Tsai; Chung-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsai; Chung-Hao.The latest application filed is for "package structure and manufacturing method thereof".
Company Profile
65.77.93
- Tsai; Chung-Hao - Changhua County TW
- Tsai; Chung-Hao - Huatan Township TW
- Tsai; Chung-Hao - Hsinchu TW
- Tsai; Chung-Hao - Kaohsiung TW
- Tsai; Chung-Hao - Hsinchu County TW
- Tsai; Chung-Hao - Hsin-Chu TW
- Tsai; Chung-Hao - Taipei N/A TW
- Tsai; Chung-Hao - HuatanTownship TW
- TSAI; CHUNG-HAO - TAIPEI CITY TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor structure, package structure, and manufacturing method thereof Grant 11,456,251 - Chen , et al. September 27, 2 | 2022-09-27 |
| Package structure including a solenoid inductor laterally aside a die and method of fabricating the same Grant 11,450,628 - Tang , et al. September 20, 2 | 2022-09-20 |
| Package Structure And Manufacturing Method Thereof App 20220285331 - Wang; Chuei-Tang ; et al. | 2022-09-08 |
| Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same Grant 11,424,197 - Wang , et al. August 23, 2 | 2022-08-23 |
| Deep Partition Power Delivery with Deep Trench Capacitor App 20220262778 - Yu; Chen-Hua ; et al. | 2022-08-18 |
| Integrated Circuit Package and Method App 20220262783 - Yu; Chen-Hua ; et al. | 2022-08-18 |
| Semiconductor package and method of forming the same Grant 11,417,698 - Chang , et al. August 16, 2 | 2022-08-16 |
| Semiconductor device, integrated fan-out package and method of forming the same Grant 11,410,923 - Tsai , et al. August 9, 2 | 2022-08-09 |
| Methods of Forming Semiconductor Packages Having a Die with an Encapsulant App 20220246559 - Tsai; Chung-Hao ; et al. | 2022-08-04 |
| Architecture for Computing System Package App 20220223530 - Yu; Chen-Hua ; et al. | 2022-07-14 |
| Die stacks and methods forming same Grant 11,380,655 - Yu , et al. July 5, 2 | 2022-07-05 |
| Memory Packages And Methods Of Forming Same App 20220208735 - Yu; Chen-Hua ; et al. | 2022-06-30 |
| Photonic semiconductor device and method Grant 11,362,077 - Chang , et al. June 14, 2 | 2022-06-14 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20220157625 - Wu; Kai-Chiang ; et al. | 2022-05-19 |
| Method Of Manufacturing Package Structure App 20220130815 - Huang; Shih-Ya ; et al. | 2022-04-28 |
| Methods of forming semiconductor packages having a die with an encapsulant Grant 11,315,891 - Tsai , et al. April 26, 2 | 2022-04-26 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 11,302,649 - Huang , et al. April 12, 2 | 2022-04-12 |
| Memory packages and methods of forming same Grant 11,282,816 - Yu , et al. March 22, 2 | 2022-03-22 |
| Integrated fan-out package and manufacturing method thereof Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
| Electronic Apparatus App 20220059450 - Tang; Tzu-Chun ; et al. | 2022-02-24 |
| Package structure and method of forming the same Grant 11,244,939 - Tsai , et al. February 8, 2 | 2022-02-08 |
| Integrated fan-out package and manufacturing method thereof Grant 11,239,096 - Wu , et al. February 1, 2 | 2022-02-01 |
| Package structure and package-on-package structure Grant 11,239,157 - Wang , et al. February 1, 2 | 2022-02-01 |
| Package structure and method of manufacturing the same Grant 11,222,883 - Huang , et al. January 11, 2 | 2022-01-11 |
| Passive device module, semiconductor package including the same, and manufacturing method thereof Grant 11,211,360 - Huang , et al. December 28, 2 | 2021-12-28 |
| Semiconductor package and manufacturing method thereof Grant 11,195,817 - Huang , et al. December 7, 2 | 2021-12-07 |
