Su; Yuan-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Su; Yuan-Chang.The latest application filed is for "semiconductor substrate and method for manufacturing the same".

Company Profile

2.34.33

Su; Yuan-Chang - Kaohsiung TW
Su; Yuan-Chang - Luzhu Township N/A TW
Su; Yuan-Chang - Taoyuan County N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor substrate and method for manufacturing the same Grant 11,398,421 - Lee , et al. July 26, 2	2022-07-26
Semiconductor device package and a method of manufacturing the same Grant 10,424,547 - Lee , et al. Sept	2019-09-24
Substrate for packaging a semiconductor device package and a method of manufacturing the same Grant 10,325,842 - Lee , et al.	2019-06-18
Semiconductor Substrate And Method For Manufacturing The Same App 20190148280 - Lee; Chun-Che ; et al.	2019-05-16
Semiconductor Package And Method Of Manufacturing The Same App 20190088506 - APPELT; Bernd Karl ; et al.	2019-03-21
Substrate For Packaging A Semiconductor Device Package And A Method Of Manufacturing The Same App 20190080995 - LEE; Chih-Cheng ; et al.	2019-03-14
Semiconductor Device Package And A Method Of Manufacturing The Same App 20190067211 - LEE; Chih Cheng ; et al.	2019-02-28
Semiconductor substrate mitigating bridging Grant 10,181,438 - Lee , et al. Ja	2019-01-15
Double side via last method for double embedded patterned substrate Grant 10,128,198 - Yen , et al. November 13, 2	2018-11-13
Substrate, semiconductor package structure and manufacturing process Grant 10,096,542 - Lee , et al. October 9, 2	2018-10-09
Semiconductor package structure and semiconductor process Grant 10,083,902 - Su , et al. September 25, 2	2018-09-25
Semiconductor package including dielectric layers defining via holes extending to component pads Grant 10,079,156 - Lee , et al. September 18, 2	2018-09-18
Substrate, Semiconductor Package Structure And Manufacturing Process App 20180240743 - LEE; Chih Cheng ; et al.	2018-08-23
Double Side Via Last Method For Double Embedded Patterned Substrate App 20170229402 - YEN; You-Lung ; et al.	2017-08-10
Double side via last method for double embedded patterned substrate Grant 9,659,853 - Yen , et al. May 23, 2	2017-05-23
Semiconductor substrate, semiconductor package structure and method of making the same Grant 9,583,427 - Lee , et al. February 28, 2	2017-02-28
Semiconductor Package Structure And Semiconductor Process App 20160322292 - SU; Yuan-Chang ; et al.	2016-11-03
Double Side Via Last Method For Double Embedded Patterned Substrate App 20160315041 - YEN; You-Lung ; et al.	2016-10-27
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same App 20160240469 - LEE; Chih-Cheng ; et al.	2016-08-18
Semiconductor package structure and semiconductor process Grant 9,420,695 - Su , et al. August 16, 2	2016-08-16
Embedded component device and manufacturing methods thereof Grant 9,406,658 - Lee , et al. August 2, 2	2016-08-02
Package Carrier, Semiconductor Package, And Process For Fabricating Same App 20160218019 - SU; Yuan-Chang ; et al.	2016-07-28
Semiconductor Package And Method Of Manufacturing The Same App 20160218021 - APPELT; Bernd Karl ; et al.	2016-07-28
Semiconductor substrate, semiconductor package structure and method of making the same Grant 9,373,601 - Lee , et al. June 21, 2	2016-06-21
Semiconductor Package Structure And Semiconductor Process App 20160143149 - SU; Yuan-Chang ; et al.	2016-05-19
Semiconductor Package Including Embedded Components And Method Of Making The Same App 20160133562 - LEE; Chih-Cheng ; et al.	2016-05-12
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same App 20150348931 - LEE; Chih-Cheng ; et al.	2015-12-03
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 9,196,597 - Su , et al. November 24, 2	2015-11-24
Semiconductor package and process for fabricating same Grant 9,165,900 - Su , et al. October 20, 2	2015-10-20
