Tsubosaki; Kunihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsubosaki; Kunihiro.The latest application filed is for "method of manufacturing a semiconductor device".
Company Profile
0.53.50
- Tsubosaki; Kunihiro - Hino JP
- Tsubosaki; Kunihiro - Tokyo JP
- Tsubosaki, Kunihiro - Shinjuku-Ku JP
- Tsubosaki, Kunihiro - Hino-shi JP
- Tsubosaki, Kunihiro - Tokyo-To JP
- TSUBOSAKI, KUNIHIRO - HAMURA-SHI JP
Patent Activity
| Patent | Date |
|---|---|
| Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two Grant RE43,443 - Kajihara , et al. June 5, 2 | 2012-06-05 |
| Method of manufacturing a semiconductor device Grant 7,678,706 - Miyaki , et al. March 16, 2 | 2010-03-16 |
| Semiconductor device and manufacturing method thereof Grant 7,420,284 - Miyazaki , et al. September 2, 2 | 2008-09-02 |
| Method Of Manufacturing A Semiconductor Device App 20070298545 - MIYAKI; Yoshinori ; et al. | 2007-12-27 |
| Method of manufacturing a semiconductor device Grant 7,247,576 - Miyaki , et al. July 24, 2 | 2007-07-24 |
| Circuit tape having adhesive film semiconductor device and a method for manufacturing the same Grant 7,202,570 - Nagai , et al. April 10, 2 | 2007-04-10 |
| Semiconductor device and manufacturing method thereof App 20060261494 - Miyazaki; Chuichi ; et al. | 2006-11-23 |
| Semiconductor device and manufacturing method thereof Grant 7,091,620 - Miyazaki , et al. August 15, 2 | 2006-08-15 |
| Semiconductor device and its manufacturing method App 20060049499 - Miyaki; Yoshinori ; et al. | 2006-03-09 |
| Manufacturing method of a semiconductor device Grant 6,989,334 - Miyaki , et al. January 24, 2 | 2006-01-24 |
| Semiconductor device and manufacturing metthod thereof App 20050212142 - Miyazaki, Chuichi ; et al. | 2005-09-29 |
| Semiconductor device and manufacturing method thereof App 20050200019 - Miyazaki, Chuichi ; et al. | 2005-09-15 |
| Plastic molded type semiconductor device and fabrication process thereof Grant 6,943,456 - Miyaki , et al. September 13, 2 | 2005-09-13 |
| Semiconductor device and method of fabricating the same App 20050167831 - Tsubosaki, Kunihiro | 2005-08-04 |
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Semiconductor device and method of fabricating the same Grant 6,906,429 - Tsubosaki June 14, 2 | 2005-06-14 |
| Semiconductor device and method of fabricating the same App 20050073049 - Tsubosaki, Kunihiro | 2005-04-07 |
| Circuit tape having adhesive film semiconductor device and a method for manufacturing the same App 20040224149 - Nagai, Akira ; et al. | 2004-11-11 |
| Semiconductor device and method for fabricating the semiconductor device Grant 6,808,962 - Tsubosaki October 26, 2 | 2004-10-26 |
| Semiconductor device Grant 6,803,258 - Ito , et al. October 12, 2 | 2004-10-12 |
| Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Grant 6,791,194 - Nagai , et al. September 14, 2 | 2004-09-14 |
| Plastic molded type semiconductor device and fabrication process thereof App 20040159922 - Miyaki, Yoshinori ; et al. | 2004-08-19 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Semiconductor device and manufacturing method thereof Grant 6,759,272 - Tsubosaki , et al. July 6, 2 | 2004-07-06 |
| Semiconductor device App 20040126932 - Ito, Fujio ; et al. | 2004-07-01 |
| Inspection contact sheet and method of fabricating the same App 20040101666 - Tsubosaki, Kunihiro ; et al. | 2004-05-27 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Semiconductor device and manufacturing method thereof App 20040061220 - Miyazaki, Chuichi ; et al. | 2004-04-01 |
| Plastic molded type semiconductor device and fabrication process thereof Grant 6,692,989 - Miyaki , et al. February 17, 2 | 2004-02-17 |
