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Solderless Interconnection Structure and Method of Forming Same
App 20210313287 - Lin; Yu-Wei ; et al. | 2021-10-07 |
Solderless interconnection structure and method of forming same
Grant 11,043,462 - Lin , et al. June 22, 2 | 2021-06-22 |
Solderless Interconnection Structure and Method of Forming Same
App 20190295971 - Lin; Yu-Wei ; et al. | 2019-09-26 |
Solderless interconnection structure and method of forming same
Grant 10,319,691 - Lin , et al. | 2019-06-11 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,153,243 - Tseng , et al. Dec | 2018-12-11 |
Structures having a tapering curved profile and methods of making same
Grant 10,008,459 - Tsai , et al. June 26, 2 | 2018-06-26 |
Bump structure and method of forming same
Grant 9,966,346 - Chen , et al. May 8, 2 | 2018-05-08 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,953,939 - Lin , et al. April 24, 2 | 2018-04-24 |
Bump-on-trace interconnection structure for flip-chip packages
Grant 9,917,035 - Tseng , et al. March 13, 2 | 2018-03-13 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20170229421 - Tseng; Yu-Jen ; et al. | 2017-08-10 |
Interconnection structure
Grant 9,673,125 - Liu , et al. June 6, 2 | 2017-06-06 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 9,646,923 - Tseng , et al. May 9, 2 | 2017-05-09 |
Interconnection Structure and Method of Forming Same
App 20170117245 - Lin; Yu-Wei ; et al. | 2017-04-27 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20170069587 - Lin; Yen-Liang ; et al. | 2017-03-09 |
Package having substrate with embedded metal trace overlapped by landing pad
Grant 9,536,850 - Yu , et al. January 3, 2 | 2017-01-03 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,508,668 - Lin , et al. November 29, 2 | 2016-11-29 |
Interconnection structure and method of forming same
Grant 9,496,233 - Lin , et al. November 15, 2 | 2016-11-15 |
Bump Structure and Method of Forming Same
App 20150357301 - Chen; Guan-Yu ; et al. | 2015-12-10 |
Conductive Contacts Having Varying Widths And Method Of Manufacturing Same
App 20150325542 - Lin; Yen-Liang ; et al. | 2015-11-12 |
Bump structure and method of forming same
Grant 9,111,817 - Chen , et al. August 18, 2 | 2015-08-18 |
Conductive contacts having varying widths and method of manufacturing same
Grant 9,105,530 - Lin , et al. August 11, 2 | 2015-08-11 |
Methods for metal bump die assembly
Grant 8,853,002 - Lin , et al. October 7, 2 | 2014-10-07 |
Package Having Substrate with Embedded Metal Trace Overlapped by Landing Pad
App 20140252598 - Yu; Chen-Hua ; et al. | 2014-09-11 |
Methods for Metal Bump Die Assembly
App 20140193952 - Lin; Hsiu-Jen ; et al. | 2014-07-10 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
App 20140167253 - Tseng; Yu-Jen ; et al. | 2014-06-19 |
Interconnection Structure
App 20140117534 - Liu; Hao-Juin ; et al. | 2014-05-01 |
Bump-on-trace Interconnection Structure For Flip-chip Packages
App 20140110847 - TSENG; Yu-Jen ; et al. | 2014-04-24 |
Bump Structure and Method of Forming Same
App 20140077358 - Chen; Guan-Yu ; et al. | 2014-03-20 |
Metal Bump and Method of Manufacturing Same
App 20140077365 - Lin; Yen-Liang ; et al. | 2014-03-20 |
Ladder Bump Structures and Methods of Making Same
App 20140077359 - Tsai; Pei-Chun ; et al. | 2014-03-20 |
Interconnection Structure and Method of Forming Same
App 20140077360 - Lin; Yu-Wei ; et al. | 2014-03-20 |
Method for designing a package and substrate layout
Grant 8,664,041 - Tseng , et al. March 4, 2 | 2014-03-04 |
Trace Layout Method in Bump-on-Trace Structures
App 20130270693 - Tseng; Yu-Jen ; et al. | 2013-10-17 |
Active Reflective Warning Apparatus
App 20090168177 - Tseng; Yu-Jen ; et al. | 2009-07-02 |
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