| Patent | Date |
|---|
Ultra-thin, hyper-density semiconductor packages
Grant 11,430,724 - Mallik , et al. August 30, 2 | 2022-08-30 |
Socket with integrated flex connector
Grant 11,398,692 - Hardikar , et al. July 26, 2 | 2022-07-26 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20220148968 - COLLINS; Andrew ; et al. | 2022-05-12 |
Chip with magnetic interconnect alignment
Grant 11,296,050 - Swaminathan April 5, 2 | 2022-04-05 |
Socket With Integrated Flex Connector
App 20220102884 - HARDIKAR; MAHESH S. ; et al. | 2022-03-31 |
Package Integration Using Fanout Cavity Substrate
App 20220093522 - Shanmugam; Karthik ; et al. | 2022-03-24 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge
Grant 11,270,942 - Collins , et al. March 8, 2 | 2022-03-08 |
Chip With Magnetic Interconnect Alignment
App 20210066240 - Swaminathan; Rajasekaran | 2021-03-04 |
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept | 2020-09-22 |
Ultra-thin, Hyper-density Semiconductor Packages
App 20200273784 - MALLIK; Debendra ; et al. | 2020-08-27 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20200235051 - COLLINS; Andrew ; et al. | 2020-07-23 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge
Grant 10,643,945 - Collins , et al. | 2020-05-05 |
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ; et al. | 2020-02-27 |
Bga Stim Package Architecture For High Performance Systems
App 20190393121 - SWAMINATHAN; Rajasekaran ; et al. | 2019-12-26 |
Multiple Die Package Using An Embedded Bridge Connecting Dies
App 20190363049 - MEKONNEN; Yidnekachew S. ; et al. | 2019-11-28 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20190206792 - Collins; Andrew ; et al. | 2019-07-04 |
Printed circuit board with a recess to accommodate discrete components in a package
Grant 10,187,996 - Swaminathan , et al. Ja | 2019-01-22 |
Printed Circuit Board With A Recess To Accommodate Discrete Components In A Package
App 20180270957 - Swaminathan; Rajasekaran ; et al. | 2018-09-20 |
Interconnect cable with edge finger connector
Grant 10,074,920 - Tran , et al. September 11, 2 | 2018-09-11 |
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20180007791 - Prakash; Mani ; et al. | 2018-01-04 |
Magnetic intermetallic compound interconnect
Grant 9,847,308 - Swaminathan , et al. December 19, 2 | 2017-12-19 |
CPU package substrates with removable memory mechanical interfaces
Grant 9,832,876 - Prakash , et al. November 28, 2 | 2017-11-28 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
Grant 9,793,233 - Swaminathan , et al. October 17, 2 | 2017-10-17 |
Chip package connector assembly
Grant 9,674,954 - Swaminathan , et al. June 6, 2 | 2017-06-06 |
Techniques and configurations associated with a package load assembly
Grant 9,615,483 - Chawla , et al. April 4, 2 | 2017-04-04 |
Electronic package with narrow-factor via including finish layer
Grant 9,603,247 - Swaminathan , et al. March 21, 2 | 2017-03-21 |
Magnetic Intermetallic Compound Interconnect
App 20160379951 - SWAMINATHAN; RAJASEKARAN ; et al. | 2016-12-29 |
Forming Sacrificial Composite Materials For Package-on-package Architectures And Structures Formed Thereby
App 20160343680 - SWAMINATHAN; Rajasekaran ; et al. | 2016-11-24 |
Double-mated edge finger connector
Grant 9,502,800 - Tran , et al. November 22, 2 | 2016-11-22 |
Snap connector for socket assembly and associated techniques and configurations
Grant 9,478,881 - Zhang , et al. October 25, 2 | 2016-10-25 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
Grant 9,472,519 - Swaminathan , et al. October 18, 2 | 2016-10-18 |
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
Grant 9,461,014 - Srinivasan , et al. October 4, 2 | 2016-10-04 |
Snap Connector For Socket Assembly And Associated Techniques And Configurations
App 20160268710 - Zhang; Zhichao ; et al. | 2016-09-15 |
Cpu Package Substrates With Removable Memory Mechanical Interfaces
App 20160183374 - Prakash; Mani ; et al. | 2016-06-23 |
Magnetic Intermetallic Compound Interconnect
App 20160172320 - SWAMINATHAN; RAJASEKARAN ; et al. | 2016-06-16 |
Techniques And Configurations Associated With A Package Load Assembly
App 20160079150 - Chawla; Gaurav ; et al. | 2016-03-17 |
Integrated circuit connectors
Grant 9,265,170 - Swaminathan , et al. February 16, 2 | 2016-02-16 |
Electronic Package With Narrow-factor Via Including Finish Layer
App 20160044786 - Swaminathan; Rajasekaran ; et al. | 2016-02-11 |
Interconnect Cable With Edge Finger Connector
App 20150357736 - Tran; Donald T. ; et al. | 2015-12-10 |