| Method of making semiconductor device having improved heat radiation plate arrangement Grant 6,673,655 - Ito , et al. January 6, 2 | 2004-01-06 |
| Semiconductor device and manufacturing method thereof Grant 6,670,215 - Miyazaki , et al. December 30, 2 | 2003-12-30 |
| Semiconductor device and manufacturing method thereof Grant 6,664,616 - Tsubosaki , et al. December 16, 2 | 2003-12-16 |
| Method of manufacturing a ball grid array type semiconductor package Grant 6,664,135 - Miyazaki , et al. December 16, 2 | 2003-12-16 |
| Semiconductor device and its manufacturing method App 20030207557 - Akiyama, Yukiharu ; et al. | 2003-11-06 |
| Semiconductor device and manufacturing method thereof Grant 6,642,083 - Miyazaki , et al. November 4, 2 | 2003-11-04 |
| Semiconductor device and its manufacturing method Grant 6,639,323 - Akiyama , et al. October 28, 2 | 2003-10-28 |
| Semiconductor device and manufactuiring method thereof App 20030162326 - Tsubosaki, Kunihiro ; et al. | 2003-08-28 |
| Method of fabricating a semiconductor device Grant 6,610,561 - Tsubosaki , et al. August 26, 2 | 2003-08-26 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Methods of processing semiconductor wafer and producing IC card, and carrier Grant 6,589,855 - Miyamoto , et al. July 8, 2 | 2003-07-08 |
| Plastic molded type semiconductor device and fabrication process thereof App 20030124770 - Miyaki, Yoshinori ; et al. | 2003-07-03 |
| Methods of processing semiconductor wafer and producing IC card, and carrier Grant 6,573,158 - Miyamoto , et al. June 3, 2 | 2003-06-03 |
| Semiconductor device and manufacturing method thereof Grant 6,521,981 - Miyazaki , et al. February 18, 2 | 2003-02-18 |
| Method for mounting a thin semiconductor device App 20030027376 - Usami, Mitsuo ; et al. | 2003-02-06 |
| Semiconductor device with elastic structure and wiring Grant 6,515,371 - Akiyama , et al. February 4, 2 | 2003-02-04 |
| Semiconductor package and flip chip bonding method therein App 20030001286 - Kajiwara, Ryoichi ; et al. | 2003-01-02 |
| Semiconductor device App 20020192871 - Ito, Fujio ; et al. | 2002-12-19 |
| Semiconductor Device And Manufacturing Method Thereof App 20020180010 - TSUBOSAKI, KUNIHIRO ; et al. | 2002-12-05 |
| Semiconductor device and method for fabricating the semiconductor device App 20020175409 - Tsubosaki, Kunihiro | 2002-11-28 |
| Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same App 20020160185 - Nagai, Akira ; et al. | 2002-10-31 |
| Semiconductor device and manufacturing method thereof Grant 6,472,727 - Miyazaki , et al. October 29, 2 | 2002-10-29 |
| Lead frame and semiconductor package formed using it App 20020153596 - Tsubosaki, Kunihiro ; et al. | 2002-10-24 |
| Semiconductor device App 20020137262 - Ito, Fujio ; et al. | 2002-09-26 |
| Semiconductor device App 20020137261 - Ito, Fujio ; et al. | 2002-09-26 |
| Member for mounting of semiconductor Grant 6,441,502 - Yamada , et al. August 27, 2 | 2002-08-27 |
| Semiconductor device and manufacturing method thereof App 20020070461 - Miyazaki, Chuichi ; et al. | 2002-06-13 |
| Semiconductor device and manufacturing method thereof App 20020066181 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020068380 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020064901 - Miyazaki, Chuichi ; et al. | 2002-05-30 |
| Semiconductor device and its manufacturing method App 20020050636 - Akiyama, Yukiharu ; et al. | 2002-05-02 |
| Semiconductor device and its manufacturing method App 20020047215 - Akiyama, Yukiharu ; et al. | 2002-04-25 |
| Methods of processing semiconductor wafer and producing IC card, and carrier App 20020048907 - Miyamoto, Toshio ; et al. | 2002-04-25 |
| Methods of processing semiconductor wafer and producing IC card, and carrier App 20020034860 - Miyamoto, Toshio ; et al. | 2002-03-21 |
