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Package Structure With Fan-out Feature
App 20220310468 - LIN; Meng-Liang ; et al. | 2022-09-29 |
Package component with stepped passivation layer
Grant 11,450,567 - Cheng , et al. September 20, 2 | 2022-09-20 |
Semiconductor devices and methods of manufacturing
Grant 11,430,776 - Wu , et al. August 30, 2 | 2022-08-30 |
Structure and formation method of package structure with fan-out structure
Grant 11,430,739 - Tsai , et al. August 30, 2 | 2022-08-30 |
Bump Integration with Redistribution Layer
App 20220246565 - Yang; Ting-Li ; et al. | 2022-08-04 |
Hybrid Micro-bump Integration With Redistribution Layer
App 20220230978 - Yang; Ting-Li ; et al. | 2022-07-21 |
Dummy structure of stacked and bonded semiconductor device
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Semiconductor device and method of manufacture
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Semiconductor Device and Method
App 20220223548 - Yang; Ting-Li ; et al. | 2022-07-14 |
Semiconductor Device and Method
App 20220223550 - Chen; Chen-Shien ; et al. | 2022-07-14 |
Semiconductor device and method of manufacture
Grant 11,387,217 - Lin , et al. July 12, 2 | 2022-07-12 |
Chip Structure With Conductive Via Structure And Method For Forming The Same
App 20220216143 - YANG; Ting-Li ; et al. | 2022-07-07 |
Fan-out package with cavity substrate
Grant 11,380,666 - Tsai , et al. July 5, 2 | 2022-07-05 |
Semiconductor Package
App 20220208707 - Hsu; Chia-Kuei ; et al. | 2022-06-30 |
Dual-sided Routing in 3D SiP Structure
App 20220199541 - Tsai; Po-Hao ; et al. | 2022-06-23 |
Formation Method Of Chip Package
App 20220189884 - CHUANG; Po-Yao ; et al. | 2022-06-16 |
Structure and formation method of chip package with fan-out feature
Grant 11,362,010 - Lin , et al. June 14, 2 | 2022-06-14 |
Chip Package Structure With Conductive Shielding Film
App 20220181305 - YU; Chen-Hua ; et al. | 2022-06-09 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20220157695 - Cheng; Li-Hui ; et al. | 2022-05-19 |
Package with fan-out structures
Grant 11,322,449 - Jeng , et al. May 3, 2 | 2022-05-03 |
Dual-sided routing in 3D SiP structure
Grant 11,322,447 - Tsai , et al. May 3, 2 | 2022-05-03 |
Package Structure And Manufacturing Method Thereof
App 20220122952 - Chen; Wei-Yu ; et al. | 2022-04-21 |
Formation Method Of Chip Package With Fan-out Feature
App 20220108956 - TSAI; Po-Hao ; et al. | 2022-04-07 |
Semiconductor Device and Method
App 20220102269 - Yang; Ting-Li ; et al. | 2022-03-31 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 11,282,803 - Hsu , et al. March 22, 2 | 2022-03-22 |
Structure and formation method of chip package with shielding structure
Grant 11,270,953 - Chuang , et al. March 8, 2 | 2022-03-08 |
Chip package structure with seal ring structure
Grant 11,264,363 - Yu , et al. March 1, 2 | 2022-03-01 |
Method Of Forming Package Structure
App 20220059515 - LIN; Jing-Cheng ; et al. | 2022-02-24 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 11,239,138 - Cheng , et al. February 1, 2 | 2022-02-01 |
Structure and formation method of chip package with fan-out feature
Grant 11,239,173 - Tsai , et al. February 1, 2 | 2022-02-01 |
Package structure and manufacturing method thereof
Grant 11,217,570 - Chen , et al. January 4, 2 | 2022-01-04 |
Semiconductor Devices And Methods Of Manufacturing
App 20210391317 - Wu; Yi-Wen ; et al. | 2021-12-16 |
Method For Forming Package Structure
App 20210384125 - TSAI; Po-Hao ; et al. | 2021-12-09 |
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375672 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Semiconductor Package With Improved Interposer Structure
App 20210375755 - Wu; Yi-Wen ; et al. | 2021-12-02 |
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375815 - Tsai; Po-Hao ; et al. | 2021-12-02 |
Package Component with Stepped Passivation Layer
App 20210375675 - Cheng; Ming-Da ; et al. | 2021-12-02 |
Fan-Out Package with Controllable Standoff
App 20210351118 - Tsai; Po-Hao ; et al. | 2021-11-11 |
Method For Forming Chip Package Structure
App 20210343652 - JENG; Shin-Puu ; et al. | 2021-11-04 |
Semiconductor Device and Method of Manufacture
App 20210343665 - Chuang; Po-Yao ; et al. | 2021-11-04 |
Method of forming package structure
Grant 11,164,852 - Lin , et al. November 2, 2 | 2021-11-02 |
Fan-out packages and methods of forming the same
Grant 11,164,754 - Tsai , et al. November 2, 2 | 2021-11-02 |
Semiconductor Device And Method
App 20210335701 - Lin; Jing-Cheng ; et al. | 2021-10-28 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,588 - Tsai , et al. October 26, 2 | 2021-10-26 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,587 - Tsai , et al. October 26, 2 | 2021-10-26 |
