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Systems and methods for producing flat surfaces in interconnect structures Grant 10,199,275 - Uzoh , et al. Fe | 2019-02-05 |
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Systems, Methods And Compositions For Effective Insect Population Suppression App 20180000093 - NCHEKWUBE; Emeka J. ;   et al. | 2018-01-04 |
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Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers Grant 9,799,626 - Uzoh , et al. October 24, 2 | 2017-10-24 |
Connector structures and methods Grant 9,634,412 - Uzoh , et al. April 25, 2 | 2017-04-25 |
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Electrical Barrier Layers App 20170098621 - UZOH; Cyprian ;   et al. | 2017-04-06 |
Electrical barrier layers Grant 9,560,773 - Uzoh , et al. January 31, 2 | 2017-01-31 |
Systems and methods for producing flat surfaces in interconnect structures Grant 9,558,998 - Uzoh , et al. January 31, 2 | 2017-01-31 |
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Carrier-less Silicon Interposer App 20160079090 - Newman; Michael ;   et al. | 2016-03-17 |
Electronic Structures Strengthened By Porous And Non-porous Layers, And Methods Of Fabrication App 20160079138 - UZOH; Cyprian ;   et al. | 2016-03-17 |
Bva Interposer App 20160079214 - Caskey; Terrence ;   et al. | 2016-03-17 |
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Reliable wire method Grant 9,245,670 - Uzoh , et al. January 26, 2 | 2016-01-26 |
Electrical Barrier Layers App 20150334829 - UZOH; Cyprian ;   et al. | 2015-11-19 |
Single Exposure In Multi-damascene Process App 20150279730 - UZOH; Cyprian ;   et al. | 2015-10-01 |
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Electrical barrier layers Grant 9,125,333 - Uzoh , et al. September 1, 2 | 2015-09-01 |
Systems and methods for producing flat surfaces in interconnect structures Grant 9,123,703 - Uzoh , et al. September 1, 2 | 2015-09-01 |
Vias in porous substrates Grant 8,975,751 - Mohammed , et al. March 10, 2 | 2015-03-10 |
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Reliable Wire Structure And Method App 20140157592 - Uzoh; Cyprian ;   et al. | 2014-06-12 |
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Reliable wire structure and method Grant 8,692,118 - Uzoh , et al. April 8, 2 | 2014-04-08 |
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Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,329,335 - Talieh , et al. February 12, 2 | 2008-02-12 |
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,311,811 - Talieh , et al. December 25, 2 | 2007-12-25 |
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Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,282,124 - Talieh , et al. October 16, 2 | 2007-10-16 |
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Method and apparatus for processing a substrate with minimal edge exclusion Grant 6,942,780 - Basol , et al. September 13, 2 | 2005-09-13 |
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Method and apparatus for avoiding particle accumulation in electrodeposition Grant 6,932,896 - Basol , et al. August 23, 2 | 2005-08-23 |
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Electroetching process and system Grant 6,852,630 - Basol , et al. February 8, 2 | 2005-02-08 |
Method and structure for thru-mask contact electrodeposition Grant 6,815,354 - Uzoh , et al. November 9, 2 | 2004-11-09 |
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Methods for repairing defects on a semiconductor substrate App 20040035709 - Uzoh, Cyprian | 2004-02-26 |
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Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030217932 - Talieh, Homayoun ;   et al. | 2003-11-27 |
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Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030209425 - Talieh, Homayoun ;   et al. | 2003-11-13 |
Work piece carrier head for plating and polishing Grant 6,612,915 - Uzoh , et al. September 2, 2 | 2003-09-02 |
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate Grant 6,610,190 - Basol , et al. August 26, 2 | 2003-08-26 |
Method and structure for thru-mask contact electrodeposition App 20030080431 - Uzoh, Cyprian ;   et al. | 2003-05-01 |
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact App 20030070930 - Talieh, Homayoun ;   et al. | 2003-04-17 |
Method and apparatus for full surface electrotreating of a wafer App 20030029731 - Ashjaee, Jalal ;   et al. | 2003-02-13 |
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating Grant 6,497,800 - Talieh , et al. December 24, 2 | 2002-12-24 |
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Grant 6,482,307 - Ashjaee , et al. November 19, 2 | 2002-11-19 |
Anode assembly for plating and planarizing a conductive layer Grant 6,478,936 - Volodarsky , et al. November 12, 2 | 2002-11-12 |
Electroetching process and system App 20020153097 - Basol, Bulent M. ;   et al. | 2002-10-24 |
Method and apparatus for avoiding particle accumulation in electrodeposition App 20020139682 - Basol, Bulent M. ;   et al. | 2002-10-03 |
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Method and apparatus employing pad designs and structures with improved fluid distribution Grant 6,413,403 - Lindquist , et al. July 2, 2 | 2002-07-02 |
Modified plating solution for plating and planarization and process utilizing same App 20020061715 - Uzoh, Cyprian ;   et al. | 2002-05-23 |
Vertically configured chamber used for multiple processes App 20020056646 - Volodarsky, Konstantin ;   et al. | 2002-05-16 |
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate App 20020053516 - Basol, Bulent M. ;   et al. | 2002-05-09 |
Modified plating solution for plating and planarization and process utilizing same Grant 6,354,916 - Uzoh , et al. March 12, 2 | 2002-03-12 |
Vertically configured chamber used for multiple processes Grant 6,352,623 - Volodarsky , et al. March 5, 2 | 2002-03-05 |
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing App 20010035354 - Ashjaee, Jalal ;   et al. | 2001-11-01 |