loadpatents
name:-0.018306016921997
name:-0.012069940567017
name:-0.0015268325805664
URAKAWA; Masafumi Patent Filings

URAKAWA; Masafumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for URAKAWA; Masafumi.The latest application filed is for "recipe updating method".

Company Profile
1.12.15
  • URAKAWA; Masafumi - Miyagi JP
  • Urakawa; Masafumi - Kurokawa-gun JP
  • Urakawa; Masafumi - Salem MA
  • Urakawa; Masafumi - Nirasaki JP
  • Urakawa; Masafumi - Nirasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Recipe Updating Method
App 20220137603 - URAKAWA; Masafumi
2022-05-05
Member and plasma processing apparatus
Grant 11,037,763 - Sugawara , et al. June 15, 2
2021-06-15
Plasma processing method and plasma processing apparatus
Grant 10,707,053 - Urakawa , et al.
2020-07-07
Member And Plasma Processing Apparatus
App 20180350567 - SUGAWARA; Yuki ;   et al.
2018-12-06
Plasma Processing Method And Plasma Processing Apparatus
App 20180096822 - Urakawa; Masafumi ;   et al.
2018-04-05
Plasma processing method and plasma processing apparatus
Grant 9,870,898 - Urakawa , et al. January 16, 2
2018-01-16
Etching method and etching apparatus
Grant 9,865,471 - Shimoda , et al. January 9, 2
2018-01-09
Plasma processing method and plasma processing apparatus
Grant 9,653,316 - Urakawa May 16, 2
2017-05-16
Method of processing substrate and substrate processing apparatus
Grant 9,530,657 - Urakawa , et al. December 27, 2
2016-12-27
Etching Method And Etching Apparatus
App 20160322230 - SHIMODA; Gaku ;   et al.
2016-11-03
Plasma Processing Method And Plasma Processing Apparatus
App 20160247666 - URAKAWA; Masafumi ;   et al.
2016-08-25
Method of etching silicon oxide film
Grant 9,257,301 - Ogasawara , et al. February 9, 2
2016-02-09
Etching method and plasma processing apparatus
Grant 9,224,616 - Urakawa December 29, 2
2015-12-29
Etching Method And Plasma Processing Apparatus
App 20150140828 - Urakawa; Masafumi
2015-05-21
Method Of Processing Substrate And Substrate Processing Apparatus
App 20150132967 - URAKAWA; Masafumi ;   et al.
2015-05-14
Method Of Etching Silicon Oxide Film
App 20150056808 - OGASAWARA; Masahiro ;   et al.
2015-02-26
Plasma Processing Method And Plasma Processing Apparatus
App 20140235062 - URAKAWA; Masafumi
2014-08-21
Method and system for dry etching a hafnium containing material
Grant 8,183,161 - Fernandez , et al. May 22, 2
2012-05-22
Processing device, electrode, electrode plate, and processing method
Grant 8,038,835 - Hayashi , et al. October 18, 2
2011-10-18
Method and system for reducing line edge roughness during pattern etching
Grant 7,846,645 - Urakawa December 7, 2
2010-12-07
Processing Device, Electrode, Electrode Plate, And Processing Method
App 20100230386 - HAYASHI; Kazuichi ;   et al.
2010-09-16
Reduced contaminant gas injection system and method of using
Grant 7,743,731 - Enomoto , et al. June 29, 2
2010-06-29
Silicon carbide focus ring for plasma etching system
App 20090151870 - URAKAWA; Masafumi ;   et al.
2009-06-18
Method and system for reducing line edge roughness during pattern etching
App 20090155731 - URAKAWA; Masafumi
2009-06-18
Method and system for dry etching a hafnium containing material
App 20080064220 - Fernandez; Luis Isidro ;   et al.
2008-03-13
Reduced contaminant gas injection system and method of using
App 20070235136 - Enomoto; Takashi ;   et al.
2007-10-11
Processing device, electrode, electrode plate, and processing method
App 20050092435 - Hayashi, Kazuichi ;   et al.
2005-05-05

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