| Patent | Date |
|---|
Semiconductor Device Structure And Methods Of Forming The Same
App 20220277995 - CHU; Hwei-Jay ; et al. | 2022-09-01 |
Semiconductor structure and method for forming the same
Grant 11,393,718 - Chu , et al. July 19, 2 | 2022-07-19 |
Self-aligned Via Structures And Methods
App 20220165661 - Wu; Chieh-Han ; et al. | 2022-05-26 |
Substrate Position Calibration For Substrate Supports In Substrate Processing Systems
App 20220099426 - MATSUSHITA; Tomoharu ; et al. | 2022-03-31 |
Self-aligned via structures with barrier layers
Grant 11,251,118 - Wu , et al. February 15, 2 | 2022-02-15 |
Substrate position calibration for substrate supports in substrate processing systems
Grant 11,201,078 - Matsushita , et al. December 14, 2 | 2021-12-14 |
Semiconductor Structure And Method For Forming The Same
App 20210242078 - CHU; Hwei-Jay ; et al. | 2021-08-05 |
Two piece shutter disk assembly with self-centering feature
Grant 11,043,406 - Tsai , et al. June 22, 2 | 2021-06-22 |
Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
Grant 11,031,273 - Chia , et al. June 8, 2 | 2021-06-08 |
PVD buffer layers for LED fabrication
Grant 11,011,676 - Zhu , et al. May 18, 2 | 2021-05-18 |
Self-Aligned Via Structures and Methods
App 20210082804 - Wu; Chieh-Han ; et al. | 2021-03-18 |
Method and apparatus for processing a substrate using non-contact temperature measurement
Grant 10,950,475 - Ramachandran , et al. March 16, 2 | 2021-03-16 |
Interconnect Structures with Low-Aspect-Ratio Contact Vias
App 20210057333 - Tsai; Cheng-Hsiung ; et al. | 2021-02-25 |
Method And Apparatus For Processing A Substrate Using Non-contact Temperature Measurement
App 20210057244 - RAMACHANDRAN; VINODH ; et al. | 2021-02-25 |
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
App 20210035856 - Tsai; Cheng-Hsiung ; et al. | 2021-02-04 |
Interconnect structure having an etch stop layer over conductive lines
Grant 10,861,742 - Tsai , et al. December 8, 2 | 2020-12-08 |
Inline Microwave Batch Degas Chamber
App 20200378006 - GAUTAM; RIBHU ; et al. | 2020-12-03 |
Methods and apparatus for shutter disk assembly detection
Grant 10,851,453 - Tsai , et al. December 1, 2 | 2020-12-01 |
Spacer Etching Process For Integrated Circuit Design
App 20200286738 - LIU; RU-GUN ; et al. | 2020-09-10 |
High conductance process kit
Grant 10,763,086 - Chia , et al. Sep | 2020-09-01 |
Base plate for a processing chamber substrate support
Grant D893,441 - Rao , et al. A | 2020-08-18 |
Method and Apparatus for cleaning a substrate
App 20200230782 - AGARWAL; Pulkit ; et al. | 2020-07-23 |
Apparatus to improve substrate temperature uniformity
Grant 10,711,348 - Tsai , et al. | 2020-07-14 |
Process kit design for in-chamber heater and wafer rotating mechanism
Grant 10,704,147 - Rasheed , et al. | 2020-07-07 |
Deposition ring for physical vapor deposition chamber
Grant D888,903 - Gunther , et al. | 2020-06-30 |
Process Kit Having Tall Deposition Ring For Pvd Chamber
App 20200194243 - GUNTHER; DAVID ; et al. | 2020-06-18 |
Physical Vapor Deposition (pvd) Electrostatic Chuck With Improved Thermal Coupling For Temperature Sensitive Processes
App 20200185247 - CHIA; BONNIE T ; et al. | 2020-06-11 |
Spacer etching process for integrated circuit design
Grant 10,665,467 - Liu , et al. | 2020-05-26 |
Two Piece Shutter Disk Assembly With Self-centering Feature
App 20190326154 - TSAI; CHENG-HSIUNG ; et al. | 2019-10-24 |
Substrate Support With Edge Seal
App 20190326152 - KE; CHANG ; et al. | 2019-10-24 |
Methods And Apparatus For Shutter Disk Assembly Detection
