Tessera Technologies Hungary Kft.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tessera Technologies Hungary Kft..The latest application filed is for "reducing erroneous colors in edge areas with chromatic abberation".

Company Profile

0.11.15

Tessera Technologies Hungary Kft. - Budapest HU
Tessera Technologies Hungary Kft. - HU HU
Tessera Technologies Hungary Kft. - 1126 Budapest Ugocsa u. 4/B Budapest HU
Tessera Technologies Hungary Kft - HU HU

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reducing Erroneous Colors in Edge Areas with Chromatic Abberation App 20120008859 - Schwartz; Tomer	2012-01-12
Fixed Focal Length Optical Lens Architecture Providing A Customized Depth Of Focus Optical System App 20110115965 - Engelhardt; Kai ; et al.	2011-05-19
Integrated circuit device App 20100323475 - Badehi; Avner	2010-12-23
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating Grant 7,807,508 - Oganesian , et al. October 5, 2	2010-10-05
Stacked Microelectronic Assemblies Having Vias Extending Through Bond Pads App 20100230795 - Kriman; Moshe ; et al.	2010-09-16
Integrated circuit device Grant 7,781,240 - Badehi August 24, 2	2010-08-24
Methods and apparatus for packaging integrated circuit devices Grant 7,642,629 - Zilber , et al. January 5, 2	2010-01-05
Methods and apparatus for packaging integrated circuit devices Grant 7,495,341 - Zilber , et al. February 24, 2	2009-02-24
Methods and apparatus for packaging integrated circuit devices Grant 7,479,398 - Zilber , et al. January 20, 2	2009-01-20
Packaged integrated circuits and methods of producing thereof Grant 7,408,249 - Badihi August 5, 2	2008-08-05
Microelectronic assemblies having compliancy and methods therefor App 20080150121 - Oganesian; Vage ; et al.	2008-06-26
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating App 20080099900 - Oganesian; Vage ; et al.	2008-05-01
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating App 20080099907 - Oganesian; Vage ; et al.	2008-05-01
Methods and apparatus for packaging integrated circuit devices App 20080017879 - Zilber; Gil ; et al.	2008-01-24
Methods and apparatus for packaging integrated circuit devices App 20080012115 - Zilber; Gil ; et al.	2008-01-17
Methods and apparatus for packaging integrated circuit devices Grant 7,265,440 - Zilber , et al. September 4, 2	2007-09-04
Wafer level packaging to lidded chips App 20070190747 - Humpston; Giles ; et al.	2007-08-16
Wafer level chip packaging App 20070190691 - Humpston; Giles ; et al.	2007-08-16
Methods and apparatus for packaging integrated circuit devices App 20070138498 - Zilber; Gil ; et al.	2007-06-21
Methods and apparatus for packaging integrated circuit devices Grant 7,192,796 - Zilber , et al. March 20, 2	2007-03-20
Chip packages with covers App 20070040257 - Badehi; Avner Pierre	2007-02-22
Integrated circuit device App 20070040180 - Badehi; Avner	2007-02-22
Integrated circuit device App 20070042562 - Badehi; Avner	2007-02-22
Integrated circuit device Grant 7,157,742 - Badehi January 2, 2	2007-01-02
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced Grant 7,144,745 - Badehi December 5, 2	2006-12-05
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby Grant 7,033,664 - Zilber , et al. April 25, 2	2006-04-25

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