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Interconnect Structures And Manufacturing Method Thereof
App 20220293503 - HUANG; Chun-Hsien ; et al. | 2022-09-15 |
Contact Structure For Semiconductor Device And Method
App 20220278199 - Tsai; Yan-Ming ; et al. | 2022-09-01 |
Contact with a silicide region
Grant 11,411,094 - Cheng , et al. August 9, 2 | 2022-08-09 |
Phase control in contact formation
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Semiconductor device pre-cleaning
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Interconnect Structure of Semiconductor Device
App 20220165616 - Liu; Yao-Min ; et al. | 2022-05-26 |
Contact structure for semiconductor device and method
Grant 11,335,774 - Tsai , et al. May 17, 2 | 2022-05-17 |
Ammonium Fluoride Pre-clean Protection
App 20220149519 - CHU; Li-Wei ; et al. | 2022-05-12 |
Interconnect Structure Of Semiconductor Device
App 20220084937 - Liu; Yao-Min ; et al. | 2022-03-17 |
Metal Adhesion Layer To Promote Metal Plug Adhesion
App 20220084879 - WU; Pei-Wen ; et al. | 2022-03-17 |
Semiconductor Device Pre-cleaning
App 20220068712 - CHU; Li-Wei ; et al. | 2022-03-03 |
Ammonium fluoride pre-clean protection
Grant 11,232,947 - Chu , et al. January 25, 2 | 2022-01-25 |
Formation method of semiconductor device structure with metal-semiconductor compound region
Grant 11,222,818 - Chao , et al. January 11, 2 | 2022-01-11 |
Method for forming semiconductor contact structure
Grant 11,195,791 - Cheng , et al. December 7, 2 | 2021-12-07 |
Contact Conductive Feature Formation and Structure
App 20210343590 - Chang; Ken-Yu ; et al. | 2021-11-04 |
Chemical Direct Pattern Plating Method
App 20210272910 - LIU; Wen-Jiun ; et al. | 2021-09-02 |
Conductive Feature Formation and Structure
App 20210225701 - Wang; Yu Shih ; et al. | 2021-07-22 |
Contact conductive feature formation and structure
Grant 11,062,941 - Chang , et al. July 13, 2 | 2021-07-13 |
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
App 20210193517 - Chen; Pin-Wen ; et al. | 2021-06-24 |
Chemical direct pattern plating method
Grant 10,998,269 - Liu , et al. May 4, 2 | 2021-05-04 |
Contact Structure For Semiconductor Device And Method
App 20210118994 - Tsai; Yan-Ming ; et al. | 2021-04-22 |
Conductive feature formation and structure
Grant 10,971,396 - Wang , et al. April 6, 2 | 2021-04-06 |
Conductive feature formation and structure using bottom-up filling deposition
Grant 10,943,823 - Chen , et al. March 9, 2 | 2021-03-09 |
Semiconductor device and method
Grant 10,867,845 - Wang , et al. December 15, 2 | 2020-12-15 |
Chemical Direct Pattern Plating Method
App 20200388575 - Liu; Wen-Jiun ; et al. | 2020-12-10 |
Phase Control in Contact Formation
App 20200343135 - Huang; Chun-Hsien ; et al. | 2020-10-29 |
Contact Conductive Feature Formation and Structure
App 20200203222 - Chang; Ken-Yu ; et al. | 2020-06-25 |
Chemical direct pattern plating method
Grant 10,692,814 - Liu , et al. | 2020-06-23 |
Method of Forming a Contact with a Silicide Region
App 20200152763 - Cheng; Yu-Wen ; et al. | 2020-05-14 |
Method For Forming Semiconductor Contact Structure
App 20200111739 - CHENG; Yu-Wen ; et al. | 2020-04-09 |
Contact conductive feature formation and structure
Grant 10,580,693 - Chang , et al. | 2020-03-03 |
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
App 20200051858 - Chen; Pin-Wen ; et al. | 2020-02-13 |
Semiconductor Device and Method
App 20200043781 - Wang; Yu-Sheng ; et al. | 2020-02-06 |
Formation Method Of Semiconductor Device Structure With Metal-semiconductor Compound Region
App 20200020583 - CHAO; Yi-Hsiang ; et al. | 2020-01-16 |
Contact Conductive Feature Formation and Structure
App 20200020578 - Chang; Ken-Yu ; et al. | 2020-01-16 |
