SYLVESTRE; Julien
Patent Applications and Registrations
Patent applications and USPTO patent grants for SYLVESTRE; Julien.The latest application filed is for "neuromorphic micro-electro-mechanical-system device".
Company Profile
2.23.24
- SYLVESTRE; Julien - Sherbrooke CA
- Sylvestre; Julien - Chambly CA
- Sylvestre; Julien - Paris N/A FR
- Sylvestre; Julien - Bromont N/A CA
- Sylvestre; Julien - Quebec CA
Patent Activity
| Patent | Date |
|---|---|
| Neuromorphic Micro-electro-mechanical-system Device App 20220063989 - SYLVESTRE; Julien ; et al. | 2022-03-03 |
| Apparatus And Methods For Cooling Of An Integrated Circuit App 20200154604 - SYLVESTRE; Julien ; et al. | 2020-05-14 |
| Apparatus and methods for cooling of an integrated circuit Grant 10,390,460 - Sylvestre , et al. A | 2019-08-20 |
| Thermocompression for semiconductor chip assembly Grant 10,134,704 - Sylvestre November 20, 2 | 2018-11-20 |
| Method And System For Acoustically Scanning A Sample App 20180172644 - Sylvestre; Julien ; et al. | 2018-06-21 |
| Thermocompression For Semiconductor Chip Assembly App 20170309586 - Sylvestre; Julien | 2017-10-26 |
| Liquid metal flip chip devices Grant 9,761,542 - Sylvestre , et al. September 12, 2 | 2017-09-12 |
| Thermocompression for semiconductor chip assembly Grant 9,735,125 - Sylvestre August 15, 2 | 2017-08-15 |
| Apparatus and Methods for Cooling of an Integrated Circuit App 20170223871 - SYLVESTRE; Julien ; et al. | 2017-08-03 |
| Low-stress dual underfill packaging Grant 9,698,072 - Brofman , et al. July 4, 2 | 2017-07-04 |
| Low-stress dual underfill packaging Grant 9,373,559 - Brofman , et al. June 21, 2 | 2016-06-21 |
| Thermocompression For Semiconductor Chip Assembly App 20160093585 - Sylvestre; Julien | 2016-03-31 |
| Thermocompression for semiconductor chip assembly Grant 9,287,230 - Sylvestre March 15, 2 | 2016-03-15 |
| Low-stress Dual Underfill Packaging App 20160049345 - Brofman; Peter J. ; et al. | 2016-02-18 |
| Low-stress Dual Underfill Packaging App 20150255312 - Brofman; Peter J. ; et al. | 2015-09-10 |
| Soldering A Semiconductor Device And A Substrate Based On Oscillating Frequencies App 20150156889 - Sylvestre; Julien | 2015-06-04 |
| Thermocompression For Semiconductor Chip Assembly App 20150123271 - Sylvestre; Julien | 2015-05-07 |
| Methods and systems involving soldering Grant 8,939,346 - Sylvestre January 27, 2 | 2015-01-27 |
| Thermocompression for semiconductor chip assembly Grant 8,932,909 - Sylvestre January 13, 2 | 2015-01-13 |
| Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,910,853 - Arvin , et al. December 16, 2 | 2014-12-16 |
| Method and device for reading an emulsion Grant 8,798,341 - Baudry , et al. August 5, 2 | 2014-08-05 |
| Underfill adhesion measurements at a microscopic scale Grant 8,796,049 - Cadotte , et al. August 5, 2 | 2014-08-05 |
| Thermocompression For Semiconductor Chip Assembly App 20140131855 - Sylvestre; Julien | 2014-05-15 |
| Underfill Adhesion Measurements At A Microscopic Scale App 20140030827 - CADOTTE; Maxime ; et al. | 2014-01-30 |
| ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20130284495 - Arvin; Charles L. ; et al. | 2013-10-31 |
| Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,493,746 - Arvin , et al. July 23, 2 | 2013-07-23 |
| Methods and Systems Involving Soldering App 20120205424 - Sylvestre; Julien | 2012-08-16 |
| Optimization of metallurgical properties of a solder joint Grant 8,197,612 - Busby , et al. June 12, 2 | 2012-06-12 |
| Method And Device For Culturing Algae App 20110281295 - Sylvestre; Julien | 2011-11-17 |
| Method And Device For Reading An Emulsion App 20110188717 - Baudry; Jean ; et al. | 2011-08-04 |
| ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20100200271 - Arvin; Charles L. ; et al. | 2010-08-12 |
| Method And Apparatus To Minimize Stress During Reflow Process App 20090298206 - Duchesne; Eric ; et al. | 2009-12-03 |
| Optimization Of Metallurgical Properties Of A Solder Joint App 20090266447 - BUSBY; JAMES A. ; et al. | 2009-10-29 |
| Temporary structure to reduce stress and warpage in a flip chip organic package Grant 7,538,432 - Danovitch , et al. May 26, 2 | 2009-05-26 |
| Method for measuring thin layers in solid state devices Grant 7,512,518 - Blander , et al. March 31, 2 | 2009-03-31 |
| Method for determining the impact of layer thicknesses on laminate warpage Grant 7,482,180 - Sylvestre , et al. January 27, 2 | 2009-01-27 |
| Method to optimize the manufacturing of interconnects in microelectronic packages Grant 7,484,190 - Duchesne , et al. January 27, 2 | 2009-01-27 |
| Temporary structure to reduce stress and warpage in a flip chip organic package Grant 7,473,618 - Danovitch , et al. January 6, 2 | 2009-01-06 |
| Structure For Controlled Collapse Chip Connection With Displaced Captured Pads App 20080230901 - Duchesne; Eric ; et al. | 2008-09-25 |
| Non-contact Thermal Imaging System For Heterogeneous Components App 20080224030 - Sylvestre; Julien ; et al. | 2008-09-18 |
| Method For Measuring Thin Layers In Solid State Devices App 20080021673 - Blander; Alexandre ; et al. | 2008-01-24 |
| Method of massive directed mutagenesis App 20050153343 - Sylvestre, Julien ; et al. | 2005-07-14 |
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