| Patent | Date |
|---|
Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor deposition
Grant 11,430,661 - Kuratomi , et al. August 30, 2 | 2022-08-30 |
Methods and apparatus for controlling contact resistance in cobalt-titanium structures
Grant 11,424,132 - Kuratomi , et al. August 23, 2 | 2022-08-23 |
Impurity removal in doped ALD tantalum nitride
Grant 11,410,881 - Li , et al. August 9, 2 | 2022-08-09 |
Metal Cap For Contact Resistance Reduction
App 20220231137 - Mebarki; Bencherki ; et al. | 2022-07-21 |
Physical vapor deposition (PVD) chamber with reduced arcing
Grant 11,393,665 - Du , et al. July 19, 2 | 2022-07-19 |
Methods and apparatus for processing a substrate
Grant 11,315,771 - Xie , et al. April 26, 2 | 2022-04-26 |
Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor deposition
Grant 11,313,034 - Zeng , et al. April 26, 2 | 2022-04-26 |
Methods and apparatus for filling a feature disposed in a substrate
Grant 11,289,329 - Li , et al. March 29, 2 | 2022-03-29 |
Methods And Apparatus For Intermixing Layer For Enhanced Metal Reflow
App 20220084882 - ZHONG; Lanlan ; et al. | 2022-03-17 |
Doping of metal barrier layers
Grant 11,270,911 - Chen , et al. March 8, 2 | 2022-03-08 |
Deposition Of Metal Films With Tungsten Liner
App 20220028793 - Lei; Yu ; et al. | 2022-01-27 |
Ruthenium Liner And Cap For Back-end-of-line Applications
App 20220028795 - Xu; Wenjing ; et al. | 2022-01-27 |
Methods And Apparatus For Processing A Substrate
App 20220020578 - XIE; Xiangjin ; et al. | 2022-01-20 |
Methods And Apparatus For Controlling Ion Fraction In Physical Vapor Deposition Processes
App 20220020577 - WANG; Xiaodong ; et al. | 2022-01-20 |
Methods and apparatus for semi-dynamic bottom up reflow
Grant 11,222,816 - Zhong , et al. January 11, 2 | 2022-01-11 |
Impurity Removal in Doped ALD Tantalum Nitride
App 20210407853 - Li; Rui ; et al. | 2021-12-30 |
Methods And Apparatus For Semi-dynamic Bottom Up Reflow
App 20210391214 - ZHONG; Lanlan ; et al. | 2021-12-16 |
Overhang Reduction Using Pulsed Bias
App 20210391176 - Mebarki; Bencherki ; et al. | 2021-12-16 |
Methods And Apparatus For Precleaning And Treating Wafer Surfaces
App 20210371972 - XIE; Xiangjin ; et al. | 2021-12-02 |
Directional Selective Junction Clean With Field Polymer Protections
App 20210366722 - Lei; Yu ; et al. | 2021-11-25 |
Doping Of Metal Barrier Layers
App 20210351072 - Chen; Lu ; et al. | 2021-11-11 |
Binary Metal Liner Layers
App 20210351136 - Shen; Gang ; et al. | 2021-11-11 |
Deposition of metal films with tungsten liner
Grant 11,171,045 - Lei , et al. November 9, 2 | 2021-11-09 |
Metal Oxide Preclean Chamber With Improved Selectivity And Flow Conductance
App 20210343508 - NGUYEN; Andrew ; et al. | 2021-11-04 |
Selective Oxidation And Simplified Pre-clean
App 20210287898 - Mebarki; Bencherki ; et al. | 2021-09-16 |
Processing system and method of forming a contact
Grant 11,114,320 - Thareja , et al. September 7, 2 | 2021-09-07 |
Methods and apparatus for substrate edge uniformity
Grant 11,056,325 - Nguyen , et al. July 6, 2 | 2021-07-06 |
Methods and apparatus for controlling ion fraction in physical vapor deposition processes
Grant 11,037,768 - Wang , et al. June 15, 2 | 2021-06-15 |
PVD buffer layers for LED fabrication
Grant 11,011,676 - Zhu , et al. May 18, 2 | 2021-05-18 |