App 20190316251 - TSAI; CHENG-HSIUNG ; et al. | 2019-10-17 |
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
App 20190287848 - Tsai; Cheng-Hsiung ; et al. | 2019-09-19 |
Interconnect structure having an etch stop layer over conductive lines
Grant 10,312,139 - Tsai , et al. | 2019-06-04 |
Apparatus and method for reducing substrate sliding in process chambers
Grant 10,262,877 - Thirunavukarasu , et al. | 2019-04-16 |
Substrate Support For Reduced Damage Substrate Backside
App 20190080951 - HUSTON; Joel M. ; et al. | 2019-03-14 |
Substrate support with improved RF return
Grant 10,134,615 - Kamath , et al. November 20, 2 | 2018-11-20 |
Substrate Position Calibration For Substrate Supports In Substrate Processing Systems
App 20180233396 - MATSUSHITA; TOMOHARU ; et al. | 2018-08-16 |
Semiconductor device including a target integrated circuit pattern
Grant 10,049,919 - Wu , et al. August 14, 2 | 2018-08-14 |
Lithography using high selectivity spacers for pitch reduction
Grant 10,014,175 - Chang , et al. July 3, 2 | 2018-07-03 |
Method of forming an interconnect structure for a semiconductor device
Grant 9,997,404 - Wu , et al. June 12, 2 | 2018-06-12 |
Process Kit Design For In-chamber Heater And Wafer Rotating Mechanism
App 20180155838 - RASHEED; Muhammad M. ; et al. | 2018-06-07 |
High Conductance Process Kit
App 20180130644 - CHIA; Bonnie T. ; et al. | 2018-05-10 |
Self-aligned double spacer patterning process
Grant 9,911,646 - Tsai , et al. March 6, 2 | 2018-03-06 |
Substrate support with multiple heating zones
Grant 9,888,528 - Matsushita , et al. February 6, 2 | 2018-02-06 |
Lithography Using High Selectivity Spacers for Pitch Reduction
App 20180012761 - Chang; Yu-Sheng ; et al. | 2018-01-11 |
High conductance process kit
Grant 9,865,437 - Chia , et al. January 9, 2 | 2018-01-09 |
Self-aligned double spacer patterning process
Grant 9,831,117 - Wu , et al. November 28, 2 | 2017-11-28 |
In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
Grant 9,818,585 - Green , et al. November 14, 2 | 2017-11-14 |
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
App 20170287775 - Tsai; Cheng-Hsiung ; et al. | 2017-10-05 |
Lithography using high selectivity spacers for pitch reduction
Grant 9,773,676 - Chang , et al. September 26, 2 | 2017-09-26 |
Semiconductor device manufacturing methods
Grant 9,768,031 - Huang , et al. September 19, 2 | 2017-09-19 |
Metal lines for interconnect structure and method of manufacturing same
Grant 9,735,052 - Tsai , et al. August 15, 2 | 2017-08-15 |
Self-Aligned Double Spacer Patterning Process
App 20170200641 - Tsai; Cheng-Hsiung ; et al. | 2017-07-13 |
Apparatus And Method For Reducing Substrate Sliding In Process Chambers
App 20170186631 - THIRUNAVUKARASU; SRISKANTHARAJAH ; et al. | 2017-06-29 |
Interconnect structure having an etch stop layer over conductive lines
Grant 9,685,368 - Tsai , et al. June 20, 2 | 2017-06-20 |
Method Of Spacer Patterning To Form A Target Integrated Circuit Pattern
App 20170162435 - WU; Chieh-Han ; et al. | 2017-06-08 |
Semiconductor integrated circuit with nano gap
Grant 9,653,349 - Tsai , et al. May 16, 2 | 2017-05-16 |
Structure and method for interconnection
Grant 9,627,215 - Huang , et al. April 18, 2 | 2017-04-18 |
Integrated circuit interconnects and methods of making same
Grant 9,627,256 - Tsai , et al. April 18, 2 | 2017-04-18 |
Method for Interconnect Scheme
App 20170103915 - Tsai; Cheng-Hsiung ; et al. | 2017-04-13 |
Pad design for electrostatic chuck surface
Grant 9,613,846 - Raj , et al. April 4, 2 | 2017-04-04 |
Structure and Method for Interconnection
