Uzoh; Cyprian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Uzoh; Cyprian.The latest application filed is for "systems and methods for producing flat surfaces in interconnect structures".

Company Profile

5.54.57

Uzoh; Cyprian - San Jose CA
Uzoh; Cyprian - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Systems and methods for producing flat surfaces in interconnect structures Grant 10,199,275 - Uzoh , et al. Fe	2019-02-05
Method for fabricating a carrier-less silicon interposer Grant 10,181,411 - Newman , et al. Ja	2019-01-15
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20180102286 - UZOH; Cyprian ; et al.	2018-04-12
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20180019167 - UZOH; Cyprian ; et al.	2018-01-18
Systems, Methods And Compositions For Effective Insect Population Suppression App 20180000093 - NCHEKWUBE; Emeka J. ; et al.	2018-01-04
Systems and methods for producing flat surfaces in interconnect structures Grant 9,812,360 - Uzoh , et al. November 7, 2	2017-11-07
Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers Grant 9,799,626 - Uzoh , et al. October 24, 2	2017-10-24
Connector structures and methods Grant 9,634,412 - Uzoh , et al. April 25, 2	2017-04-25
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20170110370 - UZOH; Cyprian ; et al.	2017-04-20
Electrical Barrier Layers App 20170098621 - UZOH; Cyprian ; et al.	2017-04-06
Electrical barrier layers Grant 9,560,773 - Uzoh , et al. January 31, 2	2017-01-31
Systems and methods for producing flat surfaces in interconnect structures Grant 9,558,998 - Uzoh , et al. January 31, 2	2017-01-31
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20160190000 - UZOH; Cyprian ; et al.	2016-06-30
Systems and methods for producing flat surfaces in interconnect structures Grant 9,318,385 - Uzoh , et al. April 19, 2	2016-04-19
Carrier-less Silicon Interposer App 20160079090 - Newman; Michael ; et al.	2016-03-17
Electronic Structures Strengthened By Porous And Non-porous Layers, And Methods Of Fabrication App 20160079138 - UZOH; Cyprian ; et al.	2016-03-17
Bva Interposer App 20160079214 - Caskey; Terrence ; et al.	2016-03-17
Single exposure in multi-damascene process Grant 9,287,164 - Uzoh , et al. March 15, 2	2016-03-15
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20160027693 - UZOH; Cyprian ; et al.	2016-01-28
Reliable wire method Grant 9,245,670 - Uzoh , et al. January 26, 2	2016-01-26
Electrical Barrier Layers App 20150334829 - UZOH; Cyprian ; et al.	2015-11-19
Single Exposure In Multi-damascene Process App 20150279730 - UZOH; Cyprian ; et al.	2015-10-01
Single exposure in multi-damascene process Grant 9,142,508 - Uzoh , et al. September 22, 2	2015-09-22
Electrical barrier layers Grant 9,125,333 - Uzoh , et al. September 1, 2	2015-09-01
Systems and methods for producing flat surfaces in interconnect structures Grant 9,123,703 - Uzoh , et al. September 1, 2	2015-09-01
Vias in porous substrates Grant 8,975,751 - Mohammed , et al. March 10, 2	2015-03-10
Low stress vias Grant 8,816,505 - Mohammed , et al. August 26, 2	2014-08-26
Systems And Methods For Producing Flat Surfaces In Interconnect Structures App 20140210102 - Uzoh; Cyprian ; et al.	2014-07-31
Reliable Wire Structure And Method App 20140157592 - Uzoh; Cyprian ; et al.	2014-06-12
High density three-dimensional integrated capacitors Grant 8,742,541 - Mohammed , et al. June 3, 2	2014-06-03
Systems and methods for producing flat surfaces in interconnect structures Grant 8,728,934 - Uzoh , et al. May 20, 2	2014-05-20
Reliable wire structure and method Grant 8,692,118 - Uzoh , et al. April 8, 2	2014-04-08
Reliable packaging and interconnect structures Grant 8,609,540 - Uzoh , et al. December 17, 2	2013-12-17
High Strength Through-substrate Vias App 20130118784 - Uzoh; Cyprian ; et al.	2013-05-16
Cavities Containing Multi-wiring Structures And Devices App 20130122747 - Uzoh; Cyprian ; et al.	2013-05-16
Low Stress Vias App 20130026645 - Mohammed; Ilyas ; et al.	2013-01-31
Connector Structures and Methods App 20130014979 - Uzoh; Cyprian ; et al.	2013-01-17
Electrical Barrier Layers App 20130014978 - Uzoh; Cyprian ; et al.	2013-01-17
Single Exposure In Multi-damascene Process App 20120326313 - Uzoh; Cyprian ; et al.	2012-12-27
Systems and Methods for Producing Flat Surfaces in Interconnect Structures App 20120326326 - Uzoh; Cyprian ; et al.	2012-12-27
Reliable Wire Structure And Method App 20120325517 - Uzoh; Cyprian ; et al.	2012-12-27
Reliable Packaging and Interconnect Structures App 20120319282 - Uzoh; Cyprian ; et al.	2012-12-20
Vias In Porous Substrates App 20120267789 - Mohammed; Ilyas ; et al.	2012-10-25
High Density Three-dimensional Integrated Capacitors App 20120181658 - Mohammed; Ilyas ; et al.	2012-07-19
Method of making rolling electrical contact to wafer front surface Grant 7,491,308 - Talieh , et al. February 17, 2	2009-02-17
Apparatus for processing surface of workpiece with small electrodes and surface contacts Grant 7,476,304 - Ashjaee , et al. January 13, 2	2009-01-13
Pad designs and structures for a versatile materials processing apparatus Grant 7,378,004 - Uzoh , et al. May 27, 2	2008-05-27
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,329,335 - Talieh , et al. February 12, 2	2008-02-12
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,311,811 - Talieh , et al. December 25, 2	2007-12-25
Providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,309,413 - Talieh , et al. December 18, 2	2007-12-18
