loadpatents
name:-0.043332099914551
name:-0.049860954284668
name:-0.0086669921875
Sun; Zhuowen Patent Filings

Sun; Zhuowen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Zhuowen.The latest application filed is for "wire bond wires for interference shielding".

Company Profile
7.43.39
  • Sun; Zhuowen - Campbell CA
  • Sun; Zhuowen - Sacramento CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultra high performance interposer
Grant 10,700,002 - Uzoh , et al.
2020-06-30
Wire Bond Wires For Interference Shielding
App 20200118939 - Awujoola; Abiola ;   et al.
2020-04-16
Wire bond wires for interference shielding
Grant 10,559,537 - Awujoola , et al. Feb
2020-02-11
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,522,457 - Uzoh , et al. Dec
2019-12-31
Ultra High Performance Interposer
App 20190304904 - Uzoh; Cyprian Emeka ;   et al.
2019-10-03
Dies-on-package devices and methods therefor
Grant 10,354,976 - Tao , et al. July 16, 2
2019-07-16
Ultra high performance interposer
Grant 10,332,833 - Uzoh , et al.
2019-06-25
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
Grant 10,325,877 - Delacruz , et al.
2019-06-18
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Th
App 20190157199 - UZOH; Cyprian Emeka ;   et al.
2019-05-23
Wire Bond Wires For Interference Shielding
App 20190027444 - Awujoola; Abiola ;   et al.
2019-01-24
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,177,086 - Uzoh , et al. J
2019-01-08
Ultra High Performance Interposer
App 20180331030 - Uzoh; Cyprian Emeka ;   et al.
2018-11-15
Wire bond wires for interference shielding
Grant 10,115,678 - Awujoola , et al. October 30, 2
2018-10-30
Via structure for signal equalization
Grant 10,103,093 - Sun , et al. October 16, 2
2018-10-16
Embedded Wire Bond Wires for Vertical Integration With Separate Surface Mount and Wire Bond Mounting Surfaces
App 20180240773 - Delacruz; Javier A. ;   et al.
2018-08-23
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20180233447 - UZOH; Cyprian Emeka ;   et al.
2018-08-16
Ultra high performance interposer
Grant 10,032,715 - Uzoh , et al. July 24, 2
2018-07-24
High-bandwidth memory application with controlled impedance loading
Grant 10,026,467 - Sun , et al. July 17, 2
2018-07-17
Method for reduced load memory module
Grant 10,007,622 - Sun , et al. June 26, 2
2018-06-26
Package on-package devices with upper RDL of WLPS and methods therefor
Grant 9,991,235 - Tao , et al. June 5, 2
2018-06-05
Package-on-package devices with same level WLP components and methods therefor
Grant 9,991,233 - Tao , et al. June 5, 2
2018-06-05
Package on-package devices with multiple levels and methods therefor
Grant 9,985,007 - Tao , et al. May 29, 2
2018-05-29
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
Grant 9,984,992 - DeLaCruz , et al. May 29, 2
2018-05-29
Wafer-level packaged components and methods therefor
Grant 9,972,573 - Tao , et al. May 15, 2
2018-05-15
Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor
Grant 9,972,609 - Tao , et al. May 15, 2
2018-05-15
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,947,618 - Uzoh , et al. April 17, 2
2018-04-17
TFD I/O partition for high-speed, high-density applications
Grant 9,928,883 - Sun , et al. March 27, 2
2018-03-27
Wire Bond Wires for Interference Shielding
App 20180061774 - Awujoola; Abiola ;   et al.
2018-03-01
Circuit assemblies with multiple interposer substrates, and methods of fabrication
Grant 9,905,507 - Shen , et al. February 27, 2
2018-02-27
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
App 20180040587 - Tao; Min ;   et al.
2018-02-08
Microelectronic Packages And Assemblies With Repeaters
App 20180040589 - Huang; Shaowu ;   et al.
2018-02-08
Wafer-Level Packaged Components and Methods Therefor
App 20180025987 - Tao; Min ;   et al.
2018-01-25
Dies-on-Package Devices and Methods Therefor
App 20180026017 - Tao; Min ;   et al.
2018-01-25
Package-on-Package Devices with Same Level WLP Components and Methods Therefor
App 20180026011 - Tao; Min ;   et al.
2018-01-25
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
App 20180026016 - Tao; Min ;   et al.
2018-01-25
Package-on-Package Devices with Multiple Levels and Methods Therefor
App 20180026018 - Tao; Min ;   et al.
2018-01-25
Package-on-Package Devices with WLP Components with Dual RDLS for Surface Mount Dies and Methods Therefor
App 20180026019 - Tao; Min ;   et al.
2018-01-25
TFD I/O Partition for High-Speed, High-Density Applications
App 20170323667 - Sun; Zhuowen ;   et al.
2017-11-09
Wire bond wires for interference shielding
Grant 9,812,402 - Awujoola , et al. November 7, 2
2017-11-07
