Talieh; Homayoun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Talieh; Homayoun.The latest application filed is for "roll-to-roll manufacturing of flexible thin film photovoltaic modules".

Company Profile

0.99.100

Talieh; Homayoun - San Jose CA
Talieh; Homayoun - Saratoga CA
Talieh; Homayoun - Cupertino CA
Talieh, Homayoun - San Josse CA
Talieh; Homayoun - Santa Clara County CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transcription and analysis of meeting recordings Grant 11,315,569 - Talieh , et al. April 26, 2	2022-04-26
Roll-to-roll Manufacturing Of Flexible Thin Film Photovoltaic Modules App 20110239450 - Basol; Bulent M. ; et al.	2011-10-06
Drum Design For Web Processing App 20100147677 - Pinarbasi; Mustafa ; et al.	2010-06-17
Method of forming contact layers on substrates Grant 7,704,880 - Uzoh , et al. April 27, 2	2010-04-27
System and method for electrochemical mechanical polishing Grant 7,648,622 - Basol , et al. January 19, 2	2010-01-19
Electropolishing system and process Grant 7,578,923 - Basol , et al. August 25, 2	2009-08-25
Electrochemical processing of conductive surface Grant 7,572,354 - Uzoh , et al. August 11, 2	2009-08-11
Method of making rolling electrical contact to wafer front surface Grant 7,491,308 - Talieh , et al. February 17, 2	2009-02-17
Apparatus for processing surface of workpiece with small electrodes and surface contacts Grant 7,476,304 - Ashjaee , et al. January 13, 2	2009-01-13
System for electropolishing and electrochemical mechanical polishing Grant 7,427,337 - Basol , et al. September 23, 2	2008-09-23
Electrochemical mechanical processing apparatus Grant 7,425,250 - Basol , et al. September 16, 2	2008-09-16
Method of forming contact layers on substrates Grant 7,416,975 - Uzoh , et al. August 26, 2	2008-08-26
Pad designs and structures for a versatile materials processing apparatus Grant 7,378,004 - Uzoh , et al. May 27, 2	2008-05-27
Electropolishing system and process App 20080099344 - Basol; Bulent M. ; et al.	2008-05-01
Apparatus for electroprocessing a workpiece surface Grant 7,341,649 - Talieh March 11, 2	2008-03-11
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,329,335 - Talieh , et al. February 12, 2	2008-02-12
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,311,811 - Talieh , et al. December 25, 2	2007-12-25
Method and apparatus for plating and polishing semiconductor substrate Grant 7,309,406 - Talieh , et al. December 18, 2	2007-12-18
Method and apparatus for forming an electrical contact with a semiconductor substrate Grant 7,309,407 - Talieh , et al. December 18, 2	2007-12-18
Providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,309,413 - Talieh , et al. December 18, 2	2007-12-18
Device providing electrical contact to the surface of a semiconductor workpiece during processing Grant 7,282,124 - Talieh , et al. October 16, 2	2007-10-16
Efficient wafer processing technology Grant 7,257,893 - Wang , et al. August 21, 2	2007-08-21
Method and system for optically enhanced metal planarization Grant 7,250,104 - Uzoh , et al. July 31, 2	2007-07-31
Method and system for electroprocessing conductive layers Grant 7,247,558 - Basol , et al. July 24, 2	2007-07-24
Method and system to provide electrical contacts for electrotreating processes Grant 7,244,347 - Basol , et al. July 17, 2	2007-07-17
Fabrication Of Semiconductor Interconnect Structures App 20070128851 - Basol; Bulent M. ; et al.	2007-06-07
Method and system to provide electrical contacts for electrotreating processes Grant 7,211,174 - Basol , et al. May 1, 2	2007-05-01
Method and system to provide electrical contacts for electrotreating processes Grant 7,211,186 - Basol , et al. May 1, 2	2007-05-01
Method and apparatus to deposit layers with uniform properties Grant 7,204,924 - Basol , et al. April 17, 2	2007-04-17
Integrated circuit interconnect fabrication systems Grant 7,204,743 - Basol , et al. April 17, 2	2007-04-17
Substrate polishing apparatus Grant 7,198,551 - Talieh April 3, 2	2007-04-03
