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Patent applications and USPTO patent grants for Tan; Fong Liang.The latest application filed is for "flexible light emitting semiconductor device".
Patent | Date |
---|---|
Method of patterning a metal on a transparent conductor Grant 10,237,985 - Sebastian , et al. | 2019-03-19 |
Flexible Light Emitting Semiconductor Device App 20170290212 - Palaniswamy; Ravi ;   et al. | 2017-10-05 |
Flexible light emitting semiconductor device Grant 9,716,061 - Palaniswamy , et al. July 25, 2 | 2017-07-25 |
Flexible LED device and method of making Grant 9,698,563 - Palaniswamy , et al. July 4, 2 | 2017-07-04 |
Flexible LED device for thermal management Grant 9,674,938 - Palaniswamy , et al. June 6, 2 | 2017-06-06 |
Method Of Patterning A Metal On A Transparent Conductor App 20170135229 - Sebastian; Muthu ;   et al. | 2017-05-11 |
Flexible LED device with wire bond free die Grant 9,564,568 - Palaniswamy , et al. February 7, 2 | 2017-02-07 |
Flexible Led Device With Wire Bond Free Die App 20160049567 - PALANISWAMY; Ravi ;   et al. | 2016-02-18 |
Flexible LED device with wire bond free die Grant 9,179,543 - Palaniswamy , et al. November 3, 2 | 2015-11-03 |
Etching method and devices produced using the etching method Grant 9,023,229 - Sebastian , et al. May 5, 2 | 2015-05-05 |
Etching Method And Devices Produced Using The Etching Method App 20140124477 - Sebastian; Muthu ;   et al. | 2014-05-08 |
Flexible Led Device For Thermal Management And Method Of Making App 20140036461 - Palaniswamy; Ravi ;   et al. | 2014-02-06 |
Flexible Light Emitting Semiconductor Device App 20130320390 - Palaniswamy; Ravi ;   et al. | 2013-12-05 |
Flexible Led Device And Method Of Making App 20130294471 - Palaniswamy; Ravi ;   et al. | 2013-11-07 |
Flexible Led Device With Wire Bond Free Die App 20130213697 - Palaniswamy; Ravi ;   et al. | 2013-08-22 |
Flexible Circuit Coverfilm Adhesion Enhancement App 20110284268 - PALANISWAMY; RAVI ;   et al. | 2011-11-24 |
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