SUDO; Hiroki
Patent Applications and Registrations
Patent applications and USPTO patent grants for SUDO; Hiroki.The latest application filed is for "core material, electronic component and method for forming bump electrode".
- SUDO; Hiroki - Tokyo JP
- Sudo; Hiroki - Tochigi JP
| Patent | Date |
|---|---|
| Core Material, Electronic Component And Method For Forming Bump Electrode App 20220212294 - KONDOH; Shigeki ; et al. | 2022-07-07 |
| Solder material, solder paste, and solder joint Grant 11,344,976 - Kawasaki , et al. May 31, 2 | 2022-05-31 |
| Method For Forming Bump Electrode Substrate App 20210387276 - HATTORI; Takahiro ; et al. | 2021-12-16 |
| Cu core ball, solder joint, solder paste and formed solder Grant 10,888,959 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
| Solder Material, Solder Paste, And Solder Joint App 20200376607 - Kawasaki; Hiroyoshi ; et al. | 2020-12-03 |
| Cu core ball, solder joint, solder paste and formed solder Grant 10,639,749 - Kawasaki , et al. | 2020-05-05 |
| Flux composition for solder applications Grant 10,610,979 - Maruko , et al. | 2020-04-07 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375054 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375053 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190376161 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Flux App 20180339375 - Maruko; Daisuke ; et al. | 2018-11-29 |
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