Method of forming contact layers on substrates App 20070066054 - Uzoh; Cyprian E. ; et al.	2007-03-22
Efficient wafer processing technology App 20070050974 - Wang; Hung-Ming ; et al.	2007-03-08
Fabrication of semiconductor interconnect structures Grant 7,172,497 - Basol , et al. February 6, 2	2007-02-06
Integrated system for processing semiconductor wafers App 20070004316 - Ashjaee; Jalal ; et al.	2007-01-04
Chip interconnect and packaging deposition methods and structures Grant 7,147,766 - Uzoh , et al. December 12, 2	2006-12-12
Method and structure to improve reliability of copper interconnects Grant 7,129,165 - Basol , et al. October 31, 2	2006-10-31
Edge and bevel cleaning process and system Grant 7,122,473 - Ashjaee , et al. October 17, 2	2006-10-17
Apparatus with conductive pad for electroprocessing App 20060219573 - Uzoh; Cyprian Emeka ; et al.	2006-10-05
Method for electrochemically processing a workpiece Grant 7,115,510 - Basol , et al. October 3, 2	2006-10-03
Advanced chemical mechanical polishing system with smart endpoint detection Grant 7,097,538 - Talieh , et al. August 29, 2	2006-08-29
Electrochemical mechanical processing with advancible sweeper Grant 7,097,755 - Basol , et al. August 29, 2	2006-08-29
Method of wafer processing with edge seed layer removal App 20060137994 - Basol; Bulent M. ; et al.	2006-06-29
Integrated system for processing semiconductor wafers Grant 7,059,944 - Ashjaee , et al. June 13, 2	2006-06-13
Method and system for electroprocessing conductive layers App 20060121725 - Basol; Bulent M. ; et al.	2006-06-08
Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate App 20060118425 - Basol; Bulent M. ; et al.	2006-06-08
Chip interconnect and packaging deposition methods and structures App 20060070885 - Uzoh; Cyprian Emeka ; et al.	2006-04-06
Advanced chemical mechanical polishing system with smart endpoint detection App 20060063469 - Talieh; Homayoun ; et al.	2006-03-23
Method and apparatus for forming an electrical contact with a semiconductor substrate App 20060042934 - Talieh; Homayoun ; et al.	2006-03-02
Integrated system for processing semiconductor wafers App 20060035569 - Ashjaee; Jalal ; et al.	2006-02-16
Substrate polishing apparatus App 20060030244 - Talieh; Homayoun	2006-02-09
Apparatus of sealing wafer backside for full-face processing Grant 6,988,932 - Ashjaee , et al. January 24, 2	2006-01-24
Multi step electrodeposition process for reducing defects and minimizing film thickness App 20060011485 - Basol; Bulent M. ; et al.	2006-01-19
Method and apparatus for processing a substrate with minimal edge exclusion App 20060006060 - Basol; Bulent M. ; et al.	2006-01-12
System and method for electrochemical mechanical polishing App 20060006073 - Basol; Bulent M. ; et al.	2006-01-12
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization Grant 6,974,769 - Basol , et al. December 13, 2	2005-12-13
Method of making rolling electrical contact to wafer front surface App 20050269212 - Talieh, Homayoun ; et al.	2005-12-08
Method of using vertically configured chamber used for multiple processes Grant 6,969,456 - Volodarsky , et al. November 29, 2	2005-11-29
Method and apparatus for forming an electrical contact with a semiconductor substrate Grant 6,958,114 - Talieh , et al. October 25, 2	2005-10-25
Planar metal electroprocessing App 20050227483 - Basol, Bulent M. ; et al.	2005-10-13
Integrated system for processing semiconductor wafers Grant 6,953,392 - Ashjaee , et al. October 11, 2	2005-10-11
Substrate polishing apparatus Grant 6,951,507 - Talieh October 4, 2	2005-10-04
Multi step electrodeposition process for reducing defects and minimizing film thickness Grant 6,946,066 - Basol , et al. September 20, 2	2005-09-20
Method and apparatus for processing a substrate with minimal edge exclusion Grant 6,942,780 - Basol , et al. September 13, 2	2005-09-13
Fluid bearing slide assembly for workpiece polishing Grant 6,939,203 - Talieh , et al. September 6, 2	2005-09-06