Method of forming a contact with a silicide region
Grant 10,535,748 - Cheng , et al. Ja | 2020-01-14 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 10,515,788 - Pan , et al. Dec | 2019-12-24 |
Contact structure and the method of forming the same
Grant 10,504,834 - Cheng , et al. Dec | 2019-12-10 |
Semiconductor device and method
Grant 10,497,615 - Wang , et al. De | 2019-12-03 |
Conductive feature formation and structure using bottom-up filling deposition
Grant 10,475,702 - Chen , et al. Nov | 2019-11-12 |
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
App 20190287851 - CHEN; Pin-Wen ; et al. | 2019-09-19 |
Contact Structure And The Method Of Forming The Same
App 20190273042 - Cheng; Yu-Wen ; et al. | 2019-09-05 |
Conformal Metal Diffusion Barrier And Plasma Treatment For Oxidized Metal Barrier
App 20190273147 - CHENG; Yu-Wen ; et al. | 2019-09-05 |
Conductive feature formation and structure
Grant 10,361,120 - Wang , et al. | 2019-07-23 |
Conductive Feature Formation And Structure
App 20190164823 - WANG; Yu Shih ; et al. | 2019-05-30 |
Conductive Feature Formation and Structure
App 20190164824 - Wang; Yu Shih ; et al. | 2019-05-30 |
Pre-deposition treatment and atomic layer deposition (ALD) process and structures formed thereby
Grant 10,297,453 - Tsai , et al. | 2019-05-21 |
Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
Grant 10,262,944 - Lin , et al. | 2019-04-16 |
Semiconductor Device and Method
App 20190109043 - Wang; Yu-Sheng ; et al. | 2019-04-11 |
Semiconductor structure
Grant 10,170,417 - Wu , et al. J | 2019-01-01 |
Method of forming self-alignment contact
Grant 10,163,719 - Liu , et al. Dec | 2018-12-25 |
Semiconductor device and method
Grant 10,157,785 - Wang , et al. Dec | 2018-12-18 |
Semiconductor Device and Method
App 20180315647 - Wang; Yu-Sheng ; et al. | 2018-11-01 |
System For Pre-deposition Treatment Of A Work-function Metal Layer
App 20180261459 - TSAI; Cheng-Yen ; et al. | 2018-09-13 |
Semiconductor device structure and method for forming the same
Grant 10,050,116 - Liu , et al. August 14, 2 | 2018-08-14 |
Pre-Deposition Treatment and Atomic Layer Deposition (ALD) Process and Structures Formed Thereby
App 20180218912 - Tsai; Cheng-Yen ; et al. | 2018-08-02 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20180158658 - Pan; Shing-Chyang ; et al. | 2018-06-07 |
Methods for pre-deposition treatment of a work-function metal layer
Grant 9,978,601 - Tsai , et al. May 22, 2 | 2018-05-22 |
Semiconductor device
Grant 9,978,681 - Su , et al. May 22, 2 | 2018-05-22 |
Method of making a silicide beneath a vertical structure
Grant 9,966,448 - Lin , et al. May 8, 2 | 2018-05-08 |
Mechanisms of forming damascene interconnect structures
Grant 9,953,868 - Chen , et al. April 24, 2 | 2018-04-24 |
Pre-deposition treatment and atomic layer deposition (ALD) process and structures formed thereby
Grant 9,947,540 - Tsai , et al. April 17, 2 | 2018-04-17 |
Semiconductor Structure
App 20180090431 - WU; Chung-Chiang ; et al. | 2018-03-29 |
Semiconductor Device Structure and Method for Forming the Same
App 20180040705 - Liu; Hsiao-Ping ; et al. | 2018-02-08 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 9,887,072 - Pan , et al. February 6, 2 | 2018-02-06 |
Semiconductor structure and methods of forming the same
Grant 9,824,969 - Wu , et al. November 21, 2 | 2017-11-21 |
Semiconductor Structure And Methods Of Forming The Same
App 20170330829 - WU; Chung-Chiang ; et al. | 2017-11-16 |
Semiconductor device structure and method for forming the same
Grant 9,818,834 - Liu , et al. November 14, 2 | 2017-11-14 |
Vertical structure having an etch stop over portion of the source
Grant 9,805,968 - Lin , et al. October 31, 2 | 2017-10-31 |
