Tseng Yu Jen

USPTO Trademark & Patent Filings

Trademark applications and grants for Tseng Yu Jen. Tseng Yu Jen has 1 trademark applications. The latest application filed is for "KOVAC"

Company Profile

TSENG, YU-JEN
jen yu tseng
Tseng; Yu-Jen - Hsinchu TW
Tseng; Yu-Jen - Hsin-Chu TW

Trademarks Patents

Patent Applications

Patent Application	Date
Solderless Interconnection Structure and Method of Forming Same 20210313287 - 17/352844 Lin; Yu-Wei ; et al.	2021-10-07
Solderless Interconnection Structure and Method of Forming Same 20190295971 - 16/436626 Lin; Yu-Wei ; et al.	2019-09-26
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices 20170229421 - 15/497408 Tseng; Yu-Jen ; et al.	2017-08-10
Interconnection Structure and Method of Forming Same 20170117245 - 15/351184 Lin; Yu-Wei ; et al.	2017-04-27
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURING SAME 20170069587 - 15/356316 Lin; Yen-Liang ; et al.	2017-03-09
Solderless interconnection structure and method of forming same 11,043,462 - 16/436,626 Lin , et al. June 22, 2	2021-06-22
Solderless interconnection structure and method of forming same 10,319,691 - 15/351,184 Lin , et al.	2019-06-11
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices 10,153,243 - 15/497,408 Tseng , et al. Dec	2018-12-11
Structures having a tapering curved profile and methods of making same 10,008,459 - 13/734,811 Tsai , et al. June 26, 2	2018-06-26
Bump structure and method of forming same 9,966,346 - 14/828,147 Chen , et al. May 8, 2	2018-05-08

Patent Grants & Applications

Trademark Applications

Mark Image Registration \| Serial	Trademark Application Date
"KOVAC" 4734585 86379054	KOVAC 2014-08-27

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