Method and apparatus of sealing wafer backside for full-face electrochemical plating Grant 6,939,206 - Ashjaee , et al. September 6, 2	2005-09-06
Method and apparatus for avoiding particle accumulation in electrodeposition Grant 6,932,896 - Basol , et al. August 23, 2	2005-08-23
Apparatus and method for loading a wafer in polishing system Grant 6,932,679 - Talieh , et al. August 23, 2	2005-08-23
System for electrochemical mechanical polishing App 20050173260 - Basol, Bulent M. ; et al.	2005-08-11
System and method for electroless surface conditioning App 20050170080 - Basol, Bulent M. ; et al.	2005-08-04
Electroetching process and system App 20050145489 - Basol, Bulent M. ; et al.	2005-07-07
Apparatus for avoiding particle accumulation in electrochemical processing App 20050145484 - Basol, Bulent M. ; et al.	2005-07-07
System for electropolishing and electrochemical mechanical polishing App 20050133379 - Basol, Bulent M. ; et al.	2005-06-23
Electroetching methods and systems using chemical and mechanical influence App 20050133380 - Basol, Bulent M. ; et al.	2005-06-23
Chemical mechanical polishing endpoint detection Grant 6,908,374 - Wang , et al. June 21, 2	2005-06-21
Packaging deposition methods Grant 6,905,588 - Uzoh , et al. June 14, 2	2005-06-14
Method and apparatus for electro-chemical mechanical deposition Grant 6,902,659 - Talieh June 7, 2	2005-06-07
Adjustable gap chemical mechanical polishing method and apparatus App 20050118932 - Talieh, Homayoun ; et al.	2005-06-02
Vertically configured chamber used for multiple processes Grant 6,884,334 - Volodarsky , et al. April 26, 2	2005-04-26
Edge and bevel cleaning process and system App 20050079713 - Ashjaee, Jalal ; et al.	2005-04-14
Method for electrochemically processing a workpiece Grant 6,867,136 - Basol , et al. March 15, 2	2005-03-15
Method and structure to reduce defects in integrated circuits and substrates Grant 6,861,354 - Uzoh , et al. March 1, 2	2005-03-01
Method and system to provide electroplanarization of a workpiece with a conducting material layer App 20050042873 - Uzoh, Cyprian E. ; et al.	2005-02-24
Anode assembly for plating and planarizing a conductive layer App 20050040049 - Volodarsky, Rimma ; et al.	2005-02-24
Advanced chemical mechanical polishing system with smart endpoint detection Grant 6,857,947 - Wang , et al. February 22, 2	2005-02-22
Method and apparatus for plating and polishing semiconductor substrate App 20050034976 - Talieh, Homayoun ; et al.	2005-02-17
Method and apparatus for full surface electrotreating of a wafer App 20050034994 - Ashjaee, Jalal ; et al.	2005-02-17
Method of sealing wafer backside for full-face electrochemical plating Grant 6,855,037 - Ashjaee , et al. February 15, 2	2005-02-15
Method and system for optically enhanced metal planarization App 20050029123 - Uzoh, Cyprian E. ; et al.	2005-02-10
Electroetching process and system Grant 6,852,630 - Basol , et al. February 8, 2	2005-02-08
Method and apparatus for full surface electrotreating of a wafer Grant 6,852,208 - Ashjaee , et al. February 8, 2	2005-02-08
Electrochemical Mechanical Planarization Process And Apparatus App 20050016868 - Basol, Bulent M. ; et al.	2005-01-27
Method and apparatus for depositing and controlling the texture of a thin film Grant 6,837,979 - Uzoh , et al. January 4, 2	2005-01-04
Method of reducing post-CMP defectivity App 20040259348 - Basol, Bulent M. ; et al.	2004-12-23
Electroetching methods and systems using chemical and mechanical influence Grant 6,821,409 - Basol , et al. November 23, 2	2004-11-23
Method and structure for thru-mask contact electrodeposition Grant 6,815,354 - Uzoh , et al. November 9, 2	2004-11-09
Method and structure to improve reliability of copper interconnects App 20040219779 - Basol, Bulent M. ; et al.	2004-11-04
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20040195111 - Talieh, Homayoun ; et al.	2004-10-07