InFO-POP structures with TIVs Having Cavities
App 20210327816 - Lin; Jing-Cheng ; et al. | 2021-10-21 |
Package With Fan-out Structures
App 20210320069 - JENG; Shin-Puu ; et al. | 2021-10-14 |
Wafer level mold chase
Grant 11,114,313 - Liu , et al. September 7, 2 | 2021-09-07 |
Chip package structure and method for forming the same
Grant 11,114,311 - Tsai , et al. September 7, 2 | 2021-09-07 |
Semiconductor package structure with twinned copper
Grant 11,114,405 - Chang , et al. September 7, 2 | 2021-09-07 |
Heterogeneous Fan-out Structure And Method Of Manufacture
App 20210272888 - Tsai; Po-Hao ; et al. | 2021-09-02 |
Semiconductor packages and methods of forming the same
Grant 11,107,798 - Yu , et al. August 31, 2 | 2021-08-31 |
Package structure with dam structure and method for forming the same
Grant 11,101,214 - Tsai , et al. August 24, 2 | 2021-08-24 |
Semiconductor package with improved interposer structure
Grant 11,094,625 - Wu , et al. August 17, 2 | 2021-08-17 |
Semiconductor package
Grant 11,094,639 - Lin , et al. August 17, 2 | 2021-08-17 |
Chip Package With Redistribution Structure
App 20210242122 - JENG; Shin-Puu ; et al. | 2021-08-05 |
Fan-out package with controllable standoff
Grant 11,075,151 - Tsai , et al. July 27, 2 | 2021-07-27 |
InFO-POP structures with TIVs having cavities
Grant 11,075,168 - Lin , et al. July 27, 2 | 2021-07-27 |
Semiconductor Device And Method Of Manufacture
App 20210225785 - Tsai; Po-Hao ; et al. | 2021-07-22 |
Semiconductor package and manufacturing method thereof
Grant 11,069,673 - Cheng , et al. July 20, 2 | 2021-07-20 |
Semiconductor device and method of manufacture
Grant 11,063,007 - Chuang , et al. July 13, 2 | 2021-07-13 |
Semiconductor device
Grant 11,062,987 - Lin , et al. July 13, 2 | 2021-07-13 |
Method for forming chip package structure
Grant 11,062,997 - Jeng , et al. July 13, 2 | 2021-07-13 |
Semiconductor device and method of manufacture
Grant 11,056,471 - Lin , et al. July 6, 2 | 2021-07-06 |
Interconnect structure for package-on-package devices
Grant 11,037,861 - Hung , et al. June 15, 2 | 2021-06-15 |
Heterogeneous fan-out structure and method of manufacture
Grant 11,018,081 - Tsai , et al. May 25, 2 | 2021-05-25 |
Package Structure With Cavity Substrate And Method For Forming The Same
App 20210125961 - TSAI; Po-Hao ; et al. | 2021-04-29 |
Structure And Formation Method Of Chip Package With Fan-out Feature
App 20210118757 - LIN; Meng-Liang ; et al. | 2021-04-22 |
Chip package with recessed interposer substrate
Grant 10,985,100 - Jeng , et al. April 20, 2 | 2021-04-20 |
Semiconductor device and method of manufacture
Grant 10,971,461 - Tsai , et al. April 6, 2 | 2021-04-06 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20210082847 - Hsu; Chia-Kuei ; et al. | 2021-03-18 |
Semiconductor Device and Method of Manufacture
App 20210074683 - Lin; Jing-Cheng ; et al. | 2021-03-11 |
Package and manufacturing method thereof
Grant 10,937,742 - Tsai March 2, 2 | 2021-03-02 |
Dual-sided Routing in 3D SiP Structure
App 20210050295 - Tsai; Po-Hao ; et al. | 2021-02-18 |
Semiconductor Device and Method of Manufacture
App 20210043581 - Lin; Jing-Cheng ; et al. | 2021-02-11 |
Fan-Out Package with Cavity Substrate
App 20210035966 - Tsai; Po-Hao ; et al. | 2021-02-04 |
Integrated Circuit Package and Method
App 20210013053 - Tsai; Po-Hao ; et al. | 2021-01-14 |
Integrated Circuit Packages And Methods Of Forming Same
App 20210005464 - Lin; Jing-Cheng ; et al. | 2021-01-07 |
Chip Package Structure With Seal Ring Structure
App 20200411485 - YU; Chen-Hua ; et al. | 2020-12-31 |
Structure And Formation Method Of Chip Package With Conductive Support Elements
App 20200411444 - TSAI; Po-Hao ; et al. | 2020-12-31 |
Semiconductor device package and method of manufacturing the same
Grant 10,879,194 - Lin , et al. December 29, 2 | 2020-12-29 |
Release Film as Isolation Film in Package
App 20200402816 - Lin; Jing-Cheng ; et al. | 2020-12-24 |
Package structure and method of forming thereof
Grant 10,872,850 - Cheng , et al. December 22, 2 | 2020-12-22 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 10,854,563 - Hsu , et al. December 1, 2 | 2020-12-01 |
Wafer Level Mold Chase
App 20200365421 - LIU; Hsien-Wen ; et al. | 2020-11-19 |
Semiconductor device and method of manufacture
Grant 10,840,218 - Lin , et al. November 17, 2 | 2020-11-17 |
Semiconductor Device Having Reduced Bump Height Variation
App 20200350277 - LIN; Jing-Cheng ; et al. | 2020-11-05 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20200350279 - Tsai; Po-Hao ; et al. | 2020-11-05 |
Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
Grant 10,818,583 - Chen , et al. October 27, 2 | 2020-10-27 |
