Teshirogi; Kazuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Teshirogi; Kazuo.The latest application filed is for "method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus".

Company Profile

0.26.29

Teshirogi; Kazuo - Kawasaki JP
Teshirogi; Kazuo - Yokohama N/A JP
TESHIROGI; Kazuo - Kawasaki-shi JP
Teshirogi, Kazuo - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus App 20150132865 - Mizukoshi; Masataka ; et al.	2015-05-14
Bonding apparatus and bonding method Grant 9,010,615 - Yoshimoto , et al. April 21, 2	2015-04-21
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus Grant 8,962,470 - Mizukoshi , et al. February 24, 2	2015-02-24
Bonding Apparatus And Bonding Method App 20140217153 - Yoshimoto; Kazuhiro ; et al.	2014-08-07
Method for manufacturing semiconductor device and surface protective tape Grant 8,444,799 - Fukaya , et al. May 21, 2	2013-05-21
Method of manufacturing semiconductor device with spraying fluid Grant 8,440,545 - Fukaya , et al. May 14, 2	2013-05-14
Film bonding method, film bonding apparatus, and semiconductor device manufacturing method Grant 8,016,973 - Shinjo , et al. September 13, 2	2011-09-13
Method For Manufacturing Semiconductor Device And Surface Protective Tape App 20110048615 - Fukaya; Hironori ; et al.	2011-03-03
Bonding Apparatus And Bonding Method App 20110011919 - Yoshimoto; Kazuhiro ; et al.	2011-01-20
Semiconductor wafer storage case and semiconductor wafer storing method Grant 7,857,140 - Shinjo , et al. December 28, 2	2010-12-28
Manufacturing method of semiconductor device Grant 7,820,487 - Teshirogi , et al. October 26, 2	2010-10-26
Semiconductor device, wiring substrate forming method, and substrate processing apparatus Grant 7,704,856 - Nakagawa , et al. April 27, 2	2010-04-27
Manufacturing method of semiconductor device Grant 7,655,505 - Teshirogi , et al. February 2, 2	2010-02-02
Semiconductor device, wiring substrate forming method, and substrate processing apparatus Grant 7,648,907 - Nakagawa , et al. January 19, 2	2010-01-19
Method Of Manufacturing Semiconductor Device App 20090239355 - FUKAYA; Hironori ; et al.	2009-09-24
Vacuum fixing jig for semiconductor device Grant 7,571,538 - Teshirogi , et al. August 11, 2	2009-08-11
Manufacturing Method Of Semiconductor Device App 20090186451 - TESHIROGI; Kazuo ; et al.	2009-07-23
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus App 20090186425 - MIZUKOSHI; Masataka ; et al.	2009-07-23
Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus Grant 7,563,343 - Teshirogi , et al. July 21, 2	2009-07-21
Semiconductor device, wiring substrate forming method, and substrate processing apparatus Grant 7,485,962 - Nakagawa , et al. February 3, 2	2009-02-03
Semiconductor device having transparent member and manufacturing method of the same Grant 7,479,627 - Yoshimoto , et al. January 20, 2	2009-01-20
Semiconductor device manufacturing method Grant 7,432,114 - Teshirogi , et al. October 7, 2	2008-10-07
Semiconductor Wafer Storage Case And Semiconductor Wafer Storing Method App 20080230438 - SHINJO; Yoshiaki ; et al.	2008-09-25
Jig for a semiconductor substrate Grant 7,395,847 - Teshirogi , et al. July 8, 2	2008-07-08
Semiconductor device, wiring substrate forming method, and substrate processing apparatus App 20070287282 - Nakagawa; Kanae ; et al.	2007-12-13
Semiconductor device manufacturing method App 20070231961 - Teshirogi; Kazuo ; et al.	2007-10-04
Bonding apparatus and bonding method App 20070215673 - Yoshimoto; Kazuhiro ; et al.	2007-09-20
Manufacturing method of semiconductor device App 20070196954 - Teshirogi; Kazuo ; et al.	2007-08-23
Film bonding method, film bonding apparatus, and semiconductor device manufacturing method App 20070196588 - Shinjo; Yoshiaki ; et al.	2007-08-23
Semiconductor device and manufacturing method of the same App 20070181792 - Yoshimoto; Kazuhiro ; et al.	2007-08-09
Semiconductor device, wiring substrate forming method, and substrate processing apparatus App 20070184646 - Nakagawa; Kanae ; et al.	2007-08-09
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig Grant 7,109,561 - Teshirogi , et al. September 19, 2	2006-09-19
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig App 20050221589 - Teshirogi, Kazuo ; et al.	2005-10-06
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig App 20050221587 - Teshirogi, Kazuo ; et al.	2005-10-06
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig App 20050221588 - Teshirogi, Kazuo ; et al.	2005-10-06
Method of making semiconductor device that has improved structural strength Grant 6,951,800 - Shinjo , et al. October 4, 2	2005-10-04
Semiconductor device, wiring substrate forming method, and substrate processing apparatus App 20050170640 - Nakagawa, Kanae ; et al.	2005-08-04
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus App 20050161814 - Mizukoshi, Masataka ; et al.	2005-07-28
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig Grant 6,902,944 - Teshirogi , et al. June 7, 2	2005-06-07
Flat-object holder and method of using the same App 20050085171 - Shimobeppu, Yuzo ; et al.	2005-04-21
Method and device of peeling semiconductor device using annular contact members Grant 6,824,643 - Yoshimoto , et al. November 30, 2	2004-11-30
Method of Manufacturing a Semiconductor Device and a Method for Fixing the Semiconductor Device Using Substrate Jig App 20040161882 - TESHIROGI, Kazuo ; et al.	2004-08-19
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig Grant 6,750,074 - Teshirogi , et al. June 15, 2	2004-06-15
Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus App 20040106301 - Teshirogi, Kazuo ; et al.	2004-06-03
Method and device of peeling semiconductor device using annular contact members App 20030075271 - Yoshimoto, Kazuhiro ; et al.	2003-04-24
Flat-object holder and method of using the same App 20030077993 - Shimobeppu, Yuzo ; et al.	2003-04-24
Semiconductor substrate jig and method of manufacturing a semiconductor device App 20030077854 - Teshirogi, Kazuo ; et al.	2003-04-24
Method of making semiconductor device that has improved structural strength App 20030077880 - Shinjo, Yoshiaki ; et al.	2003-04-24
Semiconductor device having protruding electrodes higher than a sealed portion Grant 6,528,348 - Ando , et al. March 4, 2	2003-03-04
Semiconductor device having protruding electrodes higher than a sealed portion App 20020074630 - Ando, Fumihiko ; et al.	2002-06-20
Semiconductor device having protruding electrodes higher than a sealed portion Grant 6,388,333 - Taniguchi , et al. May 14, 2	2002-05-14
Semiconductor chip removing and conveying method and device App 20010049160 - Watanabe, Mitsuhisa ; et al.	2001-12-06

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