Semiconductor Device Structure And Method For Forming The Same
App 20170200800 - LIU; Hsiao-Ping ; et al. | 2017-07-13 |
Method of Forming Self-Alignment Contact
App 20170170292 - Liu; Hsiao-Ping ; et al. | 2017-06-15 |
Vertical Structure and Method of Forming Semiconductor Device
App 20170154807 - Lin; Cheng-Tung ; et al. | 2017-06-01 |
Chemical Direct Pattern Plating Method
App 20170133324 - LIU; Wen-Jiun ; et al. | 2017-05-11 |
Atomic Layer Deposition Methods And Structures Thereof
App 20170110324 - TSAI; Cheng-Yen ; et al. | 2017-04-20 |
Semiconductor Device Having Interconnect Layer That Includes Dielectric Segments Interleaved With Metal Components
App 20170084485 - Lin; Chun-Chieh ; et al. | 2017-03-23 |
Method of forming pattern for semiconductor device
Grant 9,601,344 - Lee , et al. March 21, 2 | 2017-03-21 |
Vertical structure and method of forming semiconductor device
Grant 9,577,093 - Lin , et al. February 21, 2 | 2017-02-21 |
Pre-deposition Treatment And Atomic Layer Deposition (ald) Process And Structures Formed Thereby
App 20170032972 - Tsai; Cheng-Yen ; et al. | 2017-02-02 |
Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
Grant 9,520,362 - Lin , et al. December 13, 2 | 2016-12-13 |
Method for line stress reduction through dummy shoulder structures
Grant 9,437,485 - Kuo , et al. September 6, 2 | 2016-09-06 |
Interconnect structure and method of forming the same
Grant 9,397,047 - Chen , et al. July 19, 2 | 2016-07-19 |
Mechanisms Of Forming Damascene Interconnect Structures
App 20160133514 - Chen; Chien-An ; et al. | 2016-05-12 |
Mechanisms of forming damascene interconnect structures
Grant 9,269,612 - Chen , et al. February 23, 2 | 2016-02-23 |
Vertical Structure And Method Of Forming Semiconductor Device
App 20160027917 - LIN; CHENG-TUNG ; et al. | 2016-01-28 |
Interconnect Structure and Method of Forming the Same
App 20150371955 - Chen; Jeng-Shiou ; et al. | 2015-12-24 |
Semiconductor Device
App 20150371943 - SU; Hung-Wen ; et al. | 2015-12-24 |
Stress-controlled formation of TiN hard mask
Grant 9,218,970 - Lin , et al. December 22, 2 | 2015-12-22 |
Vertical Structure And Method Of Forming The Same
App 20150333152 - LIN; CHENG-TUNG ; et al. | 2015-11-19 |
Vertical structure and method of forming semiconductor device
Grant 9,166,001 - Lin , et al. October 20, 2 | 2015-10-20 |
Semiconductor device and method for forming the same
Grant 9,123,781 - Su , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device Having Interconnect Layer That Includes Dielectric Segments Interleaved With Metal Components
App 20150235963 - Lin; Chun-Chieh ; et al. | 2015-08-20 |
Vertical Structure And Method Of Forming Semiconductor Device
App 20150228718 - LIN; CHENG-TUNG ; et al. | 2015-08-13 |
STRESS-CONTROLLED FORMATION OF TiN HARD MASK
App 20150187579 - LIN; Rueijer ; et al. | 2015-07-02 |
Method Of Forming Pattern For Semiconductor Device
App 20150187591 - Lee; Chia-Ying ; et al. | 2015-07-02 |
Dummy Shoulder Structure For Line Stress Reduction
App 20140208283 - Kuo; Cheng-Cheng ; et al. | 2014-07-24 |
Low resistance and reliable copper interconnects by variable doping
Grant 8,785,321 - Ko , et al. July 22, 2 | 2014-07-22 |
Mechanisms Of Forming Damascene Interconnect Structures
App 20130127055 - CHEN; Chien-An ; et al. | 2013-05-23 |
Low Resistance And Reliable Copper Interconnects By Variable Doping
App 20120021602 - Ko; Ting-Chu ; et al. | 2012-01-26 |
Low resistance and reliable copper interconnects by variable doping
Grant 8,053,892 - Ko , et al. November 8, 2 | 2011-11-08 |
Semiconductor Device And Method For Forming The Same
App 20100230816 - Su; Hung-Wen ; et al. | 2010-09-16 |