Method For Depositing High Quality Pvd Films
App 20210123156 - YANG; Zihao ; et al. | 2021-04-29 |
Method Of Depositing Layers
App 20210118729 - PETHE; Shirish ; et al. | 2021-04-22 |
Film quality control in a linear scan physical vapor deposition process
Grant 10,950,448 - Mebarki , et al. March 16, 2 | 2021-03-16 |
Methods And Apparatus For Controlling Ion Fraction In Physical Vapor Deposition Processes
App 20210071294 - WANG; Xiaodong ; et al. | 2021-03-11 |
Methods and apparatus for patterning substrates using asymmetric physical vapor deposition
Grant 10,927,451 - Mebarki , et al. February 23, 2 | 2021-02-23 |
Methods and apparatus for patterning substrates using asymmetric physical vapor deposition
Grant 10,927,450 - Mebarki , et al. February 23, 2 | 2021-02-23 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20200357616 - ALLEN; Adolph Miller ; et al. | 2020-11-12 |
Methods And Apparatus For Filling A Feature Disposed In A Substrate
App 20200350159 - LI; Rui ; et al. | 2020-11-05 |
Method and apparatus for asymmetric selective physical vapor deposition
Grant 10,815,561 - Lee , et al. October 27, 2 | 2020-10-27 |
High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process
Grant 10,763,090 - Allen , et al. Sep | 2020-09-01 |
Methods And Apparatus For Patterning Substrates Using Asymmetric Physical Vapor Deposition
App 20200255937 - MEBARKI; BENCHERKI ; et al. | 2020-08-13 |
Systems and methods for low resistivity physical vapor deposition of a tungsten film
Grant 10,734,235 - Ramalingam , et al. | 2020-08-04 |
Process kit shield for improved particle reduction
Grant 10,718,049 - Rasheed , et al. | 2020-07-21 |
Method and apparatus for depositing cobalt in a feature
Grant 10,714,388 - Park , et al. | 2020-07-14 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20200219720 - SHEU; BEN-LI ; et al. | 2020-07-09 |
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers
Grant 10,707,122 - Kesapragada , et al. | 2020-07-07 |
Methods And Apparatus For Enhancing Selectivity Of Titanium And Titanium Silicides During Chemical Vapor Deposition
App 20200211852 - KURATOMI; TAKASHI ; et al. | 2020-07-02 |
Methods Of Cleaning An Oxide Layer In A Film Stack To Eliminate Arcing During Downstream Processing
App 20200203144 - DU; CHAO ; et al. | 2020-06-25 |
Processing System And Method Of Forming A Contact
App 20200203481 - THAREJA; Gaurav ; et al. | 2020-06-25 |
Methods And Apparatus For Patterning Substrates Using Asymmetric Physical Vapor Deposition
App 20200199741 - MEBARKI; BENCHERKI ; et al. | 2020-06-25 |
Methods And Apparatus For Controlling Contact Resistance In Cobalt-titanium Structures
App 20200144073 - KURATOMI; TAKASHI ; et al. | 2020-05-07 |
Methods for asymmetric deposition of metal on high aspect ratio nanostructures
Grant 10,636,655 - Sheu , et al. | 2020-04-28 |
Arcing Test Vehicle And Method Of Use Thereof
App 20200105626 - LI; MINGDONG ; et al. | 2020-04-02 |
Methods and apparatus for dynamically treating atomic layer deposition films in physical vapor deposition chambers
Grant 10,563,304 - Xie , et al. Feb | 2020-02-18 |
Collimator For Selective Pvd Without Scanning
App 20200051798 - MEBARKI; BENCHERKI ; et al. | 2020-02-13 |
Physical Vapor Deposition ( Pvd) Chamber With Reduced Arcing
App 20200051795 - DU; CHAO ; et al. | 2020-02-13 |
Treatment And Doping Of Barrier Layers