App 20170092580 - HUANG; CHIEN-HUA ; et al. | 2017-03-30 |
Self-aligned double spacer patterning process
Grant 9,607,850 - Tsai , et al. March 28, 2 | 2017-03-28 |
Apparatus and method for reducing substrate sliding in process chambers
Grant 9,595,464 - Thirunavukarasu , et al. March 14, 2 | 2017-03-14 |
Spacer Etching Process for Integrated Circuit Design
App 20170069505 - LIU; RU-GUN ; et al. | 2017-03-09 |
Method for interconnect scheme
Grant 9,589,890 - Yao , et al. March 7, 2 | 2017-03-07 |
Method of spacer patterning to form a target integrated circuit pattern
Grant 9,576,814 - Wu , et al. February 21, 2 | 2017-02-21 |
Interconnect structure and method of forming the same
Grant 9,564,397 - Tsai , et al. February 7, 2 | 2017-02-07 |
Method for Interconnect Scheme
App 20170025346 - Yao; Hsin-Chieh ; et al. | 2017-01-26 |
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
App 20160379871 - Tsai; Cheng-Hsiung ; et al. | 2016-12-29 |
Method Of Forming An Interconnect Structure For A Semiconductor Device
App 20160365276 - WU; Yung-Hsu ; et al. | 2016-12-15 |
Spacer etching process for integrated circuit design
Grant 9,502,261 - Liu , et al. November 22, 2 | 2016-11-22 |
Integrated circuit interconnects and methods of making same
Grant 9,490,205 - Tsai , et al. November 8, 2 | 2016-11-08 |
Methods and Apparatus for Cleaning a Substrate
App 20160322239 - AGARWAL; Pulkit ; et al. | 2016-11-03 |
Method of semiconductor integrated circuit fabrication
Grant 9,478,430 - Yao , et al. October 25, 2 | 2016-10-25 |
Pvd Buffer Layers For Led Fabrication
App 20160293798 - Zhu; Mingwei ; et al. | 2016-10-06 |
Apparatus To Improve Substrate Temperature Uniformity
App 20160258061 - TSAI; CHENG-HSIUNG ; et al. | 2016-09-08 |
Method of forming an interconnect structure for a semiconductor device
Grant 9,431,297 - Wu , et al. August 30, 2 | 2016-08-30 |
Substrate Support With Improved Rf Return
App 20160240426 - KAMATH; ARAVIND MIYAR ; et al. | 2016-08-18 |
PVD buffer layers for LED fabrication
Grant 9,396,933 - Zhu , et al. July 19, 2 | 2016-07-19 |
Substrate Support With Multiple Heating Zones
App 20160192444 - MATSUSHITA; TOMOHARU ; et al. | 2016-06-30 |
High Conductance Process Kit
App 20160189936 - CHIA; Bonnie T. ; et al. | 2016-06-30 |
Semiconductor patterning
Grant 9,355,865 - Tsai , et al. May 31, 2 | 2016-05-31 |
Methods of manufacturing semiconductor devices
Grant 9,349,595 - Tsai , et al. May 24, 2 | 2016-05-24 |
Interconnect Structure and Method of Forming The Same
App 20160118334 - Tsai; Cheng-Hsiung ; et al. | 2016-04-28 |
Method Of Forming An Interconnect Structure For A Semiconductor Device
App 20160099174 - Wu; Yung-Hsu ; et al. | 2016-04-07 |
Air gap formation by damascene process
Grant 9,299,603 - Tsai , et al. March 29, 2 | 2016-03-29 |
Integrated circuit formed using spacer-like copper deposition
Grant 9,275,960 - Yao , et al. March 1, 2 | 2016-03-01 |
In situ chamber clean with inert hydrogen helium mixture during wafer process
Grant 9,269,562 - Dinsmore , et al. February 23, 2 | 2016-02-23 |
Lithography Using High Selectivity Spacers for Pitch Reduction
App 20160035571 - Chang; Yu-Sheng ; et al. | 2016-02-04 |
Apparatus And Method For Reducing Substrate Sliding In Process Chambers
App 20160020134 - THIRUNAVUKARASU; SRISKANTHARAJAH ; et al. | 2016-01-21 |
Method For Integrated Circuit Patterning
App 20160005617 - Wu; Chieh-Han ; et al. | 2016-01-07 |
Spacer Etching Process for Integrated Circuit Design
App 20160005614 - LIU; RU-GUN ; et al. | 2016-01-07 |
Interconnect structure and method of forming the same