| Electronic apparatus including antennas and directors Grant 11,171,088 - Tang , et al. November 9, 2 | 2021-11-09 |
| Semiconductor Package And Manufacturing Method Thereof App 20210343651 - Tsai; Chung-Hao ; et al. | 2021-11-04 |
| Embedding Low-K Materials in Antennas App 20210328347 - Liu; Monsen ; et al. | 2021-10-21 |
| Package Structure And Method Of Forming The Same App 20210305226 - Tsai; Chung-Hao ; et al. | 2021-09-30 |
| Ceiling fan Grant 11,125,241 - Horng , et al. September 21, 2 | 2021-09-21 |
| Package Structure App 20210280524 - Lin; Chun-Wen ; et al. | 2021-09-09 |
| Package Structure And Manufacturing Method Thereof App 20210272929 - Tsai; Chung-Hao ; et al. | 2021-09-02 |
| Package with thinned substrate Grant 11,094,671 - Yu , et al. August 17, 2 | 2021-08-17 |
| Semiconductor Package And Manufacturing Method Thereof App 20210239902 - Chang; Chih-Chieh ; et al. | 2021-08-05 |
| Memory Packages And Methods Of Forming Same App 20210225809 - Yu; Chen-Hua ; et al. | 2021-07-22 |
| Passive Device Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof App 20210225804 - Huang; Shih-Ya ; et al. | 2021-07-22 |
| Semiconductor package and manufacturing method thereof Grant 11,062,998 - Tsai , et al. July 13, 2 | 2021-07-13 |
| Photonic Semiconductor Device And Method App 20210202453 - Chang; Chih-Chieh ; et al. | 2021-07-01 |
| Semiconductor Package And Method Of Forming The Same App 20210202562 - Chang; Chia-Lun ; et al. | 2021-07-01 |
| Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas Grant 11,050,153 - Liu , et al. June 29, 2 | 2021-06-29 |
| Package Structure And Method Of Fabricating The Same App 20210183794 - Tang; Tzu-Chun ; et al. | 2021-06-17 |
| Memory module, semiconductor package including the same, and manufacturing method thereof Grant 11,018,113 - Chuang , et al. May 25, 2 | 2021-05-25 |
| Semiconductor Package And Manufacturing Method Thereof App 20210125960 - Huang; Shih-Ya ; et al. | 2021-04-29 |
| Memory Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof App 20210118847 - Chuang; Lipu Kris ; et al. | 2021-04-22 |
| 3D antenna for integrated circuits Grant 10,978,781 - Hsieh , et al. April 13, 2 | 2021-04-13 |
| Package Assembly And Manufacturing Method Thereof App 20210096310 - Chang; Chih-Chieh ; et al. | 2021-04-01 |
| Semiconductor package and manufacturing method thereof Grant 10,962,711 - Chang , et al. March 30, 2 | 2021-03-30 |
| Semiconductor Package And Manufacturing Method Thereof App 20210057346 - Tsai; Chung-Hao ; et al. | 2021-02-25 |
| Photonic semiconductor device and method Grant 10,930,628 - Chang , et al. February 23, 2 | 2021-02-23 |
| Die Stacks and Methods Forming Same App 20210043608 - Yu; Chen-Hua ; et al. | 2021-02-11 |
| Package Structure And Method Of Manufacturing The Same App 20210013191 - Huang; Shih-Ya ; et al. | 2021-01-14 |
| Semiconductor Structure, Package Structure, And Manufacturing Method Thereof App 20210013140 - Chen; Wei-Ting ; et al. | 2021-01-14 |
| Antenna Device And Method For Manufacturing Antenna Device App 20200411996 - WANG; Chuei-Tang ; et al. | 2020-12-31 |
| Semiconductor device and method of manufacture Grant 10,879,183 - Wang , et al. December 29, 2 | 2020-12-29 |
| Package Structure And Method Of Forming Thereof App 20200402847 - CHEN; Chih-Lin ; et al. | 2020-12-24 |
| Package structure Grant 10,867,938 - Tang , et al. December 15, 2 | 2020-12-15 |
| Package Structure And Package-on-package Structure App 20200381357 - Wang; Chuei-Tang ; et al. | 2020-12-03 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20200373173 - Wu; Kai-Chiang ; et al. | 2020-11-26 |
| Package Structure App 20200365517 - Lin; Chun-Wen ; et al. | 2020-11-19 |