App 20190385908 - Xie; Xiangjin ; et al. | 2019-12-19 |
Multi-zone Collimator For Selective Pvd
App 20190353919 - MEBARKI; BENCHERKI ; et al. | 2019-11-21 |
Deposition Of Metal Films
App 20190341302 - Lei; Yu ; et al. | 2019-11-07 |
Film Quality Control In A Linear Scan Physical Vapor Deposition Process
App 20190311905 - Mebarki; Bencherki ; et al. | 2019-10-10 |
Methods and apparatus for processing a substrate
Grant 10,431,440 - Wang , et al. O | 2019-10-01 |
Method And Apparatus Of Forming Structures By Symmetric Selective Physical Vapor Deposition
App 20190287772 - LEE; JOUNG JOO ; et al. | 2019-09-19 |
Apparatus And Methods For Asymmetric Deposition Of Metal On High Aspect Ratio Nanostructures
App 20190287791 - SHEU; BEN-LI ; et al. | 2019-09-19 |
Methods And Apparatus For Physical Vapor Deposition Using Directional Linear Scanning
App 20190276931 - Mebarki; Bencherki ; et al. | 2019-09-12 |
Method And Apparatus For Asymmetric Selective Physical Vapor Deposition
App 20190276926 - Lee; Joung Joo ; et al. | 2019-09-12 |
Methods And Apparatus For Physical Vapor Deposition Via Linear Scanning With Ambient Control
App 20190276929 - Mebarki; Bencherki ; et al. | 2019-09-12 |
Methods and devices using PVD ruthenium
Grant 10,388,532 - Ramalingam , et al. A | 2019-08-20 |
Low thermal budget crystallization of amorphous metal silicides
Grant 10,354,882 - Mebarki , et al. July 16, 2 | 2019-07-16 |
PVD Films For EUV Lithography
App 20190212656 - Dai; Huixiong ; et al. | 2019-07-11 |
Methods And Apparatus For Substrate Edge Uniformity
App 20190189407 - NGUYEN; THANH X. ; et al. | 2019-06-20 |
Methods And Apparatus For Physical Vapor Deposition
App 20190189465 - MILLER; KEITH A. ; et al. | 2019-06-20 |
Methods for pre-cleaning conductive materials on a substrate
Grant 10,283,345 - Xie , et al. | 2019-05-07 |
Method And Apparatus For Depositing Cobalt In A Feature
App 20190122924 - PARK; JIN HEE ; et al. | 2019-04-25 |
Method For Graded Anti-reflective Coatings By Physical Vapor Deposition
App 20190051768 - CAO; Yong ; et al. | 2019-02-14 |
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers
App 20190027403 - KESAPRAGADA; Sree Rangasai V. ; et al. | 2019-01-24 |
Method and apparatus for depositing cobalt in a feature
Grant 10,157,787 - Park , et al. Dec | 2018-12-18 |
Systems And Methods For Low Resistivity Physical Vapor Deposition Of A Tungsten Film
App 20180337052 - RAMALINGAM; Jothilingam ; et al. | 2018-11-22 |
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20180327893 - DING; Peijun ; et al. | 2018-11-15 |
Low Thermal Budget Crystallization Of Amorphous Metal Silicides
App 20180315609 - Mebarki; Bencherki ; et al. | 2018-11-01 |
Aluminum-nitride buffer and active layers by physical vapor deposition
Grant 10,109,481 - Zhu , et al. October 23, 2 | 2018-10-23 |
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers
Grant 10,109,520 - Kesapragada , et al. October 23, 2 | 2018-10-23 |
Barrier Film Deposition And Treatment
App 20180294162 - XIE; XIANGJIN ; et al. | 2018-10-11 |
Extended dark space shield
Grant 10,096,455 - Nguyen , et al. October 9, 2 | 2018-10-09 |
Method for graded anti-reflective coatings by physical vapor deposition
Grant 10,096,725 - Cao , et al. October 9, 2 | 2018-10-09 |
Sputtering target for PVD chamber