Apparatus for plating and polishing a semiconductor workpiece Grant 6,797,132 - Talieh , et al. September 28, 2	2004-09-28
Method and apparatus to deposit layers with uniform properties App 20040168926 - Basol, Bulent M. ; et al.	2004-09-02
Method of sealing wafer backside for full-face processing App 20040166789 - Ashjaee, Jalal ; et al.	2004-08-26
Method of supplying solution for electrochemical processes from double-cavity electrode housing App 20040163963 - Uzoh, Cyprian E. ; et al.	2004-08-26
Method and system to provide electroplanarization of a workpiece with a conducting material layer Grant 6,780,772 - Uzoh , et al. August 24, 2	2004-08-24
Edge and bevel cleaning process and system Grant 6,777,338 - Ashjaee , et al. August 17, 2	2004-08-17
Anode assembly for plating and planarizing a conductive layer Grant 6,773,576 - Volodarsky , et al. August 10, 2	2004-08-10
Continuous bleed-and-feed process and equipment App 20040142566 - Frey, Bernard ; et al.	2004-07-22
Workpiece proximity etching method and apparatus App 20040134793 - Uzoh, Cyprian Emeka ; et al.	2004-07-15
Integrated circuit interconnect fabrication systems and methods App 20040132381 - Basol, Bulent M. ; et al.	2004-07-08
Method and device to remove unwanted material from the edge region of a workpiece App 20040132295 - Basol, Bulent M. ; et al.	2004-07-08
Fluid bearing slide assembly for workpiece polishing App 20040087259 - Talieh, Homayoun ; et al.	2004-05-06
Advanced chemical mechanical polishing system with smart endpoint detection Grant 6,722,946 - Talieh , et al. April 20, 2	2004-04-20
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization App 20040052930 - Basol, Bulent ; et al.	2004-03-18
Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs Grant 6,695,962 - Uzoh , et al. February 24, 2	2004-02-24
Method and apparatus for simultaneously cleaning and annealing a workpiece Grant 6,692,588 - Uzoh , et al. February 17, 2	2004-02-17
Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers App 20040023607 - Talieh, Homayoun ; et al.	2004-02-05
Advanced chemical mechanical polishing system with smart endpoint detection App 20040023606 - Wang, Yuchun ; et al.	2004-02-05
Selective barrier removal slurry App 20040014399 - Wang, Yuchun ; et al.	2004-01-22
Electroetching system and process App 20040007478 - Basol, Bulent M. ; et al.	2004-01-15
Method for electro chemical mechanical deposition Grant 6,676,822 - Talieh January 13, 2	2004-01-13
Semiconductor workpiece proximity plating methods and apparatus Grant 6,666,959 - Uzoh , et al. December 23, 2	2003-12-23
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030217932 - Talieh, Homayoun ; et al.	2003-11-27
Method and system to provide material removal and planarization employing a reactive pad Grant 6,649,523 - Basol , et al. November 18, 2	2003-11-18
Method and apparatus for processing a substrate with minimal edge exclusion App 20030209429 - Basol, Bulent M. ; et al.	2003-11-13
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030209445 - Talieh, Homayoun ; et al.	2003-11-13
Device providing electrical contact to the surface of a semiconductor workpiece during processing App 20030209425 - Talieh, Homayoun ; et al.	2003-11-13
Workpeice proximity plating apparatus Grant 6,630,059 - Uzoh , et al. October 7, 2	2003-10-07
Electroetching methods and systems using chemical and mechanical influence App 20030178319 - Basol, Bulent M. ; et al.	2003-09-25
Integrated system for processing semiconductor wafers App 20030166382 - Ashjaee, Jalal ; et al.	2003-09-04
Chip interconnect and pacaging deposition methods and structures App 20030164302 - Uzoh, Cyprian Emeka ; et al.	2003-09-04
Method and structure to reduce defects in integrated circuits and substrates App 20030160326 - Uzoh, Cyprian E. ; et al.	2003-08-28
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate Grant 6,610,190 - Basol , et al. August 26, 2	2003-08-26
Advanced chemical mechanical polishing system with smart endpoint detection App 20030153245 - Talieh, Homayoun ; et al.	2003-08-14
Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein Grant 6,604,988 - Talieh , et al. August 12, 2	2003-08-12
Method and system to provide electroplanarization of a workpiece with a conducting material layer App 20030139053 - Uzoh, Cyprian E. ; et al.	2003-07-24
Planar metal electroprocessing App 20030119311 - Basol, Bulent M. ; et al.	2003-06-26
Electrochemical mechanical processing with advancible sweeper App 20030106807 - Basol, Bulent M. ; et al.	2003-06-12
Method and apparatus for electro-chemical mechanical deposition App 20030094364 - Talieh, Homayoun	2003-05-22
Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein App 20030096561 - Talieh, Homayoun ; et al.	2003-05-22
Method and system to provide electrical contacts for electrotreating processes App 20030089612 - Basol, Bulent M. ; et al.	2003-05-15
Method and system to provide electrical contacts for electrotreating processes App 20030089598 - Basol, Bulent M. ; et al.	2003-05-15
Method and system to provide electrical contacts for electrotreating processes App 20030089615 - Basol, Bulent M. ; et al.	2003-05-15
Method and structure for thru-mask contact electrodeposition App 20030080431 - Uzoh, Cyprian ; et al.	2003-05-01
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact App 20030070930 - Talieh, Homayoun ; et al.	2003-04-17
Multi step electrodeposition process for reducing defects and minimizing film thickness App 20030038038 - Basol, Bulent M. ; et al.	2003-02-27
Method and apparatus for full surface electrotreating of a wafer App 20030029731 - Ashjaee, Jalal ; et al.	2003-02-13
Fabrication of semiconductor interconnect structures App 20030032373 - Basol, Bulent M. ; et al.	2003-02-13
Substrate polishing apparatus App 20030032372 - Talieh, Homayoun	2003-02-13
Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein App 20030022605 - Talieh, Homayoun ; et al.	2003-01-30
Anode assembly for plating and planarizing a conductive layer App 20030015435 - Volodarsky, Rimma ; et al.	2003-01-23
Method and apparatus of sealing wafer backside for full-face electrochemical plating App 20030008602 - Ashjaee, Jalal ; et al.	2003-01-09
Method and apparatus for electro-chemical mechanical deposition App 20030006147 - Talieh, Homayoun	2003-01-09
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating Grant 6,497,800 - Talieh , et al. December 24, 2	2002-12-24
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Grant 6,482,307 - Ashjaee , et al. November 19, 2	2002-11-19
Anode assembly for plating and planarizing a conductive layer Grant 6,478,936 - Volodarsky , et al. November 12, 2	2002-11-12
Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs App 20020162750 - Uzoh, Cyprian E. ; et al.	2002-11-07
Method for forming an electrical contact with a semiconductor substrate Grant 6,471,847 - Talieh , et al. October 29, 2	2002-10-29
Electroetching process and system App 20020153097 - Basol, Bulent M. ; et al.	2002-10-24
Edge and bevel cleaning process and system App 20020155648 - Ashjaee, Jalal ; et al.	2002-10-24
Method and apparatus for depositing and controlling the texture of a thin film App 20020153256 - Uzoh, Cyprian Emeka ; et al.	2002-10-24
Method and apparatus for avoiding particle accumulation in electrodeposition App 20020139682 - Basol, Bulent M. ; et al.	2002-10-03
Pad designs and structures for a versatile materials processing apparatus App 20020130034 - Uzoh, Cyprian ; et al.	2002-09-19
Method of sealing wafer backside for full-face electrochemical plating App 20020127956 - Ashjaee, Jalal ; et al.	2002-09-12
Vertically configured chamber used for multiple processes App 20020121435 - Volodarsky, Konstantin ; et al.	2002-09-05
Integrated system for processing semiconductor wafers App 20020088543 - Ashjaee, Jalal ; et al.	2002-07-11
Method and apparatus for forming an electrical contact with a semiconductor substrate App 20020088715 - Talieh, Homayoun ; et al.	2002-07-11
