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name:-0.013021945953369
name:-0.0036880970001221
Takemura; Keizou Patent Filings

Takemura; Keizou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takemura; Keizou.The latest application filed is for "semiconductor device, electronic device, electronic equipment, and method for manufacturing semiconductor device".

Company Profile
3.13.19
  • Takemura; Keizou - Kawasaki JP
  • Takemura; Keizou - Hiroshima JP
  • Takemura, Keizou - Hiroshima-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device, Electronic Device, Electronic Equipment, And Method For Manufacturing Semiconductor Device
App 20200328138 - Yamamoto; Tsuyoshi ;   et al.
2020-10-15
Electronic apparatus
Grant 10,575,444 - Tsunoda , et al. Feb
2020-02-25
Electronic apparatus
Grant 10,537,043 - Aoki , et al. Ja
2020-01-14
Heat Exchanger For Liquid Immersion Cooling
App 20190383559 - AOKI; Michimasa ;   et al.
2019-12-19
Cooling jacket and electronic apparatus
Grant 10,499,542 - Takemura , et al. De
2019-12-03
Electronic apparatus
Grant 10,327,356 - Wei , et al.
2019-06-18
Cooling Jacket And Electronic Apparatus
App 20190166720 - Takemura; Keizou ;   et al.
2019-05-30
Electronic Apparatus
App 20180359879 - AOKI; Michimasa ;   et al.
2018-12-13
Cooling Device, Electronic Apparatus, And Cooling System
App 20180338388 - WEI; JIE ;   et al.
2018-11-22
Electronic Apparatus
App 20180332735 - WEI; JIE ;   et al.
2018-11-15
Electronic Apparatus
App 20180317345 - TSUNODA; Yosuke ;   et al.
2018-11-01
Information processing device and cooling unit
Grant 10,014,239 - Takemura , et al. July 3, 2
2018-07-03
Information Processing Device And Cooling Unit
App 20180005921 - Takemura; Keizou ;   et al.
2018-01-04
Method for manufacturing component built-in substrate
Grant 9,653,380 - Suwada , et al. May 16, 2
2017-05-16
Method For Manufacturing Component Built-in Substrate
App 20160351471 - SUWADA; MAKOTO ;   et al.
2016-12-01
Cooling Module, Cooling Module Mounting Board And Electronic Device
App 20160073548 - WEI; JIE ;   et al.
2016-03-10
Substrate Unit And Electronic Device
App 20140340847 - IWAKIRI; Yoshihisa ;   et al.
2014-11-20
Cooling apparatus and electronic equipment
Grant 8,605,437 - Wei , et al. December 10, 2
2013-12-10
Cooling auxiliary unit and cooling system
Grant 8,540,558 - Jie , et al. September 24, 2
2013-09-24
Cooling Apparatus And Electronic Equipment
App 20120057302 - Wei; Jie ;   et al.
2012-03-08
Board unit and electronic apparatus
Grant 7,933,125 - Wei , et al. April 26, 2
2011-04-26
Cooling device and electronic device
App 20100039772 - NITTA; Kazuhiro ;   et al.
2010-02-18
Board Unit And Electronic Apparatus
App 20090237883 - WEI; Jie ;   et al.
2009-09-24
Heat sink
Grant 7,540,318 - Nitta , et al. June 2, 2
2009-06-02
Cooling unit and electronic apparatus
App 20090116186 - Wei; Jie ;   et al.
2009-05-07
Cooling Auxiliary Unit And Cooling System
App 20090117842 - JIE; Wei ;   et al.
2009-05-07
Heat sink
App 20070272399 - Nitta; Kazuhiro ;   et al.
2007-11-29
Cooling device and electronic device
App 20060144573 - Nitta; Kazuhiro ;   et al.
2006-07-06
Rolling mill and rolling method
Grant 6,895,794 - Yamamoto , et al. May 24, 2
2005-05-24
Rolling mill and rolling method
App 20030019271 - Yamamoto, Mikio ;   et al.
2003-01-30

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