Semiconductor device and method for forming the same
Grant 7,749,896 - Su , et al. July 6, 2 | 2010-07-06 |
Interconnects with harmonized stress and methods for fabricating the same
Grant 7,638,859 - Lu , et al. December 29, 2 | 2009-12-29 |
Methods and apparatuses for electrochemical deposition
Grant 7,597,787 - Su , et al. October 6, 2 | 2009-10-06 |
Uniform current distribution for ECP loading of wafers
Grant 7,544,281 - Lin , et al. June 9, 2 | 2009-06-09 |
Method and apparatus for electroplating
Grant 7,476,306 - Su , et al. January 13, 2 | 2009-01-13 |
Method for forming dual damascene structures with tapered via portions and improved performance
Grant 7,354,856 - Yeh , et al. April 8, 2 | 2008-04-08 |
Semiconductor device and fabrication method thereof
Grant 7,312,531 - Chang , et al. December 25, 2 | 2007-12-25 |
Interconnect structures and methods for fabricating the same
App 20070287294 - Ko; Ting-Chu ; et al. | 2007-12-13 |
Method and apparatus for fabricating metal layer
App 20070181434 - Lee; Hsien-Ming ; et al. | 2007-08-09 |
Method to solve via poisoning for porous low-k dielectric
Grant 7,250,683 - Tsai , et al. July 31, 2 | 2007-07-31 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology
Grant 7,235,482 - Wu , et al. June 26, 2 | 2007-06-26 |
Method and apparatus for fabricating metal layer
Grant 7,226,860 - Lee , et al. June 5, 2 | 2007-06-05 |
Semiconductor device and fabrication method thereof
App 20070096326 - Chang; Hui-Lin ; et al. | 2007-05-03 |
Low resistance and reliable copper interconnects by variable doping
App 20070054488 - Ko; Ting-Chu ; et al. | 2007-03-08 |
Semiconductor device and method for forming the same
App 20070052096 - Su; Hung-Wen ; et al. | 2007-03-08 |
Copper interconnect structures and fabrication method thereof
App 20070048991 - Shih; Chien-Hsueh ; et al. | 2007-03-01 |
Metal interconnect features with a doping gradient
Grant 7,169,700 - Chang , et al. January 30, 2 | 2007-01-30 |
Interconnects with harmonized stress and methods for fabricating the same
App 20060276027 - Lu; Yung-Cheng ; et al. | 2006-12-07 |
Uniform current distribution for ECP loading of wafers
App 20060243596 - Lin; Ming-Wei ; et al. | 2006-11-02 |
Method for forming dual damascene structures with tapered via portions and improved performance
App 20060199379 - Yeh; Ming-Shih ; et al. | 2006-09-07 |
Methods and apparatuses for electrochemical deposition
App 20060196775 - Su; Hung-Wen ; et al. | 2006-09-07 |
Composition and process for element displacement metal passivation
App 20060189131 - Chang; Chung-Liang ; et al. | 2006-08-24 |
Method to improve palanarity of electroplated copper
App 20060189127 - Chou; Shih-Wei ; et al. | 2006-08-24 |
Method to improve planarity of electroplated copper
Grant 7,064,068 - Chou , et al. June 20, 2 | 2006-06-20 |
Low resistance and reliable copper interconnects by variable doping
Grant 7,026,244 - Ko , et al. April 11, 2 | 2006-04-11 |
Process for rendering metal corrosion-resistant in electrochemical metal deposition
App 20060054508 - Lin; Ming-Wei ; et al. | 2006-03-16 |
Metal interconnect features with a doping gradient
App 20060027460 - Chang; Chung Liang ; et al. | 2006-02-09 |
Method and apparatus for fabricating metal layer
App 20050245072 - Lee, Hsien-Ming ; et al. | 2005-11-03 |
Method and apparatus for electroplating
App 20050224359 - Su, Hung-Wen ; et al. | 2005-10-13 |
Apparatus and method for removing metal from wafer edge
App 20050211379 - Su, Hung-Wen ; et al. | 2005-09-29 |
Method to solve via poisoning for porous low-k dielectric
App 20050170648 - Tsai, Ming-Hsing ; et al. | 2005-08-04 |
Method to improve planarity of electroplated copper
App 20050164495 - Chou, Shih-Wei ; et al. | 2005-07-28 |
Loadlock
