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Cobalt Plated Via Integration Scheme
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Cobalt plated via integration scheme
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Dual medium filter for ion and particle filtering during semiconductor processing
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Dual Medium Filter For Ion And Particle Filtering During Semiconductor Processing
App 20170148647 - Zhang; John H. ; et al. | 2017-05-25 |
Seamless metallization contacts
Grant 9,633,946 - Liang , et al. April 25, 2 | 2017-04-25 |
Dual medium filter for ion and particle filtering during semiconductor processing
Grant 9,607,864 - Zhang , et al. March 28, 2 | 2017-03-28 |
Multimetal Interlayer Interconnects
App 20160071791 - Huang; Elbert E. ; et al. | 2016-03-10 |
Hardmask Removal For Copper Interconnects With Tungsten Contacts By Chemical Mechanical Polishing
App 20150279733 - Ferrer; Domingo A. ; et al. | 2015-10-01 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20150255397 - Dyer; Thomas W. ; et al. | 2015-09-10 |
Doping of copper wiring structures in back end of line processing
Grant 9,059,177 - Dyer , et al. June 16, 2 | 2015-06-16 |
Post metal chemical-mechanical planarization cleaning process
Grant 8,920,567 - Devarapalli , et al. December 30, 2 | 2014-12-30 |
Post Metal Chemical-mechanical Planarization Cleaning Process
App 20140256133 - Devarapalli; Vamsi ; et al. | 2014-09-11 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20140246776 - Dyer; Thomas W. ; et al. | 2014-09-04 |
Method of repairing probe pads
Grant 8,822,994 - Zhang , et al. September 2, 2 | 2014-09-02 |
Doping of copper wiring structures in back end of line processing
Grant 8,765,602 - Dyer , et al. July 1, 2 | 2014-07-01 |
Technique For Uniform Cmp
App 20140097539 - Zhang; John H. ; et al. | 2014-04-10 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20140061914 - Dyer; Thomas W. ; et al. | 2014-03-06 |
Dual Medium Filter For Ion And Particle Filtering During Semiconductor Processing
App 20130312791 - Zhang; John H. ; et al. | 2013-11-28 |
Method Of Repairing Probe Pads
App 20130072011 - Zhang; John H. ; et al. | 2013-03-21 |
Method Of Repairing Probe Pads
App 20130063173 - Zhang; John H. ; et al. | 2013-03-14 |
Method of repairing probe pads
Grant 8,324,622 - Zhang , et al. December 4, 2 | 2012-12-04 |
Method Of Repairing Probe Pads
App 20110156032 - Zhang; John H. ; et al. | 2011-06-30 |
Detection and characterization of SiCOH-based dielectric materials during device fabrication
Grant 7,556,972 - Balachandran , et al. July 7, 2 | 2009-07-07 |
Extended life conditioning disk
Grant 7,510,463 - Kim , et al. March 31, 2 | 2009-03-31 |
Chemical planarization performance for copper/low-k interconnect structures
Grant 7,407,879 - Nicholson , et al. August 5, 2 | 2008-08-05 |
DETECTION AND CHARACTERIZATION OF SiCOH-BASED DIELECTRIC MATERIALS DURING DEVICE FABRICATION
App 20080182335 - Balachandran; Manoj ; et al. | 2008-07-31 |
Extended Life Conditioning Disk
App 20070287367 - Kim; Ben ; et al. | 2007-12-13 |
Wafer Removing Force Reduction On Cmp Tool
App 20070190788 - Balachandran; Manoj ; et al. | 2007-08-16 |
Maintaining uniform CMP hard mask thickness
Grant 7,253,098 - Chen , et al. August 7, 2 | 2007-08-07 |
Selective capping of copper wiring
Grant 7,190,079 - Andricacos , et al. March 13, 2 | 2007-03-13 |
Chemical planarization performance for copper/low-k interconnect structures
App 20060166012 - Nicholson; Lee M. ; et al. | 2006-07-27 |
Chemical planarization performance for copper/low-k interconnect structures
Grant 7,071,539 - Nicholson , et al. July 4, 2 | 2006-07-04 |
Copper recess process with application to selective capping and electroless plating
Grant 7,064,064 - Chen , et al. June 20, 2 | 2006-06-20 |
Robust Signal Processing Algorithm For End-Pointing Chemical-Mechanical Polishing Processes
App 20060105676 - O'Sullivan; Eugene J. ; et al. | 2006-05-18 |
Selective capping of copper wiring
App 20060076685 - Andricacos; Panayotis C. ; et al. | 2006-04-13 |
Selective capping of copper wiring
Grant 7,008,871 - Andricacos , et al. March 7, 2 | 2006-03-07 |
Maintaining Uniform Cmp Hard Mask Thickness
App 20060043590 - Chen; Steven Shyng-Tsong T. ; et al. | 2006-03-02 |
Copper recess process with application to selective capping and electroless plating
Grant 6,975,032 - Chen , et al. December 13, 2 | 2005-12-13 |
Copper recess process with application to selective capping and electroless plating
App 20050158985 - Chen, Shyng-Tsong ; et al. | 2005-07-21 |
Chemical planarization performance for copper/low-k interconnect structures
App 20050023689 - Nicholson, Lee M. ; et al. | 2005-02-03 |
Selective capping of copper wiring
App 20050001325 - Andricacos, Panayotis C. ; et al. | 2005-01-06 |
Copper recess process with application to selective capping and electroless plating
App 20040113279 - Chen, Shyng-Tsong ; et al. | 2004-06-17 |
Method of forming planar Cu interconnects without chemical mechanical polishing
App 20040094511 - Seo, Soon-Cheon ; et al. | 2004-05-20 |
Low dielectric constant polymer and monomers used in their formation
Grant 6,660,820 - Martin , et al. December 9, 2 | 2003-12-09 |
Scribe Line Structure For Preventing From Damages Thereof Induced During Fabrication
App 20020000642 - LIN, CHI-FA ; et al. | 2002-01-03 |
Inter-metal Dielectric Layer Structure And Its Forming Method
App 20010042903 - LIN, CHI-FA ; et al. | 2001-11-22 |
Chemical mechanical polishing slurry for metallic thin film
Grant 5,922,091 - Tsai , et al. July 13, 1 | 1999-07-13 |
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