Semiconductor device and method of manufacture
Grant 10,818,607 - Lin , et al. October 27, 2 | 2020-10-27 |
Chip package structure with conductive shielding film
Grant 10,804,247 - Yu , et al. October 13, 2 | 2020-10-13 |
Fan-out package with cavity substrate
Grant 10,804,254 - Tsai , et al. October 13, 2 | 2020-10-13 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20200312791 - Tsai; Po-Hao ; et al. | 2020-10-01 |
Structure And Formation Method Of Chip Package With Fan-out Feature
App 20200312773 - TSAI; Po-Hao ; et al. | 2020-10-01 |
Integrated circuit package and method
Grant 10,790,162 - Tsai , et al. September 29, 2 | 2020-09-29 |
Integrated circuit packages and methods of forming same
Grant 10,784,123 - Lin , et al. Sept | 2020-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20200294983 - Cheng; Li-Hui ; et al. | 2020-09-17 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20200286843 - Hsu; Chia-Kuei ; et al. | 2020-09-10 |
Semiconductor Packages and Methods of Forming the Same
App 20200279836 - Yu; Chen-Hua ; et al. | 2020-09-03 |
Release film as isolation film in package
Grant 10,763,132 - Lin , et al. Sep | 2020-09-01 |
Method of controlling bump height variation
Grant 10,741,520 - Lin , et al. A | 2020-08-11 |
Package Structure And Manufacturing Method Thereof
App 20200251456 - Kind Code | 2020-08-06 |
Semiconductor Device and Method
App 20200243435 - Lin; Jing-Cheng ; et al. | 2020-07-30 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,720,403 - Tsai , et al. | 2020-07-21 |
Package Structure And Method For Forming The Same
App 20200211962 - TSAI; Po-Hao ; et al. | 2020-07-02 |
Semiconductor Package With Improved Interposer Structure
App 20200211956 - WU; Yi-Wen ; et al. | 2020-07-02 |
Heterogeneous Antenna in Fan-Out Package
App 20200212537 - Chuang; Po-Yao ; et al. | 2020-07-02 |
Semiconductor package and manufacturing method thereof
Grant 10,672,752 - Cheng , et al. | 2020-06-02 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 10,665,559 - Hsu , et al. | 2020-05-26 |
Semiconductor packages and methods of forming the same
Grant 10,658,347 - Yu , et al. | 2020-05-19 |
Semiconductor Device And Method Of Manufacturing The Same
App 20200152560 - LIN; JING-CHENG ; et al. | 2020-05-14 |
Package And Manufacturing Method Thereof
App 20200144199 - Tsai; Po-Hao | 2020-05-07 |
Stacked and Bonded Semiconductor Device
App 20200144212 - Cheng; Li-Hui ; et al. | 2020-05-07 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20200144202 - Tsai; Po-Hao ; et al. | 2020-05-07 |
Structure And Formation Method Of Package Structure With Fan-out Structure
App 20200135653 - TSAI; Po-Hao ; et al. | 2020-04-30 |
Semiconductor Package Structure With Conductive Layer
App 20200135680 - CHANG; Jung-Hua ; et al. | 2020-04-30 |
Package structure and manufacturing method thereof
Grant 10,636,775 - Chen , et al. | 2020-04-28 |
Chip Package With Interposer Substrate
App 20200126812 - JENG; Shin-Puu ; et al. | 2020-04-23 |
Semiconductor Device and Method of Manufacture
App 20200126959 - Lin; Jing-Cheng ; et al. | 2020-04-23 |
Semiconductor device and method
Grant 10,622,297 - Lin , et al. | 2020-04-14 |
Integrated Circuit Package and Method
App 20200105663 - Tsai; Po-Hao ; et al. | 2020-04-02 |
Fan-Out Packages And Methods Of Forming The Same
App 20200105544 - Tsai; Po-Hao ; et al. | 2020-04-02 |
Method For Forming Chip Package Structure
App 20200098693 - JENG; Shin-Puu ; et al. | 2020-03-26 |
Interconnect Structure for Package-on-Package Devices
App 20200083145 - Hung; Jui-Pin ; et al. | 2020-03-12 |
Structure And Formation Method Of Chip Package With Shielding Structure
App 20200075503 - CHUANG; Po-Yao ; et al. | 2020-03-05 |
Chip Package Structure And Method For Forming The Same
App 20200075350 - TSAI; Po-Hao ; et al. | 2020-03-05 |
Semiconductor Device And Method Of Manufacture
App 20200058606 - Tsai; Po-Hao ; et al. | 2020-02-20 |
Multi-die structure and method for forming same
Grant 10,553,569 - Yu , et al. Fe | 2020-02-04 |
Heterogeneous Fan-out Structure And Method Of Manufacture
App 20200035590 - Tsai; Po-Hao ; et al. | 2020-01-30 |
InFO-POP structures with TIVs Having Cavities
App 20200035608A1 - | 2020-01-30 |
Backside redistribution layer (RDL) structure
Grant 10,541,213 - Tsai , et al. Ja | 2020-01-21 |
Semiconductor device and method of manufacturing the same
Grant 10,535,591 - Lin , et al. Ja | 2020-01-14 |
Package and manufacturing method thereof
Grant 10,535,614 - Tsai Ja | 2020-01-14 |
Printing module, printing method and system of forming a printed structure
Grant 10,535,627 - Lin , et al. Ja | 2020-01-14 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,529,673 - Tsai , et al. J | 2020-01-07 |
Fan-out Package with Controllable Standoff
