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Takacs, Mark A. Patent Filings

Takacs, Mark A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takacs, Mark A..The latest application filed is for "corrosion-resistant electrode structure for integrated circuit decoupling capacitors".

Company Profile
0.11.1
  • Takacs, Mark A. - Poughkeepsie NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Corrosion-resistant Electrode Structure For Integrated Circuit Decoupling Capacitors
App 20030075805 - Copeland, Bruce A. ;   et al.
2003-04-24
Process of forming a capacitor with multi-level interconnection technology
Grant 6,336,262 - Dalal , et al. January 8, 2
2002-01-08
Process for fabricating a low dielectric composite substrate
Grant 5,277,725 - Acocella , et al. January 11, 1
1994-01-11
Process for making a compliant thermally conductive compound
Grant 5,213,704 - Anderson, Jr. , et al. May 25, 1
1993-05-25
Low dielectric composite substrate
Grant 5,139,851 - Acocella , et al. August 18, 1
1992-08-18
Process for fabricating a low dielectric composite substrate
Grant 5,135,595 - Acocella , et al. August 4, 1
1992-08-04
Compliant thermally conductive compound
Grant 5,094,769 - Anderson, Jr. , et al. March 10, 1
1992-03-10
Planarization process for organic filling of deep trenches
Grant 4,665,007 - Cservak , et al. May 12, 1
1987-05-12
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
Grant 4,656,050 - Araps , et al. * April 7, 1
1987-04-07
Method for forming a film of dielectric material on an electric component
Grant 4,654,223 - Araps , et al. March 31, 1
1987-03-31
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials
Grant 4,599,136 - Araps , et al. July 8, 1
1986-07-08
Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures
Grant 4,568,601 - Araps , et al. February 4, 1
1986-02-04

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