Trademark applications and grants for Tsai Hung Chun. Tsai Hung Chun has 1 trademark applications. The latest application filed is for "RUIMA"
Patent Application | Date |
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Interconnect Structure for Semiconductor Devices 20150214159 - 14/679833 Chang; Hui-Lin ;   et al. | 2015-07-30 |
Interconnect Structure for Semiconductor Devices 20150017800 - 14/336330 Chang; Hui-Lin ;   et al. | 2015-01-15 |
Interconnect Structure for Semiconductor Devices 20130102148 - 13/710168 Chang; Hui-Lin ;   et al. | 2013-04-25 |
Interconnect Structure for Semiconductor Devices 20120049371 - 13/290811 Chang; Hui-Lin ;   et al. | 2012-03-01 |
COLOR BUILDING-INTEGRATED PHOTOVOLTAIC (BIPV) MODULE 20110315216 - 13/169868 CHEN; Liang-Jyi ;   et al. | 2011-12-29 |
Interconnect structure for semiconductor devices 9,219,036 - 14/679,833 Chang , et al. December 22, 2 | 2015-12-22 |
Interconnect structure for semiconductor devices 8,999,842 - 14/336,330 Chang , et al. April 7, 2 | 2015-04-07 |
Interconnect structure for semiconductor devices 8,785,324 - 13/710,168 Chang , et al. July 22, 2 | 2014-07-22 |
Interconnect structure for semiconductor devices 8,330,275 - 13/290,811 Chang , et al. December 11, 2 | 2012-12-11 |
Interconnect structure having a silicide/germanide cap layer 8,143,162 - 12/500,796 Yu , et al. March 27, 2 | 2012-03-27 |
Mark Image Registration | Serial | Trademark Application Date |
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![]() "RUIMA" 3410800 78863937 |
RUIMA 2006-04-18 |
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