App 20200006214 - Tsai; Po-Hao ; et al. | 2020-01-02 |
Chip Package Structure With Molding Layer And Method For Forming The Same
App 20200006176 - TSAI; Po-Hao ; et al. | 2020-01-02 |
Fan-Out Package with Cavity Substrate
App 20200006307 - Tsai; Po-Hao ; et al. | 2020-01-02 |
Method for a stacked and bonded semiconductor device
Grant 10,522,496 - Cheng , et al. Dec | 2019-12-31 |
Package structure, integrated fan-out package and method of fabricating the same
Grant 10,522,476 - Cheng , et al. Dec | 2019-12-31 |
Interconnect structure for package-on-package devices
Grant 10,515,875 - Hung , et al. Dec | 2019-12-24 |
Method for forming chip package with recessed interposer substrate
Grant 10,515,827 - Jeng , et al. Dec | 2019-12-24 |
Semiconductor device and method of manufacture
Grant 10,515,937 - Lin , et al. Dec | 2019-12-24 |
Method for forming semiconductor package structure with twinned copper layer
Grant 10,515,923 - Chang , et al. Dec | 2019-12-24 |
Method for forming chip package structure
Grant 10,515,904 - Lin , et al. Dec | 2019-12-24 |
InFO-POP structures with TIVs having cavities
Grant 10,515,901 - Lin , et al. Dec | 2019-12-24 |
Semiconductor Device and Method of Manufacture
App 20190355680 - Chuang; Po-Yao ; et al. | 2019-11-21 |
Semiconductor Device and Method of Manufacture
App 20190348370 - Lin; Jing-Cheng ; et al. | 2019-11-14 |
Heterogeneous fan-out structure and method of manufacture
Grant 10,468,339 - Tsai , et al. No | 2019-11-05 |
Package And Manufacturing Method Thereof
App 20190333867 - Tsai; Po-Hao | 2019-10-31 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20190319002 - Hsu; Chia-Kuei ; et al. | 2019-10-17 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20190252296 - Hung; Jui-Pin ; et al. | 2019-08-15 |
Heterogeneous Fan-Out Structure and Method of Manufacture
App 20190229046 - Tsai; Po-Hao ; et al. | 2019-07-25 |
Semiconductor device and method of manufacture
Grant 10,361,161 - Lin , et al. | 2019-07-23 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,354,982 - Tsai , et al. July 16, 2 | 2019-07-16 |
Semiconductor Device and Method of Manufacture
App 20190189594 - Lin; Jing-Cheng ; et al. | 2019-06-20 |
Method Of Forming Package Structure
App 20190172818 - LIN; Jing-Cheng ; et al. | 2019-06-06 |
PoP device and method of forming the same
Grant 10,290,610 - Huang , et al. | 2019-05-14 |
Package With Fan-out Structures
App 20190131241 - JENG; Shin-Puu ; et al. | 2019-05-02 |
Package Structure And Manufacturing Method Thereof
App 20190131283 - Chen; Wei-Yu ; et al. | 2019-05-02 |
Chip Package With Interposer Substrate And Method For Forming The Same
App 20190131284 - JENG; Shin-Puu ; et al. | 2019-05-02 |
Package and manufacturing method thereof
Grant 10,276,511 - Tsai | 2019-04-30 |
Printing Module, Printing Method And System Of Forming A Printed Structure
App 20190123015 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Release Film as Isolation Film in Package
App 20190122901 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Interconnect structure for package-on-package devices
Grant 10,269,685 - Hung , et al. | 2019-04-23 |
Package on package (PoP) bonding structures
Grant 10,269,778 - Lin , et al. | 2019-04-23 |
Integrated circuit packages and methods of forming same
Grant 10,269,587 - Lin , et al. | 2019-04-23 |
Semiconductor Packages and Methods of Forming the Same
App 20190115327 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Method For Forming Chip Package Structure
App 20190115306 - LIN; Jing-Cheng ; et al. | 2019-04-18 |
Integrated Circuit Packages and Methods of Forming Same
App 20190109020 - Lin; Jing-Cheng ; et al. | 2019-04-11 |
InFO-POP structures with TIVs Having Cavities
App 20190103362 - Lin; Jing-Cheng ; et al. | 2019-04-04 |
Semiconductor Device and Method
App 20190096796 - Lin; Jing-Cheng ; et al. | 2019-03-28 |
Pop Device And Method Of Forming The Same
App 20190067249 - Huang; Li-Hsien ; et al. | 2019-02-28 |
Semiconductor Device And Method Of Manufacturing The Same
App 20190051589 - LIN; JING-CHENG ; et al. | 2019-02-14 |
Chip Package Structure
App 20190051635 - YU; Chen-Hua ; et al. | 2019-02-14 |
Package structure and method of forming thereof
Grant 10,204,889 - Lin , et al. Feb | 2019-02-12 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190043849 - Cheng; Li-Hui ; et al. | 2019-02-07 |
Semiconductor Package
App 20190035738 - LIN; JING-CHENG ; et al. | 2019-01-31 |
Package Structure, Integrated Fan-out Package And Method Of Fabricating The Same
App 20190027446 - Cheng; Li-Hui ; et al. | 2019-01-24 |
Release Film as Isolation Film in Package
App 20190006200 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Integrated Circuit Packages and Methods of Forming Same