Grant 9,230,911 - Tsai , et al. January 5, 2 | 2016-01-05 |
Self-Aligned Double Spacer Patterning Process
App 20150380300 - Wu; Yung-Hsu ; et al. | 2015-12-31 |
Semiconductor Device Manufacturing Methods
App 20150340233 - Huang; Tsung-Min ; et al. | 2015-11-26 |
Self-Aligned Double Spacer Patterning Process
App 20150340240 - Tsai; Cheng-Hsiung ; et al. | 2015-11-26 |
Lithography using high selectivity spacers for pitch reduction
Grant 9,177,797 - Chang , et al. November 3, 2 | 2015-11-03 |
Spacer etching process for integrated circuit design
Grant 9,153,478 - Liu , et al. October 6, 2 | 2015-10-06 |
Method for integrated circuit patterning
Grant 9,136,106 - Wu , et al. September 15, 2 | 2015-09-15 |
Integrated Circuit Interconnects and Methods of Making Same
App 20150255389 - Tsai; Cheng-Hsiung ; et al. | 2015-09-10 |
Self-aligned double spacer patterning process
Grant 9,129,906 - Wu , et al. September 8, 2 | 2015-09-08 |
Integrated circuit device having a copper interconnect
Grant 9,129,967 - Tsai , et al. September 8, 2 | 2015-09-08 |
Self-aligned double spacer patterning process
Grant 9,123,776 - Tsai , et al. September 1, 2 | 2015-09-01 |
Semiconductor device manufacturing methods
Grant 9,099,400 - Huang , et al. August 4, 2 | 2015-08-04 |
Semiconductor Integrated Circuit With Nano Gap
App 20150214143 - Tsai; Cheng-Hsiung ; et al. | 2015-07-30 |
Interconnect Structure and Method of Forming the Same
App 20150187696 - Tsai; Cheng-Hsiung ; et al. | 2015-07-02 |
Method For Integrated Circuit Patterning
App 20150179435 - Wu; Chieh-Han ; et al. | 2015-06-25 |
Self-Aligned Double Spacer Patterning Process
App 20150162205 - Wu; Yung-Hsu ; et al. | 2015-06-11 |
Lithography Using High Selectivity Spacers for Pitch Reduction
App 20150155171 - Chang; Yu-Sheng ; et al. | 2015-06-04 |
Self-Aligned Double Spacer Patterning Process
App 20150155198 - Tsai; Cheng-Hsiung ; et al. | 2015-06-04 |
Semiconductor Patterning
App 20150155184 - Tsai; Cheng-Hsiung ; et al. | 2015-06-04 |
Pad Design For Electrostatic Chuck Surface
App 20150146339 - RAJ; Govinda ; et al. | 2015-05-28 |
Integrated circuit interconnects and methods of making same
Grant 9,034,756 - Tsai , et al. May 19, 2 | 2015-05-19 |
Air Gap Formation by Damascene Process
App 20150132952 - Tsai; Cheng-Hsiung ; et al. | 2015-05-14 |
Semiconductor Device Manufacturing Methods
App 20150093899 - Huang; Tsung-Min ; et al. | 2015-04-02 |
Method of Semiconductor Integrated Circuit Fabrication
App 20150056812 - Yao; Hsin-Chieh ; et al. | 2015-02-26 |
Semiconductor patterning
Grant 8,952,502 - Tsai , et al. February 10, 2 | 2015-02-10 |
In Situ Plasma Clean For Removal Of Residue From Pedestal Surface Without Breaking Vacuum
App 20140366912 - GREEN; Richard J. ; et al. | 2014-12-18 |
Addition of carboxyl groups plasma during etching for interconnect reliability enhancement
Grant 8,901,007 - Tsai , et al. December 2, 2 | 2014-12-02 |
Method of fabricating an air gap using a damascene process and structure of same
Grant 8,900,989 - Tsai , et al. December 2, 2 | 2014-12-02 |
In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
Grant 8,900,471 - Green , et al. December 2, 2 | 2014-12-02 |
Air-Gap Formation in Interconnect Structures
App 20140349481 - Tsai; Cheng-Hsiung ; et al. | 2014-11-27 |
Method of semiconducotr integrated circuit fabrication
Grant 8,890,321 - Yao , et al. November 18, 2 | 2014-11-18 |
Air-gap formation in interconnect structures
Grant 8,866,297 - Tsai , et al. October 21, 2 | 2014-10-21 |
Spacer Etching Process For Integrated Circuit Design