| Semiconductor device and manufacturing method thereof Grant 6,355,975 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Semiconductor device and manufacturing method thereof Grant 6,355,500 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Methods of processing semiconductor wafer, and producing IC card, and carrier Grant 6,342,434 - Miyamoto , et al. January 29, 2 | 2002-01-29 |
| Semiconductor Device And Manufacturing Method Thereof App 20010035575 - MIYAZAKI, CHUICHI ; et al. | 2001-11-01 |
| Semiconductor device and method for manufacturing the same Grant 6,297,544 - Nakamura , et al. October 2, 2 | 2001-10-02 |
| Plastic molded type semiconductor device and fabrication process thereof Grant 6,291,273 - Miyaki , et al. September 18, 2 | 2001-09-18 |
| Method of fabricating a semiconductor device App 20010016371 - Tsubosaki, Kunihiro ; et al. | 2001-08-23 |
| Plastic molded type semiconductor device and fabrication process thereof App 20010010949 - Miyaki, Yoshinori ; et al. | 2001-08-02 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device and manufacturing method thereof App 20010008304 - Miyazaki, Chuichi ; et al. | 2001-07-19 |
| Semiconductor device and manufacturing method thereof App 20010007781 - Miyazaki, Chuichi ; et al. | 2001-07-12 |
| Member for mounting of semiconductor and a method for producing thereof App 20010005599 - Yamada, Junichi ; et al. | 2001-06-28 |
| Semiconductor device and manufacturing method thereof App 20010005055 - Miyazaki, Chuichi ; et al. | 2001-06-28 |
| Semiconductor device and manufacturing method thereof App 20010004127 - Miyazaki, Chuichi ; et al. | 2001-06-21 |
| Semiconductor device and manufacturing method thereof App 20010003048 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002724 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010003059 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002730 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002069 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Semiconductor device and manufacturing method thereof App 20010002064 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Semiconductor device and method for making same App 20010000079 - Usami, Mitsuo ; et al. | 2001-03-29 |
| Semiconductor device Grant 6,140,697 - Usami , et al. October 31, 2 | 2000-10-31 |
| Lead on chip semiconductor device and method of fabricating the same Grant 6,137,159 - Tsubosaki , et al. October 24, 2 | 2000-10-24 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device Grant 5,986,341 - Usami , et al. November 16, 1 | 1999-11-16 |
| Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids Grant 5,874,773 - Terada , et al. February 23, 1 | 1999-02-23 |
| Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1 | 1998-02-03 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1 | 1996-12-10 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Packaged semiconductor device having stress absorbing film Grant 5,466,888 - Beng , et al. November 14, 1 | 1995-11-14 |
| Ultrasonic bonding apparatus and quality monitoring method Grant 5,431,324 - Kajiwara , et al. July 11, 1 | 1995-07-11 |
| Packaged semiconductor device having stress absorbing film Grant 5,406,028 - Beng , et al. April 11, 1 | 1995-04-11 |
| Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same Grant 5,378,656 - Kajihara , et al. January 3, 1 | 1995-01-03 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Resin-encapsulated semiconductor device Grant 4,951,122 - Tsubosaki , et al. August 21, 1 | 1990-08-21 |
| Semiconductor device and process for producing the same Grant 4,803,543 - Inayoshi , et al. February 7, 1 | 1989-02-07 |
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