App 20190006194 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Release film as isolation film in package
Grant 10,170,341 - Lin , et al. J | 2019-01-01 |
Semiconductor device method of manufacture
Grant 10,170,451 - Lin , et al. J | 2019-01-01 |
Chip package structure including redistribution structure and conductive shielding film
Grant 10,163,813 - Lin , et al. Dec | 2018-12-25 |
Semiconductor packages and methods of forming the same
Grant 10,163,872 - Yu , et al. Dec | 2018-12-25 |
Semiconductor package
Grant 10,163,848 - Lin , et al. Dec | 2018-12-25 |
Method for forming chip package structure with adhesive layer
Grant 10,163,875 - Cheng , et al. Dec | 2018-12-25 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20180366439 - Lin; Jing-Cheng ; et al. | 2018-12-20 |
Integrated fan-out packages and methods of forming the same
Grant 10,157,888 - Lin , et al. Dec | 2018-12-18 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20180350756 - Tsai; Po-Hao ; et al. | 2018-12-06 |
Semiconductor Package Structure With Conductive Line And Method For Forming The Same
App 20180350765 - CHANG; Jung-Hua ; et al. | 2018-12-06 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20180350770 - Tsai; Po-Hao ; et al. | 2018-12-06 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20180342466 - LIN; JING-CHENG ; et al. | 2018-11-29 |
Semiconductor device and method
Grant 10,141,253 - Lin , et al. Nov | 2018-11-27 |
Semiconductor package and manufacturing method thereof
Grant 10,134,719 - Cheng , et al. November 20, 2 | 2018-11-20 |
Mechanisms for forming package structure
Grant 10,128,226 - Lin , et al. November 13, 2 | 2018-11-13 |
Semicondcutor Package
App 20180315733 - Lin; Jing-Cheng ; et al. | 2018-11-01 |
Packaged semiconductor device and method of fabricating a packaged semiconductor device
Grant 10,115,675 - Lin , et al. October 30, 2 | 2018-10-30 |
Method For Forming Chip Package Structure With Adhesive Layer
App 20180308825 - CHENG; Li-Hui ; et al. | 2018-10-25 |
Semiconductor Device and Method of Manufacture
App 20180308828 - Lin; Jing-Cheng ; et al. | 2018-10-25 |
Packaged semiconductor devices and packaging devices and methods
Grant 10,109,573 - Lin , et al. October 23, 2 | 2018-10-23 |
Chip package structure and method for forming the same
Grant 10,103,125 - Yu , et al. October 16, 2 | 2018-10-16 |
Semiconductor device and method of manufactures
Grant 10,103,132 - Lin , et al. October 16, 2 | 2018-10-16 |
Package Structure And Method Of Forming Thereof
App 20180286793 - CHENG; Li-Hui ; et al. | 2018-10-04 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20180286839 - Tsai; Po-Hao ; et al. | 2018-10-04 |
Semiconductor package
Grant 10,090,253 - Lin , et al. October 2, 2 | 2018-10-02 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,083,946 - Tsai , et al. September 25, 2 | 2018-09-25 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,062,662 - Tsai , et al. August 28, 2 | 2018-08-28 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,049,989 - Tsai , et al. August 14, 2 | 2018-08-14 |
Backside Redistribution Layer (RDL) Structure
App 20180218985 - Tsai; Po-Hao ; et al. | 2018-08-02 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20180211901 - Hung; Jui-Pin ; et al. | 2018-07-26 |
Semiconductor device and method of manufacture
Grant 10,008,485 - Lin , et al. June 26, 2 | 2018-06-26 |
Package Structure And Method Of Forming Thereof
App 20180151546 - LIN; Jing-Cheng ; et al. | 2018-05-31 |
Chip Package Structure And Method For Forming The Same
App 20180151540 - YU; Chen-Hua ; et al. | 2018-05-31 |
Semiconductor Device and Method
App 20180138116 - Lin; Jing-Cheng ; et al. | 2018-05-17 |
Chip Package Structure And Method For Forming The Same
App 20180138130 - LIN; Jing-Cheng ; et al. | 2018-05-17 |
Pillar design for conductive bump
Grant 9,953,948 - Hsieh , et al. April 24, 2 | 2018-04-24 |
Through package via (TPV)
Grant 9,953,949 - Lin , et al. April 24, 2 | 2018-04-24 |
Integrated fan-out package structures with recesses in molding compound
Grant 9,953,955 - Tsai , et al. April 24, 2 | 2018-04-24 |
Semiconductor Device and Method of Manufacture
App 20180102345 - Lin; Jing-Cheng ; et al. | 2018-04-12 |
Chip package structure with adhesive layer
Grant 9,929,128 - Cheng , et al. March 27, 2 | 2018-03-27 |
Backside redistribution layer (RDL) structure
Grant 9,929,108 - Tsai , et al. March 27, 2 | 2018-03-27 |
Semiconductor Package
App 20180082954 - LIN; JING-CHENG ; et al. | 2018-03-22 |
Interconnect structure for package-on-package devices and a method of fabricating
Grant 9,922,903 - Hung , et al. March 20, 2 | 2018-03-20 |
Semiconductor Devices, Methods of Manufacture Thereof, and Semiconductor Device Packages