Double-mated Edge Finger Connector
App 20150318630 - Tran; Donald T. ; et al. | 2015-11-05 |
Interconnect cable with edge finger connector
Grant 9,118,151 - Tran , et al. August 25, 2 | 2015-08-25 |
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby
App 20150221609 - Srinivasan; Sriram ; et al. | 2015-08-06 |
Forming Sacrificial Composite Materials For Package-on-package Architectures And Structures Formed Thereby
App 20150194401 - SWAMINATHAN; Rajasekaran ; et al. | 2015-07-09 |
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
Grant 9,064,971 - Srinivasan , et al. June 23, 2 | 2015-06-23 |
Integrated Circuit Connectors
App 20150118870 - Swaminathan; Rajasekaran ; et al. | 2015-04-30 |
Magnetic attachment structure
Grant 9,010,618 - Aleksov , et al. April 21, 2 | 2015-04-21 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
Grant 9,006,887 - Swaminathan , et al. April 14, 2 | 2015-04-14 |
Magnetic intermetallic compound interconnect
Grant 8,939,347 - Swaminathan , et al. January 27, 2 | 2015-01-27 |
Interconnect Cable With Edge Finger Connector
App 20140322932 - Tran; Donald T. ; et al. | 2014-10-30 |
Magnetic Contacts For Electronics Applications
App 20140205851 - MAHAJAN; Ravindranath V. ; et al. | 2014-07-24 |
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby
App 20140175644 - Srinivasan; Sriram ; et al. | 2014-06-26 |
Magnetically sintered conductive via
Grant 8,609,532 - Swaminathan , et al. December 17, 2 | 2013-12-17 |
Package-on-package Interconnect Stiffener
App 20130292838 - Ganesan; Sanka ; et al. | 2013-11-07 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,569,108 - Xu , et al. October 29, 2 | 2013-10-29 |
Clad solder thermal interface material
Grant 8,550,327 - Deppisch , et al. October 8, 2 | 2013-10-08 |
Magnetic Attachment Structure
App 20130224444 - ALEKSOV; ALEKSANDAR ; et al. | 2013-08-29 |
Package-on-package interconnect stiffener
Grant 8,513,792 - Ganesan , et al. August 20, 2 | 2013-08-20 |
Magnetic attachment structure
Grant 8,434,668 - Aleksov , et al. May 7, 2 | 2013-05-07 |
Flip chip package containing novel underfill materials
Grant 8,377,550 - Swaminathan , et al. February 19, 2 | 2013-02-19 |
Coating For A Microelectronic Device, Treatment Comprising Same,and Method Of Managing A Thermal Profile Of A Microelectronic Die
App 20130017650 - Xu; Dingying ; et al. | 2013-01-17 |
Magnetic microelectronic device attachment
Grant 8,313,958 - Swaminathan , et al. November 20, 2 | 2012-11-20 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,287,996 - Xu , et al. October 16, 2 | 2012-10-16 |
Magnetic particle-based composite materials for semiconductor packages
Grant 8,222,730 - Swaminathan July 17, 2 | 2012-07-17 |
Magnetically Sintered Conductive Via
App 20110291276 - Swaminathan; Rajasekaran ; et al. | 2011-12-01 |
Magnetic Microelectronic Device Attachment
App 20110281375 - Swaminathan; Rajasekaran ; et al. | 2011-11-17 |
Magnetic Particle Attachment Material
App 20110278351 - Aleksov; Aleksandar ; et al. | 2011-11-17 |
Magnetic Attachment Structure
App 20110278044 - Aleksov; Aleksandar ; et al. | 2011-11-17 |
Magnetic Intermetallic Compound Interconnect
App 20110266030 - Swaminathan; Rajasekaran ; et al. | 2011-11-03 |
Flip chip package containing novel underfill materials
App 20110159228 - Swaminathan; Rajasekaran ; et al. | 2011-06-30 |
Clad Solder Thermal Interface Material
App 20110147438 - Deppisch; Carl Ludwig ; et al. | 2011-06-23 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
App 20110151624 - Xu; Dingying ; et al. | 2011-06-23 |
Clad Solder Thermal Interface Material
App 20110147914 - Deppisch; Carl L. ; et al. | 2011-06-23 |
Magnetic Particle-based Composite Materials For Semiconductor Packages
App 20110127663 - Swaminathan; Rajasekaran | 2011-06-02 |
Magnetic particle-based composite materials for semiconductor packages
Grant 7,906,376 - Swaminathan March 15, 2 | 2011-03-15 |
Attachment using magnetic particle based solder composites
Grant 7,902,060 - Swaminathan March 8, 2 | 2011-03-08 |
Package-on-package interconnect stiffener
App 20100258927 - Ganesan; Sanka ; et al. | 2010-10-14 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
App 20100224993 - Swaminathan; Rajasekaran ; et al. | 2010-09-09 |
Attachment Using Magnetic Particle Based Solder Composites
App 20100159692 - SWAMINATHAN; Rajasekaran | 2010-06-24 |
Magnetic Particle-based Composite Materials For Semiconductor Packages
App 20090321923 - Swaminathan; Rajasekaran | 2009-12-31 |
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