Suh; Min Suk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suh; Min Suk.The latest application filed is for "substrate for semiconductor package and semiconductor package having the same".

Company Profile

0.35.40

Suh; Min Suk - Seoul KR
Suh; Min Suk - Sungnam KR
Suh; Min Suk - Sung Nam KR
Suh, Min Suk - Seongnam-si KR
Suh, Min Suk - Sung Nam-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked wafer level package having a reduced size Grant 8,847,377 - Kim , et al. September 30, 2	2014-09-30
Substrate for semiconductor package and semiconductor package having the same Grant 8,698,283 - Suh April 15, 2	2014-04-15
Flexible semiconductor package and method for fabricating the same Grant 8,524,530 - Suh September 3, 2	2013-09-03
Semiconductor package module Grant 8,395,245 - Kim , et al. March 12, 2	2013-03-12
Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips Grant 8,361,838 - Yang , et al. January 29, 2	2013-01-29
Substrate For Semiconductor Package And Semiconductor Package Having The Same App 20130020683 - SUH; Min Suk	2013-01-24
Semiconductor package having an internal cooling system Grant 8,358,016 - Suh , et al. January 22, 2	2013-01-22
Stacked Wafer Level Package Having A Reduced Size App 20120299199 - KIM; Jong Hoon ; et al.	2012-11-29
Stacked Wafer Level Package Having A Reduced Size App 20120299169 - KIM; Jong Hoon ; et al.	2012-11-29
Semiconductor package with stacked chips and method for manufacturing the same Grant 8,319,327 - Suh November 27, 2	2012-11-27
Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules Grant 8,299,592 - Suh , et al. October 30, 2	2012-10-30
Substrate for semiconductor package and semiconductor package having the same Grant 8,299,582 - Suh October 30, 2	2012-10-30
Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same Grant 8,232,654 - Suh July 31, 2	2012-07-31
Semiconductor Package Having An Internal Cooling System App 20120175783 - SUH; Min Suk ; et al.	2012-07-12
Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same Grant 8,202,762 - Kim , et al. June 19, 2	2012-06-19
Semiconductor package having a stacked wafer level package and method for fabricating the same Grant 8,203,217 - Suh June 19, 2	2012-06-19
Semiconductor package having an internal cooling system Grant 8,159,065 - Suh , et al. April 17, 2	2012-04-17
Flexible Semiconductor Package And Method For Fabricating The Same App 20120083074 - SUH; Min Suk	2012-04-05
Flexible semiconductor package and method for fabricating the same Grant 8,097,933 - Suh January 17, 2	2012-01-17
Semiconductor Package And Method For Manufacturing The Same App 20120009736 - YANG; Seung Taek ; et al.	2012-01-12
Stack Package Having Reduced Electrical Connection Length Suitable For High Speed Operations And Method Of Manufacturing The Same App 20110312128 - KIM; Sung Min ; et al.	2011-12-22
Semiconductor Chip With Fine Pitch Leads For Normal Testing Of Same App 20110309358 - KIM; Jong Hoon ; et al.	2011-12-22
Semiconductor Package Having Side Walls And Method For Manufacturing The Same App 20110287584 - SUH; Min Suk ; et al.	2011-11-24
Semiconductor package and method for manufacturing the same Grant 8,049,341 - Yang , et al. November 1, 2	2011-11-01
Stacked Wafer Level Package Having A Reduced Size App 20110233795 - KIM; Jong Hoon ; et al.	2011-09-29
Semiconductor Package With Stacked Chips And Method For Manufacturing The Same App 20110227217 - SUH; Min Suk	2011-09-22
Semiconductor package having side walls and method for manufacturing the same Grant 8,018,043 - Suh , et al. September 13, 2	2011-09-13
Semiconductor Package Through-electrode Suitable For A Stacked Semiconductor Package And Semiconductor Package Having The Same App 20110198722 - SUH; Min Suk	2011-08-18
Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same Grant 7,973,414 - Suh July 5, 2	2011-07-05
Semiconductor Package Having A Stacked Wafer Level Package And Method For Fabricating The Same App 20110127672 - SUH; Min Suk	2011-06-02
Semiconductor package and method for manufacturing the same for decreasing number of processes Grant 7,923,294 - Suh April 12, 2	2011-04-12
Semiconductor package having a stacked wafer level package and method for fabricating the same Grant 7,911,065 - Suh March 22, 2	2011-03-22
Stack package and method for manufacturing the same Grant 7,871,925 - Kim , et al. January 18, 2	2011-01-18
