Tsai; Chung-Jen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Chung-Jen.The latest application filed is for "circuit substrate for mounting electronic component and circuit substrate assembly having same".

Company Profile

0.4.6

Tsai; Chung-Jen - Tayuan TW
Tsai; Chung-Jen - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit substrate for mounting electronic component and circuit substrate assembly having same Grant 8,300,420 - Tsai , et al. October 30, 2	2012-10-30
Method for smoothing printed circuit boards Grant 8,227,175 - Tsai , et al. July 24, 2	2012-07-24
Printed circuit board and method for manufacturing same Grant 8,067,696 - Tsai , et al. November 29, 2	2011-11-29
Method for mounting electronic component on printed circuit board Grant 7,799,603 - Tsai , et al. September 21, 2	2010-09-21
Circuit Substrate For Mounting Electronic Component And Circuit Substrate Assembly Having Same App 20100051331 - TSAI; CHUNG-JEN ; et al.	2010-03-04
Circuit Substrate For Mounting Electronic Component And Circuit Substrate Assembly Having Same App 20100051332 - TSAI; CHUNG-JEN ; et al.	2010-03-04
Method For Manufacturing Printed Circuit Boards App 20100044237 - TSAI; CHUNG-JEN ; et al.	2010-02-25
Printed Circuit Board And Method For Manufacturing Same App 20100038116 - TSAI; CHUNG-JEN ; et al.	2010-02-18
Method For Smoothing Printed Circuit Boards App 20100035187 - Tsai; Chung-Jen ; et al.	2010-02-11
Method For Mounting Electronic Component On Printed Circuit Board App 20100003784 - TSAI; CHUNG-JEN ; et al.	2010-01-07

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