing of interconnect structures in small gaps
Grant 9,331,043 - Katkar , et al. May 3, 2 | 2016-05-03 |
Structures formed using monocrystalline silicon and/or other materials for optical and other applications
Grant 9,323,010 - Kosenko , et al. April 26, 2 | 2016-04-26 |
High Density Three-dimensional Integrated Capacitors
App 20160079189 - Mohammed; Ilyas ; et al. | 2016-03-17 |
Use Of Underfill Tape In Microelectronic Components, And Microelectronic Components With Cavities Coupled To Through-substrate Vias
App 20160079093 - TOSAYA; Eric S. ; et al. | 2016-03-17 |
Polymer Member Based Interconnect
App 20160079169 - Uzoh; Cyprian Emeka ; et al. | 2016-03-17 |
Paddle for Materials Processing
App 20160068988 - Uzoh; Cyprian Emeka | 2016-03-10 |
Device And Method For An Integrated Ultra-high-density Device
App 20160049383 - Woychik; Charles G. ; et al. | 2016-02-18 |
Multiple bond via arrays of different wire heights on a same substrate
App 20160049390 - Uzoh; Cyprian Emeka ; et al. | 2016-02-18 |
Multiple bond via arrays of different wire heights on a same substrate
Grant 9,263,394 - Uzoh , et al. February 16, 2 | 2016-02-16 |
Device And Method For Localized Underfill
App 20160042978 - WANG; Liang ; et al. | 2016-02-11 |
Porous Alumina Templates For Electronic Packages
App 20160044781 - Katkar; Rajesh ; et al. | 2016-02-11 |
Compact semiconductor package and related methods
Grant 9,257,396 - Uzoh February 9, 2 | 2016-02-09 |
Method And Substrates For Making Photovoltaic Cells
App 20160027939 - Uzoh; Cyprian Emeka ; et al. | 2016-01-28 |
Carrier-less silicon interposer
Grant 9,237,648 - Newman , et al. January 12, 2 | 2016-01-12 |
Multiple bond via arrays of different wire heights on a same substrate
App 20150380377 - UZOH; CYPRIAN EMEKA ; et al. | 2015-12-31 |
Porous alumina templates for electronic packages
Grant 9,226,396 - Katkar , et al. December 29, 2 | 2015-12-29 |
Making Multilayer 3d Capacitors Using Arrays Of Upstanding Rods Or Ridges
App 20150364538 - WANG; Liang ; et al. | 2015-12-17 |
Low-stress vias
Grant 9,214,425 - Mohammed , et al. December 15, 2 | 2015-12-15 |
Low Cte Component With Wire Bond Interconnects
App 20150348873 - Katkar; Rajesh ; et al. | 2015-12-03 |
Compact Semiconductor Package And Related Methods
App 20150340327 - UZOH; Cyprian Emeka | 2015-11-26 |
Method And Structures For Heat Dissipating Interposers
App 20150340310 - Uzoh; Cyprian Emeka ; et al. | 2015-11-26 |
High density three-dimensional integrated capacitors
Grant 9,190,463 - Mohammed , et al. November 17, 2 | 2015-11-17 |
Conductive Connections, Structures With Such Connections, And Methods Of Manufacture
App 20150325507 - UZOH; Cyprian Emeka ; et al. | 2015-11-12 |
Low-stress Vias
App 20150325498 - Mohammed; Ilyas ; et al. | 2015-11-12 |
Conductive Connections, Structures With Such Connections, And Methods Of Manufacture
App 20150325543 - KATKAR; Rajesh ; et al. | 2015-11-12 |
Method and substrates for making photovoltaic cells
Grant 9,184,323 - Uzoh , et al. November 10, 2 | 2015-11-10 |
Bowl-shaped solder structure
App 20150303157 - Uzoh; Cyprian Emeka ; et al. | 2015-10-22 |
Method And Structures For Via Substrate Repair And Assembly
App 20150270193 - Uzoh; Cyprian Emeka | 2015-09-24 |
Stacked Die Integrated Circuit
App 20150270209 - WOYCHIK; Charles G. ; et al. | 2015-09-24 |
Capacitors Using Porous Alumina Structures
App 20150270069 - Katkar; Rajesh ; et al. | 2015-09-24 |
Via Structure For Signal Equalization