Grant 10,060,024 - Liu , et al. August 28, 2 | 2018-08-28 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 10,047,430 - Ding , et al. August 14, 2 | 2018-08-14 |
Systems and methods for low resistivity physical vapor deposition of a tungsten film
Grant 10,043,670 - Ramalingam , et al. August 7, 2 | 2018-08-07 |
Methods for forming cobalt-copper selective fill for an interconnect
Grant 10,014,179 - Tao , et al. July 3, 2 | 2018-07-03 |
Interconnect structures and methods of formation
Grant 9,984,976 - Cheng , et al. May 29, 2 | 2018-05-29 |
Methods For Depositing Amorphous Silicon Layers Or Silicon Oxycarbide Layers Via Physical Vapor Deposition
App 20180142343 - ZENG; Weimin ; et al. | 2018-05-24 |
Methods and apparatus for improved metal ion filtering
Grant 9,953,813 - Tang , et al. April 24, 2 | 2018-04-24 |
Methods and Devices Using PVD Ruthenium
App 20180096852 - Ramalingam; Jothilingam ; et al. | 2018-04-05 |
Process Kit Shield For Improved Particle Reduction
App 20180087147 - RASHEED; MUHAMMAD ; et al. | 2018-03-29 |
Sputtering Target for PVD Chamber
App 20170350001 - Liu; Zhendong ; et al. | 2017-12-07 |
Process kit shield for improved particle reduction
Grant 9,834,840 - Rasheed , et al. December 5, 2 | 2017-12-05 |
Methods for forming low resistivity interconnects
Grant 9,812,328 - Singh , et al. November 7, 2 | 2017-11-07 |
Methods And Apparatus For Controlling Ion Fraction In Physical Vapor Deposition Processes
App 20170253959 - WANG; Xiaodong ; et al. | 2017-09-07 |
Sputtering target for PVD chamber
Grant 9,752,228 - Liu , et al. September 5, 2 | 2017-09-05 |
Method And Apparatus For Depositing Cobalt In A Feature
App 20170178956 - PARK; Jin Hee ; et al. | 2017-06-22 |
Methods And Apparatus For Processing A Substrate
App 20170178877 - WANG; RONGJUN ; et al. | 2017-06-22 |
Systems And Methods For Low Resistivity Physical Vapor Deposition Of A Tungsten Film
App 20170117153 - RAMALINGAM; Jothilingam ; et al. | 2017-04-27 |
Target for PVD sputtering system
Grant 9,633,824 - Nguyen , et al. April 25, 2 | 2017-04-25 |
Methods for depositing dielectric films via physical vapor deposition processes
Grant 9,633,839 - Zeng , et al. April 25, 2 | 2017-04-25 |
Methods For Pre-cleaning Conductive Materials On A Substrate
App 20170098540 - XIE; Xiangjin ; et al. | 2017-04-06 |
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers
App 20170098575 - KESAPRAGADA; Sree Rangasai V. ; et al. | 2017-04-06 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20170029941 - ALLEN; Adolph Miller ; et al. | 2017-02-02 |
Methods For Forming Low Resistivity Interconnects
App 20160372371 - SINGH; Kaushal K. ; et al. | 2016-12-22 |
Methods For Depositing Dielectric Films Via Physical Vapor Deposition Processes
App 20160372319 - ZENG; Weimin ; et al. | 2016-12-22 |
High density TiN RF/DC PVD deposition with stress tuning
Grant 9,499,901 - Cao , et al. November 22, 2 | 2016-11-22 |
Pvd Buffer Layers For Led Fabrication
App 20160293798 - Zhu; Mingwei ; et al. | 2016-10-06 |
Methods for pre-cleaning conductive interconnect structures
Grant 9,460,959 - Xie , et al. October 4, 2 | 2016-10-04 |
Methods For Forming Cobalt-copper Selective Fill For An Interconnect
App 20160240432 - TAO; RONG ; et al. | 2016-08-18 |
Interconnect Structures And Methods Of Formation
App 20160240483 - CHENG; YANA ; et al. | 2016-08-18 |
