loadpatents
name:-1.6933319568634
name:-0.15514206886292
name:-0.028929948806763
Thomas; Terence M. Patent Filings

Thomas; Terence M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Thomas; Terence M..The latest application filed is for "chemical mechanical polishing composition and methods relating thereto".

Company Profile
0.23.33
  • Thomas; Terence M. - Newark DE
  • Thomas; Terence M. - Arvada CO
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Low-stain polishing composition
Grant 9,633,865 - Thomas , et al. April 25, 2
2017-04-25
Chemical mechanical polishing composition and methods relating thereto
Grant 8,563,436 - Ghosh , et al. October 22, 2
2013-10-22
Chemical mechanical polishing composition and methods relating thereto
Grant 8,540,893 - Ghosh , et al. September 24, 2
2013-09-24
Chemical Mechanical Polishing Composition And Methods Relating Thereto
App 20130217230 - Ghosh; Tirthankar ;   et al.
2013-08-22
Polymeric barrier removal polishing slurry
Grant 7,785,487 - Thomas , et al. August 31, 2
2010-08-31
Chemical mechanical polishing composition and methods relating thereto
App 20100029079 - Ghosh; Tirthankar ;   et al.
2010-02-04
Low-stain polishing composition
App 20090215265 - Thomas; Terence M. ;   et al.
2009-08-27
Polishing Copper-Containing patterned wafers
App 20090215266 - Thomas; Terence M. ;   et al.
2009-08-27
Alkaline barrier polishing slurry
App 20080276543 - Thomas; Terence M. ;   et al.
2008-11-13
Copper polishing cleaning solution
Grant 7,387,964 - So , et al. June 17, 2
2008-06-17
Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasive
App 20080029126 - Thomas; Terence M.
2008-02-07
Polishing compositions for noble metals
Grant 7,270,762 - Wang , et al. September 18, 2
2007-09-18
Barrier polishing solution
Grant 7,253,111 - Liu , et al. August 7, 2
2007-08-07
Polymeric barrier removal polishing slurry
App 20070051917 - Thomas; Terence M. ;   et al.
2007-03-08
Tungsten polishing solution
Grant 7,132,058 - Thomas , et al. November 7, 2
2006-11-07
CMP system for metal deposition
Grant 7,084,059 - Thomas , et al. August 1, 2
2006-08-01
Polishing composition
Grant 7,070,485 - Lack , et al. July 4, 2
2006-07-04
Multi-step polishing solution for chemical mechanical planarization
Grant 6,971,945 - Liu , et al. December 6, 2
2005-12-06
Barrier polishing solution
App 20050236601 - Liu, Zhendong ;   et al.
2005-10-27
Multi-step Polishing Solution For Chemical Mechanical Planarization
App 20050194357 - Liu, Zhendong ;   et al.
2005-09-08
Method for planarizing metal interconnects
Grant 6,936,541 - Bian , et al. August 30, 2
2005-08-30
Compositions and methods for low downforce pressure polishing of copper
App 20050136671 - Goldberg, Wendy B. ;   et al.
2005-06-23
Compositions and methods for controlled polishing of copper
App 20050136670 - Ameen, Joseph G. ;   et al.
2005-06-23
Compositions and methods for polishing copper
App 20050104048 - Thomas, Terence M. ;   et al.
2005-05-19
Composition and method for polishing in metal CMP
Grant 6,699,299 - Sachan , et al. March 2, 2
2004-03-02
Method for planarizing metal interconnects
App 20040023492 - Bian, Jinru ;   et al.
2004-02-05
Semiconductor wafer with a resistant film
Grant 6,664,188 - Thomas December 16, 2
2003-12-16
Copper polishing cleaning solution
App 20030207778 - So, Joseph K. ;   et al.
2003-11-06
Polishing of semiconductor substrates
Grant 6,641,631 - Thomas , et al. November 4, 2
2003-11-04
Composition and method for polishing in metal CMP
App 20030181046 - Sachan, Vikas ;   et al.
2003-09-25
Polishing compositions for noble metals
App 20030176072 - Wang, Hongyu ;   et al.
2003-09-18
Composition and method for polishing in metal CMP
Grant 6,616,717 - Sachan , et al. September 9, 2
2003-09-09
CMP system for metal deposition
App 20030166339 - Thomas, Terence M. ;   et al.
2003-09-04
Compositions for insulator and metal CMP and methods relating thereto
Grant 6,607,424 - Costas , et al. August 19, 2
2003-08-19
Polishing of metal substrates
Grant 6,605,537 - Bian , et al. August 12, 2
2003-08-12
Dissolution of metal particles produced by polishing
Grant 6,602,112 - Tran , et al. August 5, 2
2003-08-05
Metal polishing slurry having a static etch inhibitor and method of formulation
App 20030139047 - Thomas, Terence M. ;   et al.
2003-07-24
Tungsten polishing solution
App 20030139050 - Thomas, Terence M. ;   et al.
2003-07-24
Copper polishing cleaning solution
App 20030119692 - So, Joseph K. ;   et al.
2003-06-26
Adapting a semiconductor wafer for planarization
App 20030020141 - Thomas, Terence M.
2003-01-30
Polishing composition for CMP having abrasive particles
App 20030006396 - Wang, Hongyu ;   et al.
2003-01-09
Method and composition for polishing by CMP
App 20020146965 - Thomas, Terence M. ;   et al.
2002-10-10
Chemical mechanical polishing slurries for metal
Grant 6,447,373 - Lack , et al. September 10, 2
2002-09-10
Polishing compositions for noble metals
App 20020111027 - Sachan, Vikas ;   et al.
2002-08-15
Polishing of metal substrates
App 20020106897 - Bian, Jinru ;   et al.
2002-08-08
Polishing of semiconductor substrates
App 20020083650 - Thomas, Terence M. ;   et al.
2002-07-04
Polishing composition
App 20020062600 - Mandigo, Glenn C. ;   et al.
2002-05-30
Polishing by CMP for optimized planarization
App 20020042199 - Bian, Jinru ;   et al.
2002-04-11
Polishing compositions for noble metals
App 20020039839 - Thomas, Terence M. ;   et al.
2002-04-04
Control of removal rates in CMP
App 20020019202 - Thomas, Terence M. ;   et al.
2002-02-14
Polishing composition
App 20010044264 - Lack, Craig D. ;   et al.
2001-11-22
Dissolution of metal particles produced by polishing
App 20010039166 - Tran, Tony Quan ;   et al.
2001-11-08
Composition and method for polishing in metal CMP
App 20010024933 - Sachan, Vikas ;   et al.
2001-09-27
Method of bonding silver to glass and mirrors produced according to this method
Grant 4,547,432 - Pitts , et al. October 15, 1
1985-10-15

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