App 20180012830 - Chen; I-Ting ; et al. | 2018-01-11 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180006005 - Cheng; Li-Hui ; et al. | 2018-01-04 |
Multi-Die Structure and Method for Forming Same
App 20170373048 - Yu; Chen-Hua ; et al. | 2017-12-28 |
Packaged Semiconductor Device And Method Of Fabricating A Packaged Semiconductor Device
App 20170373016 - Lin; Jing-Cheng ; et al. | 2017-12-28 |
Semiconductor device and method of manufacture
Grant 9,842,826 - Lin , et al. December 12, 2 | 2017-12-12 |
Semiconductor Device and Method of Manufacture
App 20170338185 - Lin; Jing-Cheng ; et al. | 2017-11-23 |
Packaged Semiconductor Devices and Packaging Devices and Methods
App 20170338177 - Lin; Jing-Cheng ; et al. | 2017-11-23 |
Semiconductor package manufacturing method
Grant 9,818,697 - Lin , et al. November 14, 2 | 2017-11-14 |
Integrated fan-out structure with openings in buffer layer
Grant 9,799,581 - Chiu , et al. October 24, 2 | 2017-10-24 |
Mechanisms For Forming Package Structure
App 20170301663 - LIN; Jing-Cheng ; et al. | 2017-10-19 |
Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
Grant 9,773,724 - Chen , et al. September 26, 2 | 2017-09-26 |
Package on Package (PoP) Bonding Structures
App 20170271311 - Lin; Jing-Cheng ; et al. | 2017-09-21 |
Multi-die structure and method of forming same
Grant 9,761,566 - Yu , et al. September 12, 2 | 2017-09-12 |
Method Of Controlling Bump Height Variation
App 20170229422 - LIN; Jing-Cheng ; et al. | 2017-08-10 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20170229433 - Tsai; Po-Hao ; et al. | 2017-08-10 |
Semiconductor Device and Method of Manufacture
App 20170229434 - Lin; Jing-Cheng ; et al. | 2017-08-10 |
Semiconductor Device and Method
App 20170229414 - Cheng; Li-Hui ; et al. | 2017-08-10 |
Packaged semiconductor devices and packaging devices and methods
Grant 9,728,496 - Lin , et al. August 8, 2 | 2017-08-08 |
Semiconductor device and method of manufacture
Grant 9,728,508 - Lin , et al. August 8, 2 | 2017-08-08 |
Mechanisms for forming package structure
Grant 9,698,135 - Lin , et al. July 4, 2 | 2017-07-04 |
Semiconductor Device and Method of Manufactures
App 20170162551 - Lin; Jing-Cheng ; et al. | 2017-06-08 |
Package on package (PoP) bonding structures
Grant 9,673,181 - Lin , et al. June 6, 2 | 2017-06-06 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20170154858 - Tsai; Po-Hao ; et al. | 2017-06-01 |
Semiconductor device and method
Grant 9,646,918 - Cheng , et al. May 9, 2 | 2017-05-09 |
Mechanisms for controlling bump height variation
Grant 9,646,942 - Lin , et al. May 9, 2 | 2017-05-09 |
Semiconductor Packages And Methods Of Forming The Same
App 20170117261 - Yu; Chen-Hua ; et al. | 2017-04-27 |
Semicondutor device and method of manufacture
Grant 9,633,934 - Lin , et al. April 25, 2 | 2017-04-25 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,633,895 - Tsai , et al. April 25, 2 | 2017-04-25 |
Semiconductor Device and Method of Manufacture
App 20170084543 - Lin; Jing-Cheng ; et al. | 2017-03-23 |
Backside Redistribution Layer (RDL) Structure
App 20170084550 - Tsai; Po-Hao ; et al. | 2017-03-23 |
Pillar Design for Conductive Bump
App 20170084571 - Hsieh; Cheng-Chieh ; et al. | 2017-03-23 |
Semiconductor device and method of manufactures
Grant 9,583,420 - Lin , et al. February 28, 2 | 2017-02-28 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 9,570,401 - Tsai , et al. February 14, 2 | 2017-02-14 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20170040288 - Tsai; Po-Hao ; et al. | 2017-02-09 |
Through Package Via (TPV)
App 20170040283 - Lin; Jing-Cheng ; et al. | 2017-02-09 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20170025397 - Hung; Jui-Pin ; et al. | 2017-01-26 |
Backside redistribution layer (RDL) structure
Grant 9,553,059 - Tsai , et al. January 24, 2 | 2017-01-24 |
Semiconductor Device and Method of Manufacture
App 20170018531 - Lin; Jing-Cheng ; et al. | 2017-01-19 |
Integrated Fan-Out Structure with Openings in Buffer Layer
App 20170012024 - Chiu; Wu Sen ; et al. | 2017-01-12 |
Semiconductor packages and methods of forming the same
Grant 9,543,170 - Yu , et al. January 10, 2 | 2017-01-10 |
Packaging structures and methods with a metal pillar
Grant 9,508,666 - Yu , et al. November 29, 2 | 2016-11-29 |
Pillar design for conductive bump
Grant 9,496,235 - Hsieh , et al. November 15, 2 | 2016-11-15 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20160329307 - Tsai; Po-Hao ; et al. | 2016-11-10 |
Semiconductor Package Manufacturing Method
App 20160315051 - LIN; JING-CHENG ; et al. | 2016-10-27 |
Through package via (TPV)
Grant 9,478,498 - Lin , et al. October 25, 2 | 2016-10-25 |
