Test; Howard R

Patent Applications and Registrations

Patent applications and USPTO patent grants for Test; Howard R.The latest application filed is for "copper-metallized integrated circuits having electroless thick copper bond pads".

Company Profile

0.12.13

Test; Howard R - Plano TX
Test; Howard R. - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and method for bond pads of copper-metallized integrated circuits Grant 7,535,104 - Test , et al. May 19, 2	2009-05-19
Copper-metallized Integrated Circuits Having Electroless Thick Copper Bond Pads App 20080274294 - Test; Howard R. ; et al.	2008-11-06
Copper-metallized integrated circuits having electroless thick copper bond pads Grant 7,413,974 - Test , et al. August 19, 2	2008-08-19
Thermally Enhanced IC Package and Method App 20080157300 - Chuang; Shih-Fang ; et al.	2008-07-03
Wire bonded semiconductor device having low inductance and noise Grant 7,265,443 - Test , et al. September 4, 2	2007-09-04
Structure and Method for Bond Pads of Copper-Metallized Integrated Circuits App 20070176301 - Test; Howard R. ; et al.	2007-08-02
Structure and method for bond pads of copper-metallized integrated circuits Grant 7,217,656 - Test , et al. May 15, 2	2007-05-15
Structure and method for bond pads of copper-metallized integrated circuits App 20060267203 - Test; Howard R. ; et al.	2006-11-30
Wire bonded semiconductor device having low inductance and noise App 20060244154 - Test; Howard R. ; et al.	2006-11-02
Wire loop grid array package App 20050133928 - Howard, Gregory E. ; et al.	2005-06-23
Wire bonding process for copper-metallized integrated circuits App 20050106851 - Test, Howard R. ; et al.	2005-05-19
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process Grant 6,869,875 - Test March 22, 2	2005-03-22
Wire bonding process for copper-metallized integrated circuits Grant 6,800,555 - Test , et al. October 5, 2	2004-10-05
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process App 20040084511 - Test, Howard R.	2004-05-06
Nickel plating process having controlled hydrogen concentration App 20040018675 - Test, Howard R. ; et al.	2004-01-29
Nickel plating process having controlled hydrogen concentration Grant 6,619,538 - Test , et al. September 16, 2	2003-09-16
Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process Grant 6,616,967 - Test September 9, 2	2003-09-09
Micromechanical device contact terminals free of particle generation App 20030107137 - Stierman, Roger J. ; et al.	2003-06-12
Structure and method for bond pads of copper-metallized integrated circuits App 20030071319 - Stierman, Roger J. ; et al.	2003-04-17
Wire bonding process for copper-metallized integrated circuits App 20010035452 - Test, Howard R. ; et al.	2001-11-01
Structure and method for bond pads of copper-metallized integrated circuits App 20010033020 - Stierman, Roger J. ; et al.	2001-10-25
Wire bonded flip-chip assembly of semiconductor devices Grant 6,268,662 - Test , et al. July 31, 2	2001-07-31
Method for making an IC device using a single-headed bonder Grant 5,979,743 - Test November 9, 1	1999-11-09
Capillary designs and process for fine pitch ball bonding Grant 5,544,804 - Test , et al. August 13, 1	1996-08-13
Process of packaging a semiconductor device with reduced stress forces Grant 4,874,722 - Bednarz , et al. October 17, 1	1989-10-17

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