| Die stacks and methods forming same Grant 10,818,640 - Yu , et al. October 27, 2 | 2020-10-27 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
| Package structure and method of manufacturing the same Grant 10,811,404 - Huang , et al. October 20, 2 | 2020-10-20 |
| Semiconductor Device with Shielding Structure for Cross-talk Reduction App 20200321288 - Huang; Shih-Ya ; et al. | 2020-10-08 |
| Die Stacks And Methods Forming Same App 20200321315 - Yu; Chen-Hua ; et al. | 2020-10-08 |
| Semiconductor structure, package structure, and manufacturing method thereof Grant 10,796,990 - Chen , et al. October 6, 2 | 2020-10-06 |
| Package with Thinned Substrate App 20200303342 - Yu; Chen-Hua ; et al. | 2020-09-24 |
| Semiconductor chip, package structure, and pacakge-on-package structure Grant 10,777,502 - Wang , et al. Sept | 2020-09-15 |
| Integrated fan-out package and manufacturing method thereof Grant 10,770,313 - Wu , et al. Sep | 2020-09-08 |
| Antenna device and method for manufacturing antenna device Grant 10,770,795 - Wang , et al. Sep | 2020-09-08 |
| Package structure with inductor and method of forming thereof Grant 10,763,164 - Chen , et al. Sep | 2020-09-01 |
| Method of manufacturing integrated fan-out package Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
| Package structures Grant 10,734,323 - Lin , et al. | 2020-08-04 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 10,692,817 - Huang , et al. | 2020-06-23 |
| Package with thinned substrate Grant 10,679,968 - Yu , et al. | 2020-06-09 |
| Semiconductor Package And Manufacturing Method Thereof App 20200174187 - Chang; Chih-Chieh ; et al. | 2020-06-04 |
| Ceiling Fan App 20200173446 - Horng; Alex ; et al. | 2020-06-04 |
| Manufacturing method of redistribution layer Grant 10,607,856 - Huang , et al. | 2020-03-31 |
| Semiconductor Structure, Package Structure, And Manufacturing Method Thereof App 20200091063 - Chen; Wei-Ting ; et al. | 2020-03-19 |
| Semiconductor Chip, Package Structure, And Pacakge-on-package Structure App 20200066631 - Wang; Chuei-Tang ; et al. | 2020-02-27 |
| Package, Package Structure And Method Of Manufacturing The Same App 20200035625 - Wang; Chuei-Tang ; et al. | 2020-01-30 |
| 3D Antenna for Integrated Circuits App 20200028240 - Hsieh; Jeng-Shien ; et al. | 2020-01-23 |
| Semiconductor Device, Integrated Fan-out Package And Method Of Forming The Same App 20200020627 - Tsai; Chung-Hao ; et al. | 2020-01-16 |
| Photonic Semiconductor Device And Method App 20200006304 - Chang; Chih-Chieh ; et al. | 2020-01-02 |
| Semiconductor Device and Method of Manufacture App 20190393153 - Wang; Chuei-Tang ; et al. | 2019-12-26 |
| Package structure, semiconductor chip and method of fabricating the same Grant 10,504,835 - Wang , et al. Dec | 2019-12-10 |
| Package Structure And Method Of Manufacturing The Same App 20190371781 - Huang; Shih-Ya ; et al. | 2019-12-05 |
| 3D antenna for integrated circuits Grant 10,498,009 - Hsieh , et al. De | 2019-12-03 |
| Method Of Manufacturing Integrated Fan-out Package App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
| Semiconductor Packages And Methods Of Forming Same App 20190295972 - Tsai; Chung-Hao ; et al. | 2019-09-26 |
| Embedding Low-K Materials in Antennas App 20190252783 - Liu; Monsen ; et al. | 2019-08-15 |
| Semiconductor Device with Shielding Structure for Cross-talk Reduction App 20190252326 - Huang; Shih-Ya ; et al. | 2019-08-15 |
| Package structure having connecting module Grant 10,381,309 - Wang , et al. A | 2019-08-13 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20190244834 - Wu; Kai-Chiang ; et al. | 2019-08-08 |