App 20140273442 - Liu; Ru-Gun ; et al. | 2014-09-18 |
Method Of Fabricating An Air Gap Using A Damascene Process And Structure Of Same
App 20140252633 - Tsai; Cheng-Hsiung ; et al. | 2014-09-11 |
Integrated Circuit Interconnects And Methods Of Making Same
App 20140239501 - Tsai; Cheng-Hsiung ; et al. | 2014-08-28 |
In Situ Chamber Clean With Inert Hydrogen Helium Mixture During Wafer Process
App 20140196746 - Dinsmore; Robert ; et al. | 2014-07-17 |
Addition Of Carboxyl Groups Plasma During Etching For Interconnect Reliability Enhancement
App 20140187044 - Tsai; Cheng-Hsiung ; et al. | 2014-07-03 |
Air-Gap Formation in Interconnect Structures
App 20140151888 - Tsai; Cheng-Hsiung ; et al. | 2014-06-05 |
Method of Semiconducotr integrated Circuit Fabrication
App 20140138838 - Yao; Hsin-Chieh ; et al. | 2014-05-22 |
Semiconductor Patterning
App 20140138801 - Tsai; Cheng-Hsiung ; et al. | 2014-05-22 |
Integrated Circuit Device Having A Copper Interconnect
App 20140124932 - Tsai; Cheng-Hsiung ; et al. | 2014-05-08 |
Integrated Circuit Formed Using Spacer-Like Copper Deposition
App 20140084479 - Yao; Hsin-Chieh ; et al. | 2014-03-27 |
Air-gap formation in interconnect structures
Grant 8,664,743 - Tsai , et al. March 4, 2 | 2014-03-04 |
Integrated Circuit Interconnects and Methods of Making Same
App 20140027908 - Tsai; Cheng-Hsiung ; et al. | 2014-01-30 |
Methods of Manufacturing Semiconductor Devices
App 20140017894 - Tsai; Cheng-Hsiung ; et al. | 2014-01-16 |
Pvd Buffer Layers For Led Fabrication
App 20130285065 - Zhu; Mingwei ; et al. | 2013-10-31 |
Semiconductor patterning
Grant 8,518,836 - Tsai , et al. August 27, 2 | 2013-08-27 |
Electrostatic chuck assembly
Grant 8,390,980 - Sansoni , et al. March 5, 2 | 2013-03-05 |
Detachable electrostatic chuck for supporting a substrate in a process chamber
Grant 7,907,384 - Brown , et al. March 15, 2 | 2011-03-15 |
In Situ Plasma Clean For Removal Of Residue From Pedestal Surface Without Breaking Vacuum
App 20100218785 - Green; Richard J. ; et al. | 2010-09-02 |
Detachable electrostatic chuck
Grant 7,697,260 - Brown , et al. April 13, 2 | 2010-04-13 |
Electrostatic Chuck Assembly
App 20100039747 - Sansoni; Steven V. ; et al. | 2010-02-18 |
Detachable electrostatic chuck for supporting a substrate in a process chamber
App 20090201622 - Brown; Karl ; et al. | 2009-08-13 |
Oxygen plasma clean to remove carbon species deposited on a glass dome surface
Grant 7,550,090 - Gu , et al. June 23, 2 | 2009-06-23 |
Detachable electrostatic chuck for supporting a substrate in a process chamber
Grant 7,480,129 - Brown , et al. January 20, 2 | 2009-01-20 |
Oxygen Plasma Clean To Remove Carbon Species Deposited On A Glass Dome Surface
App 20080173326 - GU; QUANCHENG ; et al. | 2008-07-24 |
Detachable electrostatic chuck for supporting a substrate in a process chamber
App 20060002053 - Brown; Karl ; et al. | 2006-01-05 |
Detachable electrostatic chuck
App 20050219786 - Brown, Karl ; et al. | 2005-10-06 |
Pedestal assembly with enhanced thermal conductivity
Grant 6,563,686 - Tsai , et al. May 13, 2 | 2003-05-13 |
Substrate support with multilevel heat transfer mechanism
Grant 6,506,291 - Tsai , et al. January 14, 2 | 2003-01-14 |
Substrate Support With Multilevel Heat Transfer Mechanism
App 20020189940 - Tsai, Cheng-Hsiung ; et al. | 2002-12-19 |
Pedestal assembly with enhanced thermal conductivity
App 20020129475 - Tsai, Cheng-Hsiung ; et al. | 2002-09-19 |
Connectors For An Eletrostatic Chuck
App 20020022403 - CHENG, WING L. ; et al. | 2002-02-21 |
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