Trasporto; Arnel Senosa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Trasporto; Arnel Senosa.The latest application filed is for "semiconductor device and method of forming a package in-fan out package".

Company Profile

2.95.69

Trasporto; Arnel Senosa - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Grant RE47,923 - Camacho , et al.	2020-03-31
Semiconductor device and method of forming a package in-fan out package Grant 10,068,862 - Do , et al. September 4, 2	2018-09-04
Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof Grant 9,799,589 - Do , et al. October 24, 2	2017-10-24
Integrated circuit packaging system with unplated leadframe and method of manufacture thereof Grant 9,620,480 - Dimaculangan , et al. April 11, 2	2017-04-11
Integrated circuit packaging system with routable trace and method of manufacture thereof Grant 9,576,873 - Do , et al. February 21, 2	2017-02-21
Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device Grant 9,525,080 - Camacho , et al. December 20, 2	2016-12-20
Semiconductor Device and Method of Forming a Package In-Fan Out Package App 20160300817 - Do; Byung Tai ; et al.	2016-10-13
Optical semiconductor device having pre-molded leadframe with window and method therefor Grant 9,397,236 - Camacho , et al. July 19, 2	2016-07-19
Integrated circuit packaging system with external interconnect and method of manufacture thereof Grant 9,324,641 - Do , et al. April 26, 2	2016-04-26
Integrated circuit packaging system with transferable trace lead frame Grant 9,324,584 - Do , et al. April 26, 2	2016-04-26
Integrated circuit packaging system with electrical interface and method of manufacture thereof Grant 9,305,873 - Do , et al. April 5, 2	2016-04-05
Integrated circuit packaging system with terminals and method of manufacture thereof Grant 9,219,029 - Do , et al. December 22, 2	2015-12-22
Integrated circuit packaging system with leadframe and method of manufacture thereof Grant 9,190,349 - Do , et al. November 17, 2	2015-11-17
Integrated circuit packaging system with trace protection layer and method of manufacture thereof Grant 9,177,897 - Do , et al. November 3, 2	2015-11-03
Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof Grant 9,147,662 - Do , et al. September 29, 2	2015-09-29
Coreless integrated circuit packaging system and method of manufacture thereof Grant 9,142,530 - Do , et al. September 22, 2	2015-09-22
Leadframe system with warp control mechanism and method of manufacture thereof Grant 9,123,712 - Do , et al. September 1, 2	2015-09-01
Integrated circuit packaging system with routable traces and method of manufacture thereof Grant 9,105,620 - Do , et al. August 11, 2	2015-08-11
Integrated Circuit Packaging System With Vialess Substrate And Method Of Manufacture Thereof App 20150179555 - Kim; Sung Soo ; et al.	2015-06-25
Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof Grant 8,987,064 - Do , et al. March 24, 2	2015-03-24
Integrated circuit packaging system with thermal structures and method of manufacture thereof Grant 8,963,320 - Do , et al. February 24, 2	2015-02-24
Integrated circuit packaging system with thermal emission and method of manufacture thereof Grant 8,957,509 - Do , et al. February 17, 2	2015-02-17
Integrated circuit packaging system with trenched leadframe and method of manufacture thereof Grant 8,937,379 - Do , et al. January 20, 2	2015-01-20
Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device Grant 8,866,248 - Camacho , et al. October 21, 2	2014-10-21
Coreless Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20140284791 - Do; Byung Tai ; et al.	2014-09-25
Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof Grant 8,841,173 - Do , et al. September 23, 2	2014-09-23
Integrated circuit packaging system with island terminals and method of manufacture thereof Grant 8,802,501 - Camacho , et al. August 12, 2	2014-08-12
Integrated circuit packaging system with routable circuitry and method of manufacture thereof Grant 8,791,556 - Do , et al. July 29, 2	2014-07-29
Integrated circuit packaging system with leads and transposer and method of manufacture thereof Grant 8,786,063 - Camacho , et al. July 22, 2	2014-07-22
Integrated Circuit Packaging System With Molded Grid-array Mechanism And Method Of Manufacture Thereof App 20140197548 - Do; Byung Tai ; et al.	2014-07-17
Integrated circuit mounting system with paddle interlock and method of manufacture thereof Grant 8,779,565 - Han , et al. July 15, 2	2014-07-15
Integrated circuit packaging system with electrical interface and method of manufacture thereof Grant 8,759,159 - Do , et al. June 24, 2	2014-06-24
