Tsui; Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsui; Ting.The latest application filed is for "silicon carbide film for integrated circuit fabrication".

Company Profile

0.5.9

Tsui; Ting - Garland TX
Tsui; Ting - Markham CA
Tsui; Ting - Dallas TX
Tsui, Ting - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Systems and methods that selectively modify liner induced stress Grant 7,939,400 - Tsui , et al. May 10, 2	2011-05-10
Silicon Carbide Film For Integrated Circuit Fabrication App 20110034023 - Matz; Laura M. ; et al.	2011-02-10
SiC Film for Semiconductor Processing App 20090081864 - Matz; Laura M. ; et al.	2009-03-26
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface Grant 7,087,518 - Farber , et al. August 8, 2	2006-08-08
System for improving thermal stability of copper damascene structure App 20050186788 - Lu, Jiong-Ping ; et al.	2005-08-25
System for improving thermal stability of copper damascene structure Grant 6,903,000 - Lu , et al. June 7, 2	2005-06-07
Method for fabricating semiconductor devices that uses efficient plasmas Grant 6,806,103 - Tsui , et al. October 19, 2	2004-10-19
Etch Back Of Interconnect Dielectrics App 20040169280 - Farber, David G. ; et al.	2004-09-02
Etch back of interconnect dielectrics App 20040169279 - Farber, David G. ; et al.	2004-09-02
Etch back of interconnect dielectrics Grant 6,780,756 - Farber , et al. August 24, 2	2004-08-24
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface App 20030224585 - Farber, David Gerald ; et al.	2003-12-04
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface App 20030170992 - Farber, David Gerald ; et al.	2003-09-11
System for improving thermal stability of copper damascene structure App 20030124828 - Lu, Jiong-Ping ; et al.	2003-07-03
Method to improve the adhesion of dielectric layers to copper App 20030027413 - Tsui, Ting	2003-02-06

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