Interconnect structure for package-on-package devices and a method of fabricating
Grant 9,460,987 - Hung , et al. October 4, 2 | 2016-10-04 |
Package on Package (PoP) Bonding Structures
App 20160284677 - Lin; Jing-Cheng ; et al. | 2016-09-29 |
Integrated fan-out structure with openings in buffer layer
Grant 9,455,211 - Chiu , et al. September 27, 2 | 2016-09-27 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20160276278 - Tsai; Po-Hao ; et al. | 2016-09-22 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 9,425,121 - Tsai , et al. August 23, 2 | 2016-08-23 |
Semiconductor package and manufacturing method thereof
Grant 9,406,588 - Lin , et al. August 2, 2 | 2016-08-02 |
Semiconductor Device and Method of Manufactures
App 20160218049 - Lin; Jing-Cheng ; et al. | 2016-07-28 |
Package on package (PoP) bonding structures
Grant 9,368,438 - Lin , et al. June 14, 2 | 2016-06-14 |
Bump structures for semiconductor package
Grant 9,355,977 - Lin , et al. May 31, 2 | 2016-05-31 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 9,355,973 - Tsai , et al. May 31, 2 | 2016-05-31 |
Semicondutor Device and Method of Manufacture
App 20160148857 - Lin; Jing-Cheng ; et al. | 2016-05-26 |
Self-aligning conductive bump structure and method of fabrication
Grant 9,349,701 - Huang , et al. May 24, 2 | 2016-05-24 |
Mechanisms For Forming Package Structure
App 20160118372 - Lin; Jing-Cheng ; et al. | 2016-04-28 |
Method of forming a plurality of bumps on a substrate and method of forming a chip package
Grant 9,318,455 - Lin , et al. April 19, 2 | 2016-04-19 |
Semiconductor Packages And Methods Of Forming The Same
App 20160056057 - Yu; Chen-Hua ; et al. | 2016-02-25 |
Semiconductor Device and Method
App 20160049363 - Cheng; Li-Hui ; et al. | 2016-02-18 |
Mechanisms for forming package structure
Grant 9,252,065 - Lin , et al. February 2, 2 | 2016-02-02 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20160013150 - Tsai; Po-Hao ; et al. | 2016-01-14 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20150380340 - Cheng; Li-Hui ; et al. | 2015-12-31 |
Structure design for 3DIC testing
Grant 9,219,016 - Lin , et al. December 22, 2 | 2015-12-22 |
Packaged Semiconductor Devices and Packaging Devices and Methods
App 20150357278 - Lin; Jing-Cheng ; et al. | 2015-12-10 |
Semiconductor device and manufacturing method thereof
Grant 9,159,678 - Cheng , et al. October 13, 2 | 2015-10-13 |
Integrated fan-out package structures with recesses in molding compound
Grant 9,142,432 - Tsai , et al. September 22, 2 | 2015-09-22 |
Interconnect Structure for Package-on-Package Devices
App 20150255447 - Hung; Jui-Pin ; et al. | 2015-09-10 |
Packaged semiconductor devices and packaging devices and methods
Grant 9,111,821 - Lin , et al. August 18, 2 | 2015-08-18 |
Fan out package, semiconductor device and manufacturing method thereof
Grant 9,111,914 - Lin , et al. August 18, 2 | 2015-08-18 |
Self-aligning Conductive Bump Structure And Method Of Fabrication
App 20150228604 - HUANG; Cheng-Lin ; et al. | 2015-08-13 |
Copper bump structures having sidewall protection layers
Grant 9,093,314 - Lin , et al. July 28, 2 | 2015-07-28 |
Backside Redistribution Layer (RDL) Structure
App 20150179591 - Tsai; Po-Hao ; et al. | 2015-06-25 |
Bump Structures for Semiconductor Package
App 20150171038 - Lin; Jing-Cheng ; et al. | 2015-06-18 |
Method of fabricating interconnect structure for package-on-package devices
Grant 9,048,222 - Hung , et al. June 2, 2 | 2015-06-02 |
Mechanisms For Forming Package Structure
App 20150145142 - LIN; Jing-Cheng ; et al. | 2015-05-28 |
Semiconductor Device And Manufacturing Method Thereof
App 20150137351 - CHENG; LI-HUI ; et al. | 2015-05-21 |
Semiconductor Package And Manufacturing Method Thereof
App 20150130070 - LIN; JING-CHENG ; et al. | 2015-05-14 |
Self-aligning conductive bump structure and method of making the same
Grant 9,024,438 - Huang , et al. May 5, 2 | 2015-05-05 |
Copper Bump Structures Having Sidewall Protection Layers
App 20150111342 - Lin; Jing-Cheng ; et al. | 2015-04-23 |
Integrated Fan-Out Structure with Openings in Buffer Layer
App 20150102502 - Chiu; Wu Sen ; et al. | 2015-04-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20150102503 - LIN; JING-CHENG ; et al. | 2015-04-16 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20150076713 - Tsai; Po-Hao ; et al. | 2015-03-19 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20150069623 - Tsai; Po-Hao ; et al. | 2015-03-12 |
Bump structures for semiconductor package
Grant 8,970,035 - Lin , et al. March 3, 2 | 2015-03-03 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20150050779 - Tsai; Po-Hao ; et al. | 2015-02-19 |
Semiconductor device and manufacturing method thereof
Grant 8,952,544 - Lin , et al. February 10, 2 | 2015-02-10 |