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20170278787 - UZOH; Cyprian Emeka ;   et al.
2017-09-28
Ultra High Performance Interposer
App 20170256492 - Uzoh; Cyprian Emeka ;   et al.
2017-09-07
Enhanced density assembly having microelectronic packages mounted at substantial angle to board
Grant 9,728,524 - Tao , et al. August 8, 2
2017-08-08
Method for Reduced Load Memory Module
App 20170212848 - Sun; Zhuowen ;   et al.
2017-07-27
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
App 20170194281 - DeLaCruz; Javier A. ;   et al.
2017-07-06
Dual-channel Dimm
App 20170186474 - Haba; Belgacem ;   et al.
2017-06-29
Compact microelectronic assembly having reduced spacing between controller and memory packages
Grant 9,691,437 - Sun , et al. June 27, 2
2017-06-27
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,691,702 - Uzoh , et al. June 27, 2
2017-06-27
Via Structure For Signal Equalization
App 20170171003 - Sun; Zhuowen ;   et al.
2017-06-15
TFD I/O partition for high-speed, high-density applications
Grant 9,679,613 - Sun , et al. June 13, 2
2017-06-13
Ultra high performance interposer
Grant 9,666,521 - Uzoh , et al. May 30, 2
2017-05-30
High-bandwidth Memory Application With Controlled Impedance Loading
App 20170133081 - Sun; Zhuowen ;   et al.
2017-05-11
Reduced load memory module using wire bonds and a plurality of rank signals
Grant 9,640,236 - Sun , et al. May 2, 2
2017-05-02
Flexible I/O partition of multi-die memory solution
Grant 9,640,282 - Chen , et al. May 2, 2
2017-05-02
Wire Bond Wires For Interference Shielding
App 20170117231 - Awujoola; Abiola ;   et al.
2017-04-27
Microelectronic packages and assemblies with improved flyby signaling operation
Grant 9,595,511 - Haba , et al. March 14, 2
2017-03-14
Via structure for signal equalization
Grant 9,583,417 - Sun , et al. February 28, 2
2017-02-28
Wire bond wires for interference shielding
Grant 9,490,222 - Awujoola , et al. November 8, 2
2016-11-08
High-bandwidth memory application with controlled impedance loading
Grant 9,484,080 - Sun , et al. November 1, 2
2016-11-01
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20160315047 - Uzoh; Cyprian Emeka ;   et al.
2016-10-27
Circuit Assemblies With Multiple Interposer Substrates, And Methods Of Fabrication
App 20160293534 - SHEN; Hong ;   et al.
2016-10-06
Single package dual channel memory with co-support
Grant 9,460,758 - Crisp , et al. October 4, 2
2016-10-04
Reduced Load Memory Module
App 20160267954 - SUN; Zhuowen ;   et al.
2016-09-15
Circuit assemblies with multiple interposer substrates, and methods of fabrication
Grant 9,402,312 - Shen , et al. July 26, 2
2016-07-26
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,397,038 - Uzoh , et al. July 19, 2
2016-07-19
Electronic Device For Event Alert And Notification
App 20160154542 - Shen; Hong ;   et al.
2016-06-02
Contact arrangements for stackable microelectronic package structures with multiple ranks
Grant 9,349,707 - Sun , et al. May 24, 2
2016-05-24
BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail
Grant 9,343,398 - Chen , et al. May 17, 2
2016-05-17
Contact arrangements for stackable microelectronic package structures
Grant 9,337,170 - Sun , et al. May 10, 2
2016-05-10
Bga Ballout Partition Techniques For Simplified Layout In Motherboard With Multiple Power Supply Rail
App 20160093563 - Chen; Yong ;   et al.
2016-03-31
Compact Microelectronic Assembly Having Reduced Spacing Between Controller And Memory Packages
App 20160093340 - Sun; Zhuowen ;   et al.
2016-03-31
Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design
Grant 9,281,296 - Sun , et al. March 8, 2
2016-03-08
Die Stacking Techniques In Bga Memory Package For Small Footprint Cpu And Memory Motherboard Design
App 20160035703 - Sun; Zhuowen ;   et al.
2016-02-04
Circuit Assemblies With Multiple Interposer Substrates, And Methods Of Fabrication
App 20150327367 - SHEN; Hong ;   et al.
2015-11-12
Single Package Dual Channel Memory With Co-support
App 20150302901 - Crisp; Richard Dewitt ;   et al.
2015-10-22
Via Structure For Signal Equalization
App 20150262910 - SUN; Zhuowen ;   et al.
2015-09-17
Single package dual channel memory with co-support
Grant 9,070,423 - Crisp , et al. June 30, 2
2015-06-30
Ultra High Performance Interposer
App 20150041988 - Uzoh; Cyprian Emeka ;   et al.
2015-02-12
Single Package Dual Channel Memory With Co-support
App 20140362629 - Crisp; Richard Dewitt ;   et al.
2014-12-11
Planar inductor devices
Grant 8,358,193 - Dalmia , et al. January 22, 2
2013-01-22
Planar Inductor Devices
App 20110291787 - Dalmia; Sidharth ;   et al.
2011-12-01

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