Semiconductor package for improving characteristics for transmitting signals and power Grant 7,859,115 - Kim , et al. December 28, 2	2010-12-28
Stack package having pattern die redistribution Grant 7,834,463 - Kim , et al. November 16, 2	2010-11-16
Method for manufacturing semiconductor package Grant 7,795,139 - Han , et al. September 14, 2	2010-09-14
Semiconductor Package Having An Internal Cooling System App 20100224990 - SUH; Min Suk ; et al.	2010-09-09
Semiconductor Package And Method For Manufacturing The Same For Decreasing Number Of Processes App 20100203720 - SUH; Min Suk	2010-08-12
Cube Semiconductor Package Composed Of A Plurality Of Stacked Together And Interconnected Semiconductor Chip Modules App 20100187676 - Suh; Min Suk ; et al.	2010-07-29
Semiconductor package and method for manufacturing the same for decreasing number of processes Grant 7,732,931 - Suh June 8, 2	2010-06-08
Semiconductor Package For Improving Characteristics For Transmitting Signals And Power App 20100117208 - KIM; Jong Hoon ; et al.	2010-05-13
Flexible Semiconductor Package And Method For Fabricating The Same App 20100084771 - SUH; Min Suk	2010-04-08
Substrate For Semiconductor Package And Semiconductor Package Having The Same App 20100052109 - Suh; Min Suk	2010-03-04
Flip Chip Package And Method For Manufacturing The Same App 20090298229 - KIM; Seong Cheol ; et al.	2009-12-03
Stack package utilizing through vias and re-distribution lines Grant 7,598,617 - Lee , et al. October 6, 2	2009-10-06
Semiconductor Package And Method For Manufacturing The Same App 20090230565 - YANG; Seung Taek ; et al.	2009-09-17
Semiconductor Package Having Side Walls And Method For Manufacturing The Same App 20090224392 - SUH; Min Suk ; et al.	2009-09-10
Stack Package And Method For Manufacturing The Same App 20090181494 - KIM; Sung Min ; et al.	2009-07-16
Stacked Wafer Level Package Having A Reduced Size App 20090166836 - KIM; Jong Hoon ; et al.	2009-07-02
Semiconductor Package Module App 20090121326 - KIM; Jong Hoon ; et al.	2009-05-14
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same Grant 7,525,186 - Kim , et al. April 28, 2	2009-04-28
Method of manufacturing wafer level stack package Grant 7,507,637 - Suh , et al. March 24, 2	2009-03-24
Semiconductor Package Through-electrode Suitable For A Stacked Semiconductor Package And Semiconductor Package Having The Same App 20090045504 - SUH; Min Suk	2009-02-19
Semiconductor Package Having A Stacked Wafer Level Package And Method For Fabricating The Same App 20090026629 - Suh; Min Suk	2009-01-29
Semiconductor Package And Method For Manufacturing The Same App 20090026613 - SUH; Min Suk	2009-01-29
Method For Manufacturing Semiconductor Package App 20080318361 - HAN; Kwon Whan ; et al.	2008-12-25
Flip Chip Package And Method For Manufacturing The Same App 20080308949 - KIM; Seong Cheol ; et al.	2008-12-18
Wafer level chip scale package (WLCSP) with high reliability against thermal stress Grant 7,446,405 - Kim , et al. November 4, 2	2008-11-04
Stack Package Having Reduced Electrical Connection Length Suitable For High Speed Operations And Method Of Manufacturing The Same App 20080157357 - Kim; Sung Min ; et al.	2008-07-03
Stack package and method for manufacturing the same App 20080079131 - Kim; Sung Min ; et al.	2008-04-03
Stack package having pattern die redistribution App 20080001304 - Kim; Sung Min ; et al.	2008-01-03
Stack package utilizing through vias and re-distribution lines App 20070222050 - Lee; Seung Hyun ; et al.	2007-09-27
Method of manufacturing wafer level stack package App 20070218678 - Suh; Min Suk ; et al.	2007-09-20
Wafer level chip scale package (WLCSP) with high reliability against thermal stress App 20070182022 - Kim; Jong Hoon ; et al.	2007-08-09
Optical pickup actuator performable tilting operation Grant 6,801,483 - Hong , et al. October 5, 2	2004-10-05
Optical pick-up actuator Grant 6,714,364 - Suh March 30, 2	2004-03-30
Optical pickup actuator App 20030112719 - Hong, Sam Nyol ; et al.	2003-06-19
Optical pickup actuator performable tilting operation App 20020021651 - Hong, Sam Nyol ; et al.	2002-02-21
Optical pick-up actuator App 20010030815 - Suh, Min Suk	2001-10-18
Optical pick-up actuator App 20010026404 - Suh, Min Suk	2001-10-04

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