TAN; Yun Ling

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAN; Yun Ling.The latest application filed is for "integrated thin film resistor and memory device".

Company Profile

5.19.21

TAN; Yun Ling - Singapore SG
Tan; Yun Ling - Singappore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Thin Film Resistor And Memory Device App 20220208675 - GAN; Kah Wee ; et al.	2022-06-30
Thin film conductive material with conductive etch stop layer Grant 11,315,876 - Rao , et al. April 26, 2	2022-04-26
Via Structures Of Passive Semiconductor Devices App 20220093508 - RAO; XUESONG ; et al.	2022-03-24
Thin Film Conductive Material With Conductive Etch Stop Layer App 20210257300 - RAO; XUESONG ; et al.	2021-08-19
Methods for producing integrated circuits with magnets and a wet etchant for the same Grant 10,784,332 - Li , et al. Sept	2020-09-22
Methods of forming integrated circuits with solutions to interlayer dielectric void formation between gate structures Grant 10,566,441 - Nong , et al. Feb	2020-02-18
Methods For Producing Integrated Circuits With Magnets And A Wet Etchant For The Same App 20190296100 - Li; Liang ; et al.	2019-09-26
Method and device for reducing contamination for reliable bond pads Grant 10,410,854 - Mou , et al. Sept	2019-09-10
Methods Of Forming Integrated Circuits With Solutions To Interlayer Dielectric Void Formation Between Gate Structures App 20190252515 - Nong; Hao ; et al.	2019-08-15
Method And Device For Reducing Contamination For Reliable Bond Pads App 20190206676 - MOU; Honghui ; et al.	2019-07-04
Methods for removal of hard mask Grant 10,115,625 - Li , et al. October 30, 2	2018-10-30
Methods For Removal Of Hard Mask App 20180190537 - LI; Liang ; et al.	2018-07-05
Integrated circuits having nickel silicide contacts and methods for fabricating the same Grant 9,548,371 - Huang , et al. January 17, 2	2017-01-17
Method for forming through silicon via with wafer backside protection Grant 9,230,886 - Leong , et al. January 5, 2	2016-01-05
Integrated Circuits Having Nickel Silicide Contacts And Methods For Fabricating The Same App 20150311221 - Huang; Jingyan ; et al.	2015-10-29
Method For Forming Through Silicon Via With Wafer Backside Protection App 20150137359 - LEONG; Lup San ; et al.	2015-05-21
Method for forming through silicon via with wafer backside protection Grant 8,940,637 - Leong , et al. January 27, 2	2015-01-27
Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction Grant 8,860,142 - Poon , et al. October 14, 2	2014-10-14
High-K metal gate device Grant 8,853,796 - Teh , et al. October 7, 2	2014-10-07
Spacer profile engineering using films with continuously increased etch rate from inner to outer surface Grant 8,828,858 - Rao , et al. September 9, 2	2014-09-09
Method For Forming Through Silicon Via With Wafer Backside Protection App 20140008810 - Leong; Lup San ; et al.	2014-01-09
Spacer Profile Engineering Using Films With Continuously Increased Etch Rate From Inner To Outer Surface App 20130187202 - Rao; Xuesong ; et al.	2013-07-25
Step-like spacer profile Grant 8,492,236 - Rao , et al. July 23, 2	2013-07-23
Step-like Spacer Profile App 20130181259 - Rao; Xuesong ; et al.	2013-07-18
Method And Apparatus To Reduce Thermal Variations Within An Integrated Circuit Die Using Thermal Proximity Correction App 20130099321 - Poon; Debora Chyiu Hyia ; et al.	2013-04-25
High-k Metal Gate Device App 20120292719 - TEH; Young Way ; et al.	2012-11-22
Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction Grant 8,293,544 - Poon , et al. October 23, 2	2012-10-23
Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction App 20100019329 - Poon; Debora Chyiu Hyia ; et al.	2010-01-28
Semiconductor Device With Doped Transistor App 20080087958 - Verma; Purakh Raj ; et al.	2008-04-17
Semiconductor device and fabrication method Grant 7,326,609 - Verma , et al. February 5, 2	2008-02-05
Ultra-thin gate oxide through post decoupled plasma nitridation anneal Grant 7,176,094 - Zhong , et al. February 13, 2	2007-02-13
Semiconductor Device And Fabrication Method App 20060252188 - Verma; Purakh Raj ; et al.	2006-11-09
Ultra-thin gate oxide through post decoupled plasma nitridation anneal App 20030170956 - Zhong, Dong ; et al.	2003-09-11

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