App 20150262910 - SUN; Zhuowen ; et al. | 2015-09-17 |
Methods And Structure For Carrier-less Thin Wafer Handling
App 20150255345 - Uzoh; Cyprian Emeka ; et al. | 2015-09-10 |
Thermal Vias Disposed in a Substrate Proximate to a Well Thereof
App 20150255429 - KATKAR; Rajesh ; et al. | 2015-09-10 |
Method and structures for heat dissipating interposers
Grant 9,123,780 - Uzoh , et al. September 1, 2 | 2015-09-01 |
Z-connection Using Electroless Plating
App 20150243644 - Haba; Belgacem ; et al. | 2015-08-27 |
Advanced Device Assembly Structures And Methods
App 20150231732 - Uzoh; Cyprian Emeka | 2015-08-20 |
Capacitors using porous alumina structures
Grant 9,076,594 - Katkar , et al. July 7, 2 | 2015-07-07 |
Method and structures for via substrate repair and assembly
Grant 9,076,785 - Uzoh July 7, 2 | 2015-07-07 |
Reduced Stress Tsv And Interposer Structures
App 20150187673 - Uzoh; Cyprian Emeka ; et al. | 2015-07-02 |
Bowl-shaped solder structure
Grant 9,070,676 - Uzoh , et al. June 30, 2 | 2015-06-30 |
Methods and structure for carrier-less thin wafer handling
Grant 9,064,933 - Uzoh , et al. June 23, 2 | 2015-06-23 |
Tunable Composite Interposer
App 20150162216 - Woychik; Charles G. ; et al. | 2015-06-11 |
Metal Pvd-free Conducting Structures
App 20150162241 - Uzoh; Cyprian Emeka ; et al. | 2015-06-11 |
Warpage Reduction In Structures With Electircal Circuitry
App 20150155241 - UZOH; Cyprian Emeka | 2015-06-04 |
Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate
App 20150145141 - Uzoh; Cyprian Emeka ; et al. | 2015-05-28 |
Die Stacks With One Or More Bond Via Arrays
App 20150145116 - Uzoh; Cyprian Emeka ; et al. | 2015-05-28 |
High Strength Through-substrate Vias
App 20150146393 - UZOH; CYPRIAN EMEKA ; et al. | 2015-05-28 |
Via In Substrate With Deposited Layer
App 20150140815 - Uzoh; Cyprian Emeka | 2015-05-21 |
Vias In Porous Substrates
App 20150140807 - Mohammed; Ilyas ; et al. | 2015-05-21 |
Z-connection using electroless plating
Grant 9,030,017 - Haba , et al. May 12, 2 | 2015-05-12 |
Advanced device assembly structures and methods
Grant 9,024,205 - Uzoh May 5, 2 | 2015-05-05 |
Cavities Containing Multi-wiring Structures And Devices
App 20150101858 - Uzoh; Cyprian Emeka ; et al. | 2015-04-16 |
Interconnections for a substrate associated with a backside reveal
App 20150096798 - Uzoh; Cyprian Emeka | 2015-04-09 |
Bowl-shaped solder structure
App 20150097284 - Uzoh; Cyprian Emeka ; et al. | 2015-04-09 |
Reduced stress TSV and interposer structures
Grant 9,000,600 - Uzoh , et al. April 7, 2 | 2015-04-07 |
Metal PVD-free conducting structures
Grant 8,981,564 - Woychik , et al. March 17, 2 | 2015-03-17 |
TSV fabrication using a removable handling structure
Grant 8,978,247 - Yang , et al. March 17, 2 | 2015-03-17 |
Tunable composite interposer
Grant 8,963,335 - Woychik , et al. February 24, 2 | 2015-02-24 |
Via in substrate with deposited layer
Grant 8,946,899 - Uzoh February 3, 2 | 2015-02-03 |
Cavities containing multi-wiring structures and devices
Grant 8,916,781 - Haba , et al. December 23, 2 | 2014-12-23 |
Low CTE interposer without TSV structure
Grant 8,884,427 - Woychik , et al. November 11, 2 | 2014-11-11 |
Thin wafer handling and known good die test method
Grant 8,846,447 - Woychik , et al. September 30, 2 | 2014-09-30 |
Reliable packaging and interconnect structures
Grant 8,829,680 - Uzoh , et al. September 9, 2 | 2014-09-09 |
High strength through-substrate vias
Grant 8,785,790 - Uzoh , et al. July 22, 2 | 2014-07-22 |
| 