Surface metal wiring structure for an IC substrate
Grant 8,953,336 - Kao , et al. February 10, 2 | 2015-02-10 |
Through Package Via (TPV)
App 20150035146 - Lin; Jing-Cheng ; et al. | 2015-02-05 |
Semiconductor device and manufacturing method thereof
Grant 8,941,244 - Tsai , et al. January 27, 2 | 2015-01-27 |
Semiconductor Device And Manufacturing Method Thereof
App 20150008586 - TSAI; PO-HAO ; et al. | 2015-01-08 |
Semiconductor Device And Manufacturing Method Thereof
App 20150008587 - LIN; JING-CHENG ; et al. | 2015-01-08 |
Copper bump structures having sidewall protection layers
Grant 08922004 - | 2014-12-30 |
Copper bump structures having sidewall protection layers
Grant 8,922,004 - Lin , et al. December 30, 2 | 2014-12-30 |
Pillar Design for Conductive Bump
App 20140361432 - Hsieh; Cheng-Chieh ; et al. | 2014-12-11 |
Connector design for packaging integrated circuits
Grant 8,901,735 - Yu , et al. December 2, 2 | 2014-12-02 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 8,877,554 - Tsai , et al. November 4, 2 | 2014-11-04 |
Packaged Semiconductor Devices and Packaging Devices and Methods
App 20140319683 - Lin; Jing-Cheng ; et al. | 2014-10-30 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20140264839 - Tsai; Po-Hao ; et al. | 2014-09-18 |
Interconnect Structure for Package-on-Package Devices
App 20140252646 - Hung; Jui-Pin ; et al. | 2014-09-11 |
Semiconductor Devices, Methods of Manufacture Thereof, and Semiconductor Device Packages
App 20140210074 - Chen; I-Ting ; et al. | 2014-07-31 |
Packaged semiconductor devices and packaging devices and methods
Grant 8,778,738 - Lin , et al. July 15, 2 | 2014-07-15 |
Package on Package (PoP) Bonding Structures
App 20140183731 - Lin; Jing-Cheng ; et al. | 2014-07-03 |
Connector Design for Packaging Integrated Circuits
App 20140131864 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Method Of Forming A Plurality Of Bumps On A Substrate And Method Of Forming A Chip Package
App 20140127863 - LIN; Jing-Cheng ; et al. | 2014-05-08 |
Bump Structures for Semiconductor Package
App 20140061897 - Lin; Jing-Cheng ; et al. | 2014-03-06 |
Connector design for packaging integrated circuits
Grant 8,664,760 - Yu , et al. March 4, 2 | 2014-03-04 |
Planarized bumps for underfill control
Grant 8,653,658 - Lin , et al. February 18, 2 | 2014-02-18 |
Packaging Structures and Methods with a Metal Pillar
App 20140038405 - Yu; Chen-Hua ; et al. | 2014-02-06 |
3D IC packaging structures and methods with a metal pillar
Grant 8,610,285 - Yu , et al. December 17, 2 | 2013-12-17 |
Surface Metal Wiring Structure For An Ic Substrate
App 20130233601 - KAO; Chin-Fu ; et al. | 2013-09-12 |
Mechanisms For Controlling Bump Height Variation
App 20130223014 - LIN; Jing-Cheng ; et al. | 2013-08-29 |
TSVs with different sizes in interposers for bonding dies
Grant 8,455,995 - Tsai , et al. June 4, 2 | 2013-06-04 |
Planarized Bumps For Underfill Control
App 20130134581 - LIN; Jing-Cheng ; et al. | 2013-05-30 |
Structure Design for 3DIC Testing
App 20130077272 - Lin; Jing-Cheng ; et al. | 2013-03-28 |
Self-aligning Conductive Bump Structure And Method Of Making The Same
App 20130026620 - HUANG; Cheng-Lin ; et al. | 2013-01-31 |
Pillar Design for Conductive Bump
App 20130020698 - Hsieh; Cheng-Chieh ; et al. | 2013-01-24 |
Packaging Structures and Methods
App 20120306080 - Yu; Chen-Hua ; et al. | 2012-12-06 |
Copper Bump Structures Having Sidewall Protection Layers
App 20110304042 - Lin; Jing-Cheng ; et al. | 2011-12-15 |
TSVs with Different Sizes in Interposers for Bonding Dies
App 20110254160 - Tsai; Po-Hao ; et al. | 2011-10-20 |
Thin Film Transistor (TFT) and Method for Fabricating the Same
App 20070243670 - Chen; Chi-Lin ; et al. | 2007-10-18 |
Fabrication method for microstructures with high aspect ratios
Grant 7,125,795 - Kuo , et al. October 24, 2 | 2006-10-24 |
Method of enhancing laser crystallization for polycrystalline silicon fabrication
App 20060088986 - Lin; Jia-Xing ; et al. | 2006-04-27 |
Fabrication method for microstructures with high aspect ratios
App 20050064650 - Kuo, Nai-Hao ; et al. | 2005-03-24 |
Test structure and method of step coverage for optical waveguide production
Grant 6,804,443 - Tsai , et al. October 12, 2 | 2004-10-12 |
Method for forming amorphous silicon film on single crystal silicon and structure formed
Grant 6,737,307 - Tsai , et al. May 18, 2 | 2004-05-18 |
Test structure and method of step coverage for optical waveguide production
App 20040081417 - Tsai, Po-Hao ; et al. | 2004-04-29 |
Fabrication method for microstructures with high aspect ratios
App 20040018720 - Kuo, Nai-Hao ; et al. | 2004-01-29 |
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