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,282,124 - Talieh , et al. October 16, 2	2007-10-16
Mask plate design Grant 7,201,829 - Basol , et al. April 10, 2	2007-04-10
Method and apparatus for processing a substrate with minimal edge exclusion App 20060006060 - Basol; Bulent M. ; et al.	2006-01-12
Defect-free thin and planar film processing App 20060009033 - Basol; Bulent M. ; et al.	2006-01-12
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization Grant 6,974,769 - Basol , et al. December 13, 2	2005-12-13
Method of making rolling electrical contact to wafer front surface App 20050269212 - Talieh, Homayoun ; et al.	2005-12-08
Method of using vertically configured chamber used for multiple processes Grant 6,969,456 - Volodarsky , et al. November 29, 2	2005-11-29
Method and apparatus for processing a substrate with minimal edge exclusion Grant 6,942,780 - Basol , et al. September 13, 2	2005-09-13
Defect-free thin and planar film processing Grant 6,943,112 - Basol , et al. September 13, 2	2005-09-13
Method and apparatus for avoiding particle accumulation in electrodeposition Grant 6,932,896 - Basol , et al. August 23, 2	2005-08-23
Apparatus for avoiding particle accumulation in electrochemical processing App 20050145484 - Basol, Bulent M. ; et al.	2005-07-07
Electroetching process and system App 20050145489 - Basol, Bulent M. ; et al.	2005-07-07
Vertically configured chamber used for multiple processes Grant 6,884,334 - Volodarsky , et al. April 26, 2	2005-04-26
Anode assembly for plating and planarizing a conductive layer App 20050040049 - Volodarsky, Rimma ; et al.	2005-02-24
Method and apparatus for full surface electrotreating of a wafer App 20050034994 - Ashjaee, Jalal ; et al.	2005-02-17
Method and apparatus for full surface electrotreating of a wafer Grant 6,852,208 - Ashjaee , et al. February 8, 2	2005-02-08
Electroetching process and system Grant 6,852,630 - Basol , et al. February 8, 2	2005-02-08
Method and structure for thru-mask contact electrodeposition Grant 6,815,354 - Uzoh , et al. November 9, 2	2004-11-09
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20040195111 - Talieh, Homayoun ; et al.	2004-10-07
Anode assembly for plating and planarizing a conductive layer Grant 6,773,576 - Volodarsky , et al. August 10, 2	2004-08-10
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization App 20040052930 - Basol, Bulent ; et al.	2004-03-18
Methods for repairing defects on a semiconductor substrate App 20040035709 - Uzoh, Cyprian	2004-02-26
Defect-free thin and planar film processing App 20040012090 - Basol, Bulent M. ; et al.	2004-01-22
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030217932 - Talieh, Homayoun ; et al.	2003-11-27
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030209445 - Talieh, Homayoun ; et al.	2003-11-13
Method and apparatus for processing a substrate with minimal edge exclusion App 20030209429 - Basol, Bulent M. ; et al.	2003-11-13
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030209425 - Talieh, Homayoun ; et al.	2003-11-13
Work piece carrier head for plating and polishing Grant 6,612,915 - Uzoh , et al. September 2, 2	2003-09-02
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate Grant 6,610,190 - Basol , et al. August 26, 2	2003-08-26
Method and structure for thru-mask contact electrodeposition App 20030080431 - Uzoh, Cyprian ; et al.	2003-05-01
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact App 20030070930 - Talieh, Homayoun ; et al.	2003-04-17
Method and apparatus for full surface electrotreating of a wafer App 20030029731 - Ashjaee, Jalal ; et al.	2003-02-13
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating Grant 6,497,800 - Talieh , et al. December 24, 2	2002-12-24
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Grant 6,482,307 - Ashjaee , et al. November 19, 2	2002-11-19
Anode assembly for plating and planarizing a conductive layer Grant 6,478,936 - Volodarsky , et al. November 12, 2	2002-11-12
Electroetching process and system App 20020153097 - Basol, Bulent M. ; et al.	2002-10-24
Method and apparatus for avoiding particle accumulation in electrodeposition App 20020139682 - Basol, Bulent M. ; et al.	2002-10-03
Pad designs and structures for a versatile materials processing apparatus App 20020130034 - Uzoh, Cyprian ; et al.	2002-09-19
Mask plate design App 20020121445 - Basol, Bulent M. ; et al.	2002-09-05
Vertically configured chamber used for multiple processes App 20020121435 - Volodarsky, Konstantin ; et al.	2002-09-05
Method and apparatus employing pad designs and structures with improved fluid distribution Grant 6,413,403 - Lindquist , et al. July 2, 2	2002-07-02
Modified plating solution for plating and planarization and process utilizing same App 20020061715 - Uzoh, Cyprian ; et al.	2002-05-23
Vertically configured chamber used for multiple processes App 20020056646 - Volodarsky, Konstantin ; et al.	2002-05-16
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate App 20020053516 - Basol, Bulent M. ; et al.	2002-05-09
Modified plating solution for plating and planarization and process utilizing same Grant 6,354,916 - Uzoh , et al. March 12, 2	2002-03-12
Vertically configured chamber used for multiple processes Grant 6,352,623 - Volodarsky , et al. March 5, 2	2002-03-05
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing App 20010035354 - Ashjaee, Jalal ; et al.	2001-11-01

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