| Method of manufacturing integrated fan-out package Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
| Method of fabricating an integrated fan-out package Grant 10,304,790 - Chang , et al. | 2019-05-28 |
| Package Structures App 20190157208 - Lin; Chun-Wen ; et al. | 2019-05-23 |
| Package Structures App 20190157206 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
| Semiconductor device including integrated fan out antenna and method of forming the same Grant 10,297,925 - Wang , et al. | 2019-05-21 |
| Integrated fan-out package Grant 10,276,404 - Wu , et al. | 2019-04-30 |
| Electronic Apparatus App 20190122978 - Tang; Tzu-Chun ; et al. | 2019-04-25 |
| Method Of Fabricating An Integrated Fan-out Package App 20190123004 - Chang; Shou-Zen ; et al. | 2019-04-25 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 10,269,728 - Huang , et al. | 2019-04-23 |
| Embedding low-k materials in antennas Grant 10,270,172 - Liu , et al. | 2019-04-23 |
| Through-Vias and Methods of Forming the Same App 20190115258 - Tsai; Chung-Hao ; et al. | 2019-04-18 |
| Package Structure App 20190096829 - Tang; Tzu-Chun ; et al. | 2019-03-28 |
| Integrated Fan-out Package App 20190067039 - Wu; Kai-Chiang ; et al. | 2019-02-28 |
| Semiconductor Device with Shielding Structure for Cross-Talk Reduction App 20190006289 - Huang; Sylvia ; et al. | 2019-01-03 |
| Integrated fan-out package and method of fabricating the same Grant 10,163,824 - Chang , et al. Dec | 2018-12-25 |
| Manufacturing Method Of Redistribution Layer App 20180366344 - Huang; Kun-Yung ; et al. | 2018-12-20 |
| Through-vias and methods of forming the same Grant 10,157,791 - Tsai , et al. Dec | 2018-12-18 |
| Electronic apparatus Grant 10,157,834 - Tang , et al. Dec | 2018-12-18 |
| Antennas and waveguides in InFO structures Grant 10,153,239 - Wang , et al. Dec | 2018-12-11 |
| Package with Thinned Substrate App 20180337159 - Yu; Chen-Hua ; et al. | 2018-11-22 |
| Package with thinned substrate Grant 10,134,708 - Yu , et al. November 20, 2 | 2018-11-20 |
| Integrated Fan-out Package And Method Of Fabricating The Same App 20180158787 - Chang; Shou-Zen ; et al. | 2018-06-07 |
| Package Structure And Method Of Forming Thereof App 20180138126 - CHEN; Chih-Lin ; et al. | 2018-05-17 |
| Tunable Three Dimensional Inductor App 20180108477 - LIU; Monsen ; et al. | 2018-04-19 |
| Semiconductor Device Including Integrated Fan Out Antenna And Method Of Forming The Same App 20180102595 - WANG; Chuei-Tang ; et al. | 2018-04-12 |
| Package With Thinned Substrate App 20180040585 - Yu; Chen-Hua ; et al. | 2018-02-08 |
| Integrated fan out antenna and method of forming the same Grant 9,843,106 - Wang , et al. December 12, 2 | 2017-12-12 |
| Antenna Device And Method For Manufacturing Antenna Device App 20170346185 - WANG; Chuei-Tang ; et al. | 2017-11-30 |
| Antennas and Waveguides in InFO Structures App 20170338195 - Wang; Chuei-Tang ; et al. | 2017-11-23 |
| Semiconductor arrangement and formation thereof Grant 9,773,730 - Tsai , et al. September 26, 2 | 2017-09-26 |
| Method of manufacturing a tunable three dimensional inductor Grant 9,767,957 - Liu , et al. September 19, 2 | 2017-09-19 |
| Antennas and waveguides in InFO structures Grant 9,735,118 - Wang , et al. August 15, 2 | 2017-08-15 |
| Antennas and Waveguides in InFO Structures App 20170162524 - Wang; Chuei-Tang ; et al. | 2017-06-08 |
| Power amplifier package and method thereof Grant 9,640,457 - Tsai , et al. May 2, 2 | 2017-05-02 |
| 3D Antenna for Integrated Circuits App 20170098883 - Hsieh; Jeng-Shien ; et al. | 2017-04-06 |
| 3D antenna for integrated circuits Grant 9,537,205 - Hsieh , et al. January 3, 2 | 2017-01-03 |
