| Patent | Date |
|---|
Detection of corrosion using dispersed embedded sensors
Grant 10,845,297 - Goodwin , et al. November 24, 2 | 2020-11-24 |
Electronic packages with three-dimensional conductive planes, and methods for fabrication
Grant 10,418,344 - Vick , et al. Sept | 2019-09-17 |
Detection Of Corrosion Using Dispersed Embedded Sensors
App 20190178784 - Goodwin; Scott ; et al. | 2019-06-13 |
Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
Grant 10,264,669 - Lewis , et al. | 2019-04-16 |
Detection of corrosion using dispersed embedded sensors
Grant 10,209,175 - Goodwin , et al. Feb | 2019-02-19 |
Electronic Packages With Three-dimensional Conductive Planes, And Methods For Fabrication
App 20180151542 - Vick; Erik Paul ; et al. | 2018-05-31 |
Electronic packages with three-dimensional conductive planes, and methods for fabrication
Grant 9,881,905 - Vick , et al. January 30, 2 | 2018-01-30 |
Electronic Packages With Three-dimensional Conductive Planes, And Methods For Fabrication
App 20170207198 - VICK; Eric Paul ; et al. | 2017-07-20 |
Flexible Electronic Assemblies With Embedded Electronic Devices And Methods For Their Fabrication
App 20170064810 - Lewis; Jay ; et al. | 2017-03-02 |
Detection Of Corrosion Using Dispersed Embedded Sensors
App 20170030825 - Goodwin; Scott ; et al. | 2017-02-02 |
Electronic devices utilizing contact pads with protrusions and methods for fabrication
Grant 9,257,335 - Vick , et al. February 9, 2 | 2016-02-09 |
Electronic Devices Utilizing Contact Pads With Protrusions And Methods For Fabrication
App 20150235898 - Vick; Erik ; et al. | 2015-08-20 |
Three dimensional interconnect structure and method thereof
Grant 8,975,753 - Williams , et al. March 10, 2 | 2015-03-10 |
Faraday cup array integrated with a readout IC and method for manufacture thereof
Grant 8,866,080 - Bower , et al. October 21, 2 | 2014-10-21 |
Die bonding utilizing a patterned adhesion layer
Grant 8,361,901 - Vick , et al. January 29, 2 | 2013-01-29 |
Three Dimensional Interconnect Structure And Method Thereof
App 20110298134 - Williams; Charles Kenneth ; et al. | 2011-12-08 |
Faraday Cup Array Integrated With A Readout Ic And Method For Manufacture Thereof
App 20110031388 - Bower; Christopher A. ; et al. | 2011-02-10 |
Selective Planarization Method And Devices Fabricated On Planarized Structures
App 20110017703 - Temple; Dorota ; et al. | 2011-01-27 |
Die Bonding Utilizing A Patterned Adhesion Layer
App 20100270685 - VICK; Erik P. ; et al. | 2010-10-28 |
Through-substrate power-conducting via with embedded capacitance
App 20090267183 - Temple; Dorota ; et al. | 2009-10-29 |
Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
App 20040201095 - Palmer, William Devereux ; et al. | 2004-10-14 |
High Sensitivity Polarized-light Discriminator Device
App 20030075767 - Lannon, John M. JR. ; et al. | 2003-04-24 |
Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
App 20030038344 - Palmer, William Devereux ; et al. | 2003-02-27 |
Closed-loop cold cathode current regulator
Grant 6,492,781 - Palmer , et al. December 10, 2 | 2002-12-10 |
Closed-loop cold cathode current regulator
App 20020130625 - Palmer, William Devereux ; et al. | 2002-09-19 |
Integrated Circuits And Microelectronic Structures Including One Or More Layers Of Germanium-containing Glass
App 20010048143 - Croswell, Robert T. ; et al. | 2001-12-06 |
Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed thereby
Grant 6,271,150 - Croswell , et al. August 7, 2 | 2001-08-07 |
Alternating cyclic pressure modulation process for selective area deposition
Grant 5,201,995 - Reisman , et al. April 13, 1 | 1993-04-13 |
Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages
Grant 5,145,714 - Reisman , et al. September 8, 1 | 1992-09-08 |
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