Semiconductor substrate and method for making the same Grant 9,117,697 - Lee , et al. August 25, 2	2015-08-25
Semiconductor Substrate And Method For Making The Same App 20140367837 - LEE; Chun-Che ; et al.	2014-12-18
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof App 20140346670 - Su; Yuan-Chang ; et al.	2014-11-27
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 8,884,424 - Su , et al. November 11, 2	2014-11-11
Semiconductor package and process for fabricating same Grant 8,786,062 - Su , et al. July 22, 2	2014-07-22
Semiconductor Package And Process For Fabricating Same App 20140151876 - Su; Yuan-Chang ; et al.	2014-06-05
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof App 20140021636 - Su; Yuan-Chang ; et al.	2014-01-23
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 8,569,894 - Su , et al. October 29, 2	2013-10-29
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package Grant 8,399,776 - Appelt , et al. March 19, 2	2013-03-19
Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof Grant 8,367,473 - Huang , et al. February 5, 2	2013-02-05
Circuit board, and chip package structure Grant 8,357,861 - Huang , et al. January 22, 2	2013-01-22
Semiconductor package Grant 8,330,267 - Chen , et al. December 11, 2	2012-12-11
Embedded component substrate and manufacturing methods thereof Grant 8,320,134 - Su , et al. November 27, 2	2012-11-27
Leadframe package structure and manufacturing method thereof Grant 8,309,400 - Appelt , et al. November 13, 2	2012-11-13
Semiconductor package with substrate having single metal layer and manufacturing methods thereof Grant 8,288,869 - Huang , et al. October 16, 2	2012-10-16
Embedded component package structure Grant 8,284,561 - Su , et al. October 9, 2	2012-10-09
Embedded Component Device And Manufacturing Methods Thereof App 20120153493 - LEE; CHUN-CHE ; et al.	2012-06-21
Leadframe Package Structure And Manufacturing Method Thereof App 20120091569 - Appelt; Bernd Karl ; et al.	2012-04-19
Multi-layered Substrate App 20120073871 - Appelt; Bernd Karl ; et al.	2012-03-29
Method Of Fabricating Embedded Component Package Structure And The Package Structure Thereof App 20120033394 - Su; Yuan-Chang ; et al.	2012-02-09
Method of fabricating multi-layered substrate Grant 8,104,171 - Appelt , et al. January 31, 2	2012-01-31
Embedded Component Substrate and Manufacturing Methods Thereof App 20110194265 - Su; Yuan-Chang ; et al.	2011-08-11
Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof App 20110169150 - Su; Yuan-Chang ; et al.	2011-07-14
Semiconductor Package And Process For Fabricating Same App 20110084370 - SU; YUAN-CHANG ; et al.	2011-04-14
Package Carrier, Semiconductor Package, And Process For Fabricating Same App 20110084372 - SU; YUAN-CHANG ; et al.	2011-04-14
Fabrication Method Of Circuit Board, Circuit Board, And Chip Package Structure App 20110056736 - HUANG; SHIH-FU ; et al.	2011-03-10
Semiconductor Package App 20110057301 - Chen; Kuang-Hsiung ; et al.	2011-03-10
Semiconductor Package With Substrate Having Single Metal Layer And Manufacturing Methods Thereof App 20100320610 - HUANG; SHIH-FU ; et al.	2010-12-23
Substrate Having Single Patterned Metal Layer Exposing Patterned Dielectric Layer, Chip Package Structure Including The Substrate, And Manufacturing Methods Thereof App 20100314744 - Huang; Shih-Fu ; et al.	2010-12-16
Substrate Having Single Patterned Metal Layer, And Package Applied With The Substrate , And Methods Of Manufacturing Of The Substrate And Package App 20100288541 - APPELT; Bernd Karl ; et al.	2010-11-18
Substrate Having Embedded Single Patterned Metal Layer, And Package Applied With The Same, And Methods Of Manufacturing Of The Substrate And Package App 20100289132 - Huang; Shih-Fu ; et al.	2010-11-18
Method Of Fabricating Multi-layered Substrate And The Substrate Thereof App 20100055392 - Appelt; Bernd Karl ; et al.	2010-03-04

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