Tsai; Hung Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Hung Chun.The latest application filed is for "interconnect structure for semiconductor devices".
- Tsai; Hung Chun - Hsin-Chu TW
- Tsai; Hung-Chun - Hsinchu TW
- TSAI; Hung-Chun - Hsinchu City TW
Trademarks
| Patent | Date |
|---|---|
| Interconnect structure for semiconductor devices Grant 9,219,036 - Chang , et al. December 22, 2 | 2015-12-22 |
| Interconnect Structure for Semiconductor Devices App 20150214159 - Chang; Hui-Lin ; et al. | 2015-07-30 |
| Interconnect structure for semiconductor devices Grant 8,999,842 - Chang , et al. April 7, 2 | 2015-04-07 |
| Interconnect Structure for Semiconductor Devices App 20150017800 - Chang; Hui-Lin ; et al. | 2015-01-15 |
| Interconnect structure for semiconductor devices Grant 8,785,324 - Chang , et al. July 22, 2 | 2014-07-22 |
| Interconnect Structure for Semiconductor Devices App 20130102148 - Chang; Hui-Lin ; et al. | 2013-04-25 |
| Interconnect structure for semiconductor devices Grant 8,330,275 - Chang , et al. December 11, 2 | 2012-12-11 |
| Interconnect structure having a silicide/germanide cap layer Grant 8,143,162 - Yu , et al. March 27, 2 | 2012-03-27 |
| Interconnect Structure for Semiconductor Devices App 20120049371 - Chang; Hui-Lin ; et al. | 2012-03-01 |
| Method of forming three-terminal solar cell array Grant 8,101,437 - Tsai , et al. January 24, 2 | 2012-01-24 |
| Color Building-integrated Photovoltaic (bipv) Module App 20110315216 - CHEN; Liang-Jyi ; et al. | 2011-12-29 |
| Color Building-integrated Photovoltaic (bipv) Module App 20110315215 - CHEN; Liang-Jyi ; et al. | 2011-12-29 |
| Multi-terminal Solar Panel App 20110308569 - TSAI; Hung-Chun ; et al. | 2011-12-22 |
| Interconnect structure for semiconductor devices Grant 8,053,356 - Chang , et al. November 8, 2 | 2011-11-08 |
| Multi-bandgap Solar Cell And Method Producing The Same App 20110155230 - Tsai; Hung-Chun ; et al. | 2011-06-30 |
| Method Of Forming Three-terminal Solar Cell Array App 20110159629 - Tsai; Hung-Chun ; et al. | 2011-06-30 |
| Interconnect Structure for Semiconductor Devices App 20110027991 - Chang; Hui-Lin ; et al. | 2011-02-03 |
| Interconnect structure for semiconductor devices Grant 7,834,458 - Chang , et al. November 16, 2 | 2010-11-16 |
| Interconnect Structure for Semiconductor Devices App 20100090343 - Chang; Hui-Lin ; et al. | 2010-04-15 |
| Interconnect structures for semiconductor devices Grant 7,655,556 - Chang , et al. February 2, 2 | 2010-02-02 |
| Method for modulating stresses of a contact etch stop layer Grant 7,629,273 - Yu , et al. December 8, 2 | 2009-12-08 |
| Interconnect Structure Having a Silicide/Germanide Cap Layer App 20090275195 - Yu; Chen-Hua ; et al. | 2009-11-05 |
| Interconnect Structures for Semiconductor Devices App 20080233745 - Chang; Hui-Lin ; et al. | 2008-09-25 |
| Method for modulating stresses of a contact etch stop layer App 20080085607 - Yu; Chen-Hua ; et al. | 2008-04-10 |
| Method of fabricating semiconductor device Grant 7,256,124 - Lin , et al. August 14, 2 | 2007-08-14 |
| Silicon oxycarbide and silicon carbonitride based materials for MOS devices Grant 7,115,974 - Wu , et al. October 3, 2 | 2006-10-03 |
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