PVD buffer layers for LED fabrication
Grant 9,396,933 - Zhu , et al. July 19, 2 | 2016-07-19 |
Apparatus and method for improved darkspace gap design in RF sputtering chamber
Grant 9,373,485 - Forster , et al. June 21, 2 | 2016-06-21 |
Variable radius dual magnetron
Grant 9,281,167 - Nguyen , et al. March 8, 2 | 2016-03-08 |
Methods And Apparatus For Improved Metal Ion Filtering
App 20150357171 - TANG; XIANMIN ; et al. | 2015-12-10 |
Aluminum-nitride Buffer And Active Layers By Physical Vapor Deposition
App 20150348773 - ZHU; Mingwei ; et al. | 2015-12-03 |
PVD ALN film with oxygen doping for a low etch rate hardmask film
Grant 9,162,930 - Cao , et al. October 20, 2 | 2015-10-20 |
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
Grant 9,062,372 - Gopalraja , et al. June 23, 2 | 2015-06-23 |
Apparatus And Method For Improved Darkspace Gap Design In RF Sputtering Chamber
App 20150155143 - Forster; John C. ; et al. | 2015-06-04 |
Method And Apparatus For Film Deposition
App 20150136732 - TANG; Xianmin ; et al. | 2015-05-21 |
Method For Graded Anti-reflective Coatings By Physical Vapor Deposition
App 20150132551 - CAO; Yong ; et al. | 2015-05-14 |
Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning
Grant 9,017,533 - Forster , et al. April 28, 2 | 2015-04-28 |
Apparatus and method for improved darkspace gap design in RF sputtering chamber
Grant 8,992,747 - Forster , et al. March 31, 2 | 2015-03-31 |
Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target
Grant 8,992,741 - Wang , et al. March 31, 2 | 2015-03-31 |
Extended Dark Space Shield
App 20150075980 - NGUYEN; THANH ; et al. | 2015-03-19 |
Low resistivity tungsten PVD with enhanced ionization and RF power coupling
Grant 8,895,450 - Cao , et al. November 25, 2 | 2014-11-25 |
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20140305802 - DING; Peijun ; et al. | 2014-10-16 |
Methods for forming interconnect structures
Grant 8,841,211 - Lee , et al. September 23, 2 | 2014-09-23 |
Target For Pvd Sputtering System
App 20140251217 - NGUYEN; THANH X. ; et al. | 2014-09-11 |
Variable radius dual magnetron
App 20140238843 - Nguyen; Thanh X. ; et al. | 2014-08-28 |
Cu surface plasma treatment to improve gapfill window
Grant 8,764,961 - Luo , et al. July 1, 2 | 2014-07-01 |
Chamber Pasting Method In A Pvd Chamber For Reactive Re-sputtering Dielectric Material
App 20140110248 - CAO; Yong ; et al. | 2014-04-24 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 8,696,875 - Ding , et al. April 15, 2 | 2014-04-15 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering
Grant 8,668,816 - Ding , et al. March 11, 2 | 2014-03-11 |
Low Resistivity Tungsten Pvd With Enhanced Ionization And Rf Power Coupling
App 20140042016 - CAO; Yong ; et al. | 2014-02-13 |
Metal gate structures and methods for forming thereof
Grant 8,637,390 - Ganguli , et al. January 28, 2 | 2014-01-28 |
Method And Apparatus For Substrate Preclean With Hydrogen Containing High Frequency Rf Plasma
App 20130330920 - Liu; Guojun ; et al. | 2013-12-12 |
Magnetron design for RF/DC physical vapor deposition
Grant 8,580,094 - Wang , et al. November 12, 2 | 2013-11-12 |
Pvd Aln Film With Oxygen Doping For A Low Etch Rate Hardmask Film
App 20130296158 - CAO; Yong ; et al. | 2013-11-07 |
Pvd Buffer Layers For Led Fabrication
App 20130285065 - Zhu; Mingwei ; et al. | 2013-10-31 |
Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming
Grant 8,558,299 - Cao , et al. October 15, 2 | 2013-10-15 |
Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum
Grant 8,557,094 - Tang , et al. October 15, 2 | 2013-10-15 |
HIGH DENSITY TiN RF/DC PVD DEPOSITION WITH STRESS TUNING
App 20130199925 - CAO; YONG ; et al. | 2013-08-08 |
Encapsulated sputtering target
Grant 8,435,392 - Hawrylchak , et al. May 7, 2 | 2013-05-07 |
Pvd Process With Synchronized Process Parameters And Magnet Position
App 20120181166 - LUO; QIAN ; et al. | 2012-07-19 |
Encapsulated Sputtering Target
App 20120138457 - HAWRYLCHAK; LARA ; et al. | 2012-06-07 |
Encapsulated sputtering target
Grant 8,133,368 - Hawrylchak , et al. March 13, 2 | 2012-03-13 |
Substrate device having a tuned work function and methods of forming thereof
Grant 8,129,280 - Wang , et al. March 6, 2 | 2012-03-06 |
Control Of Plasma Profile Using Magnetic Null Arrangement By Auxiliary Magnets
App 20120024229 - LIU; GUOJUN ; et al. | 2012-02-02 |
Magnet For Physical Vapor Deposition Processes To Produce Thin Films Having Low Resistivity And Non-uniformity
App 20120027954 - LIU; ZHENDONG ; et al. | 2012-02-02 |
Magnetron Design For Rf/dc Physical Vapor Deposition
App 20110311735 - WANG; RONGJUN ; et al. | 2011-12-22 |
Low Resistivity Tungsten Pvd With Enhanced Ionization And Rf Power Coupling
App 20110303960 - CAO; YONG ; et al. | 2011-12-15 |
Methods For Forming Interconnect Structures
App 20110306200 - LEE; JOUNG JOO ; et al. | 2011-12-15 |
Metal Gate Structures And Methods For Forming Thereof
App 20110298062 - GANGULI; SESHADRI ; et al. | 2011-12-08 |
Process Kit Shield For Improved Particle Reduction
App 20110278165 - RASHEED; MUHAMMAD ; et al. | 2011-11-17 |
Apparatus and Method for Improved Darkspace Gap Design in RF Sputtering Chamber
App 20110220488 - Forster; John C. ; et al. | 2011-09-15 |
Substrate Device Having A Tuned Work Function And Methods Of Forming Thereof
App 20110018073 - WANG; RONGJUN ; et al. | 2011-01-27 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20100252417 - Allen; Adolph Miller ; et al. | 2010-10-07 |
Sputtering Target for PVD Chamber
App 20100252416 - Liu; Zhendong ; et al. | 2010-10-07 |
Encapsulated Sputtering Target
App 20100108500 - HAWRYLCHAK; LARA ; et al. | 2010-05-06 |
Pvd Cu Seed Overhang Re-sputtering With Enhanced Cu Ionization
App 20100096253 - Cao; Yong ; et al. | 2010-04-22 |
Cu Surface Plasma Treatment To Improve Gapfill Window
App 20100096273 - Luo; Qian ; et al. | 2010-04-22 |
Control Of Erosion Profile On A Dielectric Rf Sputter Target
App 20100089748 - C.FORSTER; JOHN ; et al. | 2010-04-15 |
Metal / metal nitride barrier layer for semiconductor device applications
Grant 7,687,909 - Ding , et al. March 30, 2 | 2010-03-30 |
Method For Ultra-uniform Sputter Deposition Using Simultaneous Rf And Dc Power On Target
App 20100032289 - WANG; RONGJUN ; et al. | 2010-02-11 |
Oxidized barrier layer
Grant 7,659,204 - Tang , et al. February 9, 2 | 2010-02-09 |
Apparatus For Controlling Radial Distribution Of Plasma Ion Density And Ion Energy At A Workpiece Surface By Multi-frequency Rf Impedance Tuning
App 20100012029 - FORSTER; John C. ; et al. | 2010-01-21 |
Apparatus And Method For Uniform Deposition
App 20090308732 - Cao; Yong ; et al. | 2009-12-17 |