App 20050097769 - Lin, Jing-Cheng ; et al. | 2005-05-12 |
Method to solve via poisoning for porous low-k dielectric
Grant 6,878,615 - Tsai , et al. April 12, 2 | 2005-04-12 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology
App 20050054196 - Wu, Chii-Ming ; et al. | 2005-03-10 |
Low resistance and reliable copper interconnects by variable doping
App 20050029659 - Ko, Ting-Chu ; et al. | 2005-02-10 |
Method of improving surface mobility before electroplating
App 20040196697 - Ko, Ted ; et al. | 2004-10-07 |
Method for integrating an electrodeposition and electro-mechanical polishing process
Grant 6,793,797 - Chou , et al. September 21, 2 | 2004-09-21 |
Method for integrating low-K materials in semiconductor fabrication
Grant 6,759,750 - Shue , et al. July 6, 2 | 2004-07-06 |
Method for improving an electrodeposition process through use of a multi-electrode assembly
Grant 6,706,166 - Chou , et al. March 16, 2 | 2004-03-16 |
Method for integrating low-K materials in semiconductor fabrication
App 20040017009 - Shue, Shau-Lin ; et al. | 2004-01-29 |
Method for fabricating metal gates in deep sub-micron devices
Grant 6,660,577 - Chen , et al. December 9, 2 | 2003-12-09 |
Copper back-end-of-line by electropolish
Grant 6,649,513 - Tsai , et al. November 18, 2 | 2003-11-18 |
Method For Improving An Electrodeposition Process Through Use Of A Multi-electrode Assembly
App 20030205477 - Chou, Shih-Wei ; et al. | 2003-11-06 |
Method for integrating an electrodeposition and electro-mechanical polishing process
App 20030183530 - Chou, Shih-Wei ; et al. | 2003-10-02 |
Reduction of Cu line damage by two-step CMP
Grant 6,620,725 - Shue , et al. September 16, 2 | 2003-09-16 |
Method For Fabricating Metal Gates In Deep Sub-micron Devices
App 20030162342 - Chen, Sheng-Hsiung ; et al. | 2003-08-28 |
Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide etch stop layers
Grant 6,562,725 - Tsai , et al. May 13, 2 | 2003-05-13 |
Method to solve via poisoning for porous low-k dielectric
App 20030077897 - Tsai, Ming-Hsing ; et al. | 2003-04-24 |
Method of doping copper metallization
App 20030022480 - Tsai, Ming-Hsing ; et al. | 2003-01-30 |
Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide ETCH stop layers
App 20030008511 - Tsai, Ming-Hsing ; et al. | 2003-01-09 |
Selective growth of copper for advanced metallization
Grant 6,420,258 - Chen , et al. July 16, 2 | 2002-07-16 |
Method of improved copper gap fill
Grant 6,399,486 - Chen , et al. June 4, 2 | 2002-06-04 |
Gap filling by two-step plating
Grant 6,319,831 - Tsai , et al. November 20, 2 | 2001-11-20 |
Method for forming a copper damascene structure over tungsten plugs with improved adhesion, oxidation resistance, and diffusion barrier properties using nitridation of the tungsten plug
Grant 6,309,964 - Tsai , et al. October 30, 2 | 2001-10-30 |
Method for preventing seed layer oxidation for high aspect gap fill
Grant 6,303,498 - Chen , et al. October 16, 2 | 2001-10-16 |
Method of forming bumps for flip chip applications
Grant 6,300,250 - Tsai October 9, 2 | 2001-10-09 |
Fabrication process for low resistivity tungsten layer with good adhesion to insulator layers
Grant 6,274,484 - Tsai , et al. August 14, 2 | 2001-08-14 |
Method for improvement of gap filling capability of electrochemical deposition of copper
Grant 6,224,737 - Tsai , et al. May 1, 2 | 2001-05-01 |
Multi-step electrochemical copper deposition process with improved filling capability
Grant 6,140,241 - Shue , et al. October 31, 2 | 2000-10-31 |
Self aligned dual damascene process and structure with low parasitic capacitance
Grant 6,133,144 - Tsai , et al. October 17, 2 | 2000-10-17 |
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