Tam; Samuel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tam; Samuel.The latest application filed is for "led back end assembly and method of manufacturing".

Company Profile

0.15.25

Tam; Samuel - Daly City CA
Tam; Samuel - Dale City CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
LED back end assembly and method of manufacturing Grant 9,748,460 - Tam , et al. August 29, 2	2017-08-29
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package Grant 9,312,150 - Ahmad , et al. April 12, 2	2016-04-12
Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections Grant 9,136,289 - Tam September 15, 2	2015-09-15
Method of and device for manufacturing LED assembly using liquid molding technologies Grant 9,041,019 - Tam , et al. May 26, 2	2015-05-26
Stacked packages using laser direct structuring Grant 9,018,749 - Tam , et al. April 28, 2	2015-04-28
Folded tape package for electronic devices Grant 8,913,180 - Tam December 16, 2	2014-12-16
Led Back End Assembly And Method Of Manufacturing App 20140239342 - Tam; Samuel ; et al.	2014-08-28
Method Of And Device For Manufacturing Led Assembly Using Liquid Molding Technologies App 20140117384 - Tam; Samuel ; et al.	2014-05-01
Stacked Packages Using Laser Direct Structuring App 20140110162 - TAM; Samuel ; et al.	2014-04-24
Method of fabricating stacked packages using laser direct structuring Grant 8,642,387 - Tam , et al. February 4, 2	2014-02-04
Camera Module Housing Having Molded Tape Substrate With Folded Leads App 20130128106 - Tam; Samuel ; et al.	2013-05-23
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20130113093 - Ahmad; Nazir ; et al.	2013-05-09
Stacked Packages Using Laser Direct Structuring App 20130105972 - Tam; Samuel ; et al.	2013-05-02
Folded Tape Package For Electronic Devices App 20130083239 - Tam; Samuel	2013-04-04
Camera Module Housing Having Built-in Conductive Traces To Accommodate Stacked Dies Using Flip Chip Connections App 20130050571 - Tam; Samuel	2013-02-28
Folded system-in-package with heat spreader Grant 8,385,073 - Tam , et al. February 26, 2	2013-02-26
Packaging Structure and Method App 20120217635 - Ahmad; Nazir ; et al.	2012-08-30
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20120049357 - Ahmad; Nazir ; et al.	2012-03-01
Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Grant 8,119,450 - Ahmad , et al. February 21, 2	2012-02-21
Packaging Structure and Method App 20120013005 - Ahmad; Nazir ; et al.	2012-01-19
Folded System-In-Package with Heat Spreader App 20110007479 - Tam; Samuel ; et al.	2011-01-13
Packaging Structure and Method App 20090227072 - Ahmad; Nazir ; et al.	2009-09-10
Packaging structure and method App 20060255474 - Ahmad; Nazir ; et al.	2006-11-16
Super-thin high speed flip chip package App 20050056944 - Pendse, Rajendra ; et al.	2005-03-17
Chip scale package with flip chip interconnect App 20040222440 - Pendse, Rajendra ; et al.	2004-11-11
Chip scale package with flip chip interconnect Grant 6,737,295 - Pendse , et al. May 18, 2	2004-05-18
Chip scale package with flip chip interconnect App 20020151189 - Pendse, Rajendra ; et al.	2002-10-17
Super-thin high speed flip chip package App 20020121707 - Pendse, Rajendra ; et al.	2002-09-05
Packaging structure and method App 20020014702 - Ahmad, Nazir ; et al.	2002-02-07

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