Method and apparatus employing pad designs and structures with improved fluid distribution Grant 6,413,403 - Lindquist , et al. July 2, 2	2002-07-02
Method and apparatus for depositing and controlling the texture of a thin film Grant 6,409,904 - Uzoh , et al. June 25, 2	2002-06-25
Method and apparatus for electrochemical mechanical deposition Grant 6,402,925 - Talieh June 11, 2	2002-06-11
Method and system to provide material removal and planarization employing a reactive pad App 20020068456 - Basol, Bulent M. ; et al.	2002-06-06
Modified plating solution for plating and planarization and process utilizing same App 20020061715 - Uzoh, Cyprian ; et al.	2002-05-23
Vertically configured chamber used for multiple processes App 20020056646 - Volodarsky, Konstantin ; et al.	2002-05-16
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate App 20020053516 - Basol, Bulent M. ; et al.	2002-05-09
Packaging deposition methods App 20020033342 - Uzoh, Cyprian Emeka ; et al.	2002-03-21
Method for forming an electrical contact with a semiconductor substrate App 20020029978 - Talieh, Homayoun ; et al.	2002-03-14
Modified plating solution for plating and planarization and process utilizing same Grant 6,354,916 - Uzoh , et al. March 12, 2	2002-03-12
Vertically configured chamber used for multiple processes Grant 6,352,623 - Volodarsky , et al. March 5, 2	2002-03-05
Semiconductor workpiece proximity plating apparatus App 20020020621 - Uzoh, Cyprian Emeka ; et al.	2002-02-21
Method and apparatus for plating and polishing a semiconductor substrate App 20020011417 - Talieh, Homayoun ; et al.	2002-01-31
Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein App 20020009959 - Talieh, Homayoun ; et al.	2002-01-24
Method and apparatus for plating and polishing a semiconductor substrate Grant 6,328,872 - Talieh , et al. December 11, 2	2001-12-11
Method and apparatus for electroplating and electropolishing App 20010042690 - Talieh, Homayoun	2001-11-22
Coater having controllable pressurized process chamber for semiconductor processing App 20010035125 - Talieh, Homayoun ; et al.	2001-11-01
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing App 20010035354 - Ashjaee, Jalal ; et al.	2001-11-01
Apparatus for forming an electrical contact with a semiconductor substrate Grant 6,251,235 - Talieh , et al. June 26, 2	2001-06-26
Coater having a controllable pressurized process chamber for semiconductor processing Grant 6,248,398 - Talieh , et al. June 19, 2	2001-06-19
Linear polisher and method for semiconductor wafer planarization Grant 6,231,427 - Talieh , et al. May 15, 2	2001-05-15
Reverse linear chemical mechanical polisher with loadable housing Grant 6,207,572 - Talieh March 27, 2	2001-03-27
Substrate polishing apparatus Grant 6,179,690 - Talieh January 30, 2	2001-01-30
Method and apparatus for electro-chemical mechanical deposition Grant 6,176,992 - Talieh January 23, 2	2001-01-23
Chemical mechanical polishing with a small polishing pad Grant 6,159,080 - Talieh December 12, 2	2000-12-12
Reverse linear polisher with loadable housing Grant 6,103,628 - Talieh August 15, 2	2000-08-15
Chemical mechanical polishing with a small polishing pad Grant 5,944,582 - Talieh August 31, 1	1999-08-31
Substrate polishing apparatus Grant 5,938,504 - Talieh August 17, 1	1999-08-17
Chemical mechanical polishing apparatus using multiple polishing pads Grant 5,934,979 - Talieh August 10, 1	1999-08-10
Linear polisher and method for semiconductor wafer planarization Grant 5,692,947 - Talieh , et al. December 2, 1	1997-12-02
Chemical mechanical polishing apparatus with improved slurry distribution Grant 5,650,039 - Talieh July 22, 1	1997-07-22
Wafer polishing machine with fluid bearings and drive systems Grant 5,593,344 - Weldon , et al. January 14, 1	1997-01-14
Polishing pad cluster for polishing a semiconductor wafer Grant 5,575,707 - Talieh , et al. November 19, 1	1996-11-19
Wafer polishing machine with fluid bearings Grant 5,558,568 - Talieh , et al. September 24, 1	1996-09-24