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20090233438 - DING; Peijun ; et al. | 2009-09-17 |
Shields usable with an inductively coupled plasma reactor
Grant 7,569,125 - Gung , et al. August 4, 2 | 2009-08-04 |
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
Grant 7,504,006 - Gopalraja , et al. March 17, 2 | 2009-03-17 |
Method of depositing a diffusion barrier layer which provides an improved interconnect
App 20090053888 - Ding; Peijun ; et al. | 2009-02-26 |
Oxidized Barrier Layer
App 20080237029 - TANG; Xianmin ; et al. | 2008-10-02 |
Resputtered Copper Seed Layer
App 20080190760 - TANG; XIANMIN ; et al. | 2008-08-14 |
Self-ionized And Capacitively-coupled Plasma For Sputtering And Resputtering
App 20080142359 - GOPALRAJA; Praburam ; et al. | 2008-06-19 |
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering
App 20080110747 - DING; Peijun ; et al. | 2008-05-15 |
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch Uniformity and Magnetron Producing Sustained Self Sputtering of Ruthenium and Tantalum
App 20080083610 - Tang; Xianmin ; et al. | 2008-04-10 |
Metal / metal nitride barrier layer for semiconductor device applications
App 20070241458 - Ding; Peijun ; et al. | 2007-10-18 |
Etch and sidewall selectivity in plasma sputtering
App 20070209925 - Tang; Xianmin ; et al. | 2007-09-13 |
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
Grant 7,253,109 - Ding , et al. August 7, 2 | 2007-08-07 |
Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
App 20070059502 - Wang; Rongjun ; et al. | 2007-03-15 |
Simultaneous ion milling and sputter deposition
App 20070051622 - Tang; Xianmin ; et al. | 2007-03-08 |
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
Grant 7,041,201 - Gung , et al. May 9, 2 | 2006-05-09 |
Method of depositing low resistivity barrier layers for copper interconnects
App 20050272254 - Ding, Peijun ; et al. | 2005-12-08 |
Method and apparatus for forming a barrier layer on a substrate
App 20050252765 - Zhang, Hong ; et al. | 2005-11-17 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering
App 20050255691 - Ding, Peijun ; et al. | 2005-11-17 |
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system
App 20050208767 - Ding, Peijun ; et al. | 2005-09-22 |
Shields usable with an inductively coupled plasma reactor
App 20050199491 - Gung, Tza-Jing ; et al. | 2005-09-15 |
Method and apparatus for forming a barrier layer on a substrate
App 20050189217 - Zhang, Hong ; et al. | 2005-09-01 |
Method of depositing a TaN seed layer
Grant 6,911,124 - Tang , et al. June 28, 2 | 2005-06-28 |
Method and apparatus for forming a barrier layer on a substrate
Grant 6,887,786 - Zhang , et al. May 3, 2 | 2005-05-03 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering
App 20050006222 - Ding, Peijun ; et al. | 2005-01-13 |
Oblique ion milling of via metallization
App 20040222082 - Gopalraja, Praburam ; et al. | 2004-11-11 |
Shaping features in sputter deposition
App 20040140196 - Gopalraja, Praburam ; et al. | 2004-07-22 |
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
App 20040094402 - Gopalraja, Praburam ; et al. | 2004-05-20 |
Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
App 20040055880 - Gung, Tza-Jing ; et al. | 2004-03-25 |
Method and apparatus for sputter deposition
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