Integrated Circuit Packaging System With Routable Grid Array Lead Frame App 20140165389 - DO; Byung Tai ; et al.	2014-06-19
Integrated Circuit Packaging System With Transferable Trace Lead Frame App 20140167236 - DO; Byung Tai ; et al.	2014-06-19
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof Grant 8,735,224 - Do , et al. May 27, 2	2014-05-27
Integrated circuit packaging system with a leaded package and method of manufacture thereof Grant 8,729,693 - Camacho , et al. May 20, 2	2014-05-20
Integrated circuit packaging system with die paddle and method of manufacture thereof Grant 8,669,654 - Do , et al. March 11, 2	2014-03-11
Integrated circuit packaging system with stacked paddle and method of manufacture thereof Grant 8,664,038 - Camacho , et al. March 4, 2	2014-03-04
Integrated circuit packaging system with formed interconnects and method of manufacture thereof Grant 8,658,470 - Do , et al. February 25, 2	2014-02-25
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,633,063 - Do , et al. January 21, 2	2014-01-21
Integrated circuit packaging system with contacts and method of manufacture thereof Grant 8,629,567 - Do , et al. January 14, 2	2014-01-14
Integrated Circuit Packaging System With Grid-array Mechanism And Method Of Manufacture Thereof App 20140008774 - Do; Byung Tai ; et al.	2014-01-09
Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor App 20140011315 - Camacho; Zigmund R. ; et al.	2014-01-09
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,623,711 - Do , et al. January 7, 2	2014-01-07
Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Grant 8,623,708 - Do , et al. January 7, 2	2014-01-07
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,592,252 - Bathan , et al. November 26, 2	2013-11-26
Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof Grant 8,569,112 - Do , et al. October 29, 2	2013-10-29
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,557,638 - Do , et al. October 15, 2	2013-10-15
Integrated Circuit Packaging System With Routable Circuitry And Method Of Manufacture Thereof App 20130256861 - Do; Byung Tai ; et al.	2013-10-03
Integrated Circuit Packaging System With External Interconnect And Method Of Manufacture Thereof App 20130249068 - Do; Byung Tai ; et al.	2013-09-26
Integrated Circuit Packaging System With Encapsulation And Leadframe Etching And Method Of Manufacture Thereof App 20130249065 - Do; Byung Tai ; et al.	2013-09-26
Integrated Circuit Packaging System With A Grid Array With A Leadframe And Method Of Manufacture Thereof App 20130249118 - Do; Byung Tai ; et al.	2013-09-26
Integrated Circuit Packaging System With Terminals And Method Of Manufacture Thereof App 20130249077 - Do; Byung Tai ; et al.	2013-09-26
Integrated circuit packaging system with leads and method of manufacture thereof Grant 8,525,325 - Do , et al. September 3, 2	2013-09-03
Integrated circuit packaging system with lead encapsulation and method of manufacture thereof Grant 8,519,518 - Do , et al. August 27, 2	2013-08-27
Integrated circuit packaging system with pad and method of manufacture thereof Grant 8,513,788 - Do , et al. August 20, 2	2013-08-20
Integrated Circuit Packaging System With Contacts And Method Of Manufacture Thereof App 20130154118 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Pad And Method Of Manufacture Thereof App 20130154072 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof App 20130154080 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Routable Trace And Method Of Manufacture Thereof App 20130154105 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Terminals And Method Of Manufacture Thereof App 20130154119 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20130154120 - Do; Byung Tai ; et al.	2013-06-20
Integrated Circuit Packaging System With Leadframe Lead Array Routing And Method Of Manufacture Thereof App 20130099365 - Do; Byung Tai ; et al.	2013-04-25
Integrated Circuit Packaging System With Planarity Control And Method Of Manufacture Thereof App 20130099367 - Do; Byung Tai ; et al.	2013-04-25
Integrated Circuit Packaging System With Thermal Structures And Method Of Manufacture Thereof App 20130087902 - Do; Byung Tai ; et al.	2013-04-11
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,399,991 - Bathan , et al. March 19, 2	2013-03-19
Integrated Circuit Packaging System With Thermal Emission And Method Of Manufacture Thereof App 20120326284 - Do; Byung Tai ; et al.	2012-12-27
Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device App 20120286400 - Camacho; Zigmund R. ; et al.	2012-11-15
Integrated Circuit Packaging System With Formed Interconnects And Method Of Manufacture Thereof App 20120280408 - Do; Byung Tai ; et al.	2012-11-08