| Power Amplifier Package And Method Thereof App 20160211214 - TSAI; CHUNG-HAO ; et al. | 2016-07-21 |
| RF choke device for integrated circuits Grant 9,391,350 - Hsieh , et al. July 12, 2 | 2016-07-12 |
| Semiconductor device with shielding layer in post-passivation interconnect structure Grant 9,368,454 - Tsai , et al. June 14, 2 | 2016-06-14 |
| Semiconductor Arrangement And Formation Thereof App 20160126188 - Tsai; Chung-Hao ; et al. | 2016-05-05 |
| Embedding Low-K Materials in Antennas App 20160126634 - Liu; Monsen ; et al. | 2016-05-05 |
| Semiconductor arrangement and formation thereof Grant 9,331,018 - Tsai , et al. May 3, 2 | 2016-05-03 |
| Device suppressing common-mode radiation Grant 9,331,740 - Wu , et al. May 3, 2 | 2016-05-03 |
| Integrated Fan Out Antenna And Method Of Forming The Same App 20160104940 - WANG; Chuei-Tang ; et al. | 2016-04-14 |
| Embedding low-k materials in antennas Grant 9,252,491 - Liu , et al. February 2, 2 | 2016-02-02 |
| Semiconductor Arrangement And Formation Thereof App 20150228577 - Tsai; Chung-Hao ; et al. | 2015-08-13 |
| 3d Antenna For Integrated Circuits App 20150130681 - HSIEH; Jeng-Shieh ; et al. | 2015-05-14 |
| Mechanisms for forming bump structures over wide metal pad Grant 9,018,757 - Tsai , et al. April 28, 2 | 2015-04-28 |
| Semiconductor Device With Shielding Layer In Post-passivation Interconnect Structure App 20150102472 - TSAI; Chung-Hao ; et al. | 2015-04-16 |
| Tunable Three Dimensional Inductor App 20150042438 - Liu; Monsen ; et al. | 2015-02-12 |
| Mechanisms For Forming Bump Structures Over Wide Metal Pad App 20150021758 - TSAI; Chung-Hao ; et al. | 2015-01-22 |
| Through-Vias and Methods of Forming the Same App 20150011083 - Tsai; Chung-Hao ; et al. | 2015-01-08 |
| Through-vias and methods of forming the same Grant 8,916,979 - Tsai , et al. December 23, 2 | 2014-12-23 |
| Common-mode noise suppression filter Grant 8,878,630 - Wu , et al. November 4, 2 | 2014-11-04 |
| Rf Choke Device For Integrated Circuits App 20140253262 - Hsieh; Jeng-Shien ; et al. | 2014-09-11 |
| Through-Vias and Methods of Forming the Same App 20140183754 - Tsai; Chung-Hao ; et al. | 2014-07-03 |
| Embedding Low-K Materials in Antennas App 20140152509 - Liu; Monsen ; et al. | 2014-06-05 |
| Common mode noise suppression circuit Grant 8,659,365 - Wu , et al. February 25, 2 | 2014-02-25 |
| Signal Transmission Circuit And Signal Transmission Cell Thereof App 20140022030 - WU; TZONG-LIN ; et al. | 2014-01-23 |
| Device Suppressing Common-mode Radiation App 20140014405 - Wu; Tzong-Lin ; et al. | 2014-01-16 |
| Defected ground structure with shielding effect Grant 8,570,114 - Wu , et al. October 29, 2 | 2013-10-29 |
| Electromagnetic noise suppression circuit Grant 8,552,811 - Wu , et al. October 8, 2 | 2013-10-08 |
| Baluns With Imaginary Commond-mode Impedance App 20130069736 - Wu; Tzong-Lin ; et al. | 2013-03-21 |
| Digital Electronic Device App 20130002378 - Wu; Tzong-Lin ; et al. | 2013-01-03 |
| Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal Grant 8,339,212 - Wu , et al. December 25, 2 | 2012-12-25 |
| Electromagnetic Noise Suppression Circuit App 20120194290 - WU; Tzong-Lin ; et al. | 2012-08-02 |
| Defected Ground Structure With Shielding Effect App 20120057323 - Wu; Tzong-Lin ; et al. | 2012-03-08 |
| Common Mode Noise Suppression Circuit App 20120025925 - Wu; Tzong-Lin ; et al. | 2012-02-02 |
| Filtering Device And Differential Signal Transmission Circuit Capable Of Suppressing Common-mode Noises Upon Transmission Of A Deifferential Signal App 20110032048 - Wu; Tzong-Lin ; et al. | 2011-02-10 |
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