Integrated Circuit Packaging System With Routed Circuit Lead Array And Method Of Manufacture Thereof App 20120280390 - Do; Byung Tai ; et al.	2012-11-08
Integrated Circuit Packaging System With Electrical Interface And Method Of Manufacture Thereof App 20120280407 - Do; Byung Tai ; et al.	2012-11-08
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120280376 - Do; Byung Tai ; et al.	2012-11-08
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120280377 - Do; Byung Tai ; et al.	2012-11-08
Integrated circuit package system with chip on lead Grant 8,269,324 - Trasporto , et al. September 18, 2	2012-09-18
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,252,666 - Bathan , et al. August 28, 2	2012-08-28
Integrated Circuit Packaging System With Terminal Locks And Method Of Manufacture Thereof App 20120205811 - Do; Byung Tai ; et al.	2012-08-16
Integrated Circuit Mounting System With Paddle Interlock And Method Of Manufacture Thereof App 20120146192 - Han; Byung Joon ; et al.	2012-06-14
Integrated Circuit Packaging System With Lead Encapsulation And Method Of Manufacture Thereof App 20120074547 - Do; Byung Tai ; et al.	2012-03-29
Optical semiconductor device having pre-molded leadframe with window and method therefor Grant 8,138,027 - Camacho , et al. March 20, 2	2012-03-20
Integrated circuit package system with concave terminal Grant 8,134,242 - Camacho , et al. March 13, 2	2012-03-13
Integrated Circuit Packaging System With Die Paddle And Method Of Manufacture Thereof App 20120032315 - Do; Byung Tai ; et al.	2012-02-09
Integrated Circuit Packaging System With Island Terminals And Method Of Manufacture Thereof App 20120018866 - Camacho; Zigmund Ramirez ; et al.	2012-01-26
Integrated Circuit Packaging System With Molded Interconnects And Method Of Manufacture Thereof App 20110316163 - Do; Byung Tai ; et al.	2011-12-29
Integrated circuit package system with leadfinger support Grant 8,022,514 - Bathan , et al. September 20, 2	2011-09-20
Mountable integrated circuit package-in-package system Grant 7,977,779 - Camacho , et al. July 12, 2	2011-07-12
Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof Grant 7,919,850 - Trasporto , et al. April 5, 2	2011-04-05
Integrated circuit packaging system with circuitry stacking and method of manufacture thereof Grant 7,919,360 - Camacho , et al. April 5, 2	2011-04-05
Integrated Circuit Packaging System With Circuitry Stacking And Method Of Manufacture Thereof App 20110068447 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Integrated Circuit Packaging System With A Leaded Package And Method Of Manufacture Thereof App 20110068458 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device App 20110049662 - Camacho; Zigmund R. ; et al.	2011-03-03
Integrated circuit package system with multiple molding Grant 7,871,863 - Camacho , et al. January 18, 2	2011-01-18
Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device Grant 7,851,246 - Camacho , et al. December 14, 2	2010-12-14
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100308467 - Bathan; Henry Descalzo ; et al.	2010-12-09
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100308459 - Bathan; Henry Descalzo ; et al.	2010-12-09
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100311206 - Bathan; Henry Descalzo ; et al.	2010-12-09
Integrated Circuit Packaging System With Leads And Transposer And Method Of Manufacture Thereof App 20100289128 - Camacho; Zigmund Ramirez ; et al.	2010-11-18
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 7,790,576 - Bathan , et al. September 7, 2	2010-09-07
Integrated Circuit Packaging System With Stacked Paddle And Method Of Manufacture Thereof App 20100140763 - Camacho; Zigmund Ramirez ; et al.	2010-06-10
Integrated Circuit Packaging System With Exposed Terminal Interconnects And Method Of Manufacture Thereof App 20100140789 - Trasporto; Arnel Senosa ; et al.	2010-06-10
Integrated Circuit Package System With Concave Terminal App 20100029046 - Camacho; Zigmund Ramirez ; et al.	2010-02-04
Integrated Circuit Package System With Chip On Lead App 20100006993 - Trasporto; Arnel Senosa ; et al.	2010-01-14
Mountable Integrated Circuit Package-in-package System App 20090302452 - Camacho; Zigmund Ramirez ; et al.	2009-12-10
Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor App 20090224386 - Camacho; Zigmund R. ; et al.	2009-09-10
Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device App 20090166785 - Camacho; Zigmund R. ; et al.	2009-07-02
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20090140394 - Bathan; Henry Descalzo ; et al.	2009-06-04