| Patent | Date |
|---|
Crack Detection Integrity Check
App 20220291277 - PERALTA; Pedro Jr Santos ; et al. | 2022-09-15 |
Wafer Level Packaging Having Redistribution Layer Formed Utilizing Laser Direct Structuring
App 20220285256 - LUAN; Jing-En | 2022-09-08 |
Semiconductor sensor package
Grant 11,430,765 - Zhou August 30, 2 | 2022-08-30 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
Grant 11,404,355 - Rodriguez , et al. August 2, 2 | 2022-08-02 |
Sensor Die Package
App 20220208819 - GANI; David ; et al. | 2022-06-30 |
Stacked Die Package Including A Multi-contact Interconnect
App 20220199582 - LUAN; Jing-En | 2022-06-23 |
Crack detection integrity check
Grant 11,366,156 - Peralta , et al. June 21, 2 | 2022-06-21 |
Optical Sensor Package And Method Of Making An Optical Sensor Package
App 20220189788 - LUAN; Jing-En | 2022-06-16 |
Passivation Layer For An Integrated Circuit Device That Provides A Moisture And Proton Barrier
App 20220189840 - GOH; Eng Hui ; et al. | 2022-06-16 |
Package With Polymer Pillars And Raised Portions
App 20220165699 - LUAN; Jing-En | 2022-05-26 |
Solder Mask For Thermal Pad Of A Printed Circuit Board To Provide Reliable Solder Contact To An Integrated Circuit
App 20220130750 - YAP; Daniel ; et al. | 2022-04-28 |
Method For Manufacturing A Wafer Level Chip Scale Package (wlcsp)
App 20220122941 - TENG; Chun Yi ; et al. | 2022-04-21 |
Proximity Sensor With Integrated Als
App 20220107392 - GANI; David | 2022-04-07 |
Package with electrical interconnection bridge
Grant 11,270,946 - Chen , et al. March 8, 2 | 2022-03-08 |
Method for removing a sacrificial layer on semiconductor wafers
Grant 11,257,679 - Loh February 22, 2 | 2022-02-22 |
Split-gate Trench Power Mosfet With Self-aligned Poly-to-poly Isolation
App 20220052194 - ADNAN; Ditto ; et al. | 2022-02-17 |
Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
Grant 11,244,892 - Yap , et al. February 8, 2 | 2022-02-08 |
Battery swap system for mobile stations
Grant 11,245,273 - Jyoti , et al. February 8, 2 | 2022-02-08 |
Compact microelectronic integrated gas sensor
Grant 11,231,386 - Teysseyre , et al. January 25, 2 | 2022-01-25 |
Proximity sensor with integrated ALS
Grant 11,226,399 - Gani January 18, 2 | 2022-01-18 |
Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical polishing of a coupled dielectric oxide layer
Grant 11,211,254 - Wang , et al. December 28, 2 | 2021-12-28 |
Embedded Wafer Level Optical Sensor Packaging
App 20210399157 - LUAN; Jing-En | 2021-12-23 |
Wafer Level Chip Scale Packaging With Sensor
App 20210395077 - LUAN; Jing-En | 2021-12-23 |
Slanted Glass Edge For Image Sensor Package
App 20210384241 - HERARD; Laurent ; et al. | 2021-12-09 |
Molded Range And Proximity Sensor With Optical Resin Lens
App 20210382197 - WONG; Wing Shenq ; et al. | 2021-12-09 |
Ambient light sensor with light protection
Grant 11,193,821 - Herard , et al. December 7, 2 | 2021-12-07 |
Power Mosfet With Reduced Current Leakage And Method Of Fabricating The Power Mosfet
App 20210376061 - YONG; Yean Ching | 2021-12-02 |
Monolithic Charge Coupled Field Effect Rectifier Embedded In A Charge Coupled Field Effect Transistor
App 20210336047 - LEE; Shin Phay ; et al. | 2021-10-28 |
Wafer Level Proximity Sensor
App 20210327863 - GANI; David | 2021-10-21 |
Molded range and proximity sensor with optical resin lens
Grant 11,137,517 - Wong , et al. October 5, 2 | 2021-10-05 |
Wlcsp With Transparent Substrate And Method Of Manufacturing The Same
App 20210305438 - GANI; David ; et al. | 2021-09-30 |
Adaptive Test Method And Designs For Low Power Mox Sensor
App 20210247344 - Brahem; Malek ; et al. | 2021-08-12 |
Wafer level proximity sensor
Grant 11,069,667 - Gani July 20, 2 | 2021-07-20 |
Mems Thin Membrane With Stress Structure
App 20210214211 - Shankar; Ravi ; et al. | 2021-07-15 |
Wlcsp Package With Different Solder Volumes
App 20210202419 - GANI; David | 2021-07-01 |
Process For Integrated Circuit Fabrication Using A Buffer Layer As A Stop For Chemical Mechanical Polishing Of A Coupled Dielectric Oxide Layer
App 20210193476 - WANG; Yuzhan ; et al. | 2021-06-24 |
Gas Sensor Device For Detecting Gases With Large Molecules
App 20210156836 - BRAHEM; Malek ; et al. | 2021-05-27 |
Semiconductor Package With Protected Sidewall And Method Of Forming The Same
App 20210159136 - LIU; Yun ; et al. | 2021-05-27 |
Adaptive test method and designs for low power mox sensor
Grant 11,009,474 - Brahem , et al. May 18, 2 | 2021-05-18 |
Integrated multi-sensor module
Grant 11,009,477 - Le Neel , et al. May 18, 2 | 2021-05-18 |
Optical Sensor Package
App 20210080547 - LUAN; Jing-En | 2021-03-18 |
Gas sensor device for detecting gases with large molecules
Grant 10,942,157 - Brahem , et al. March 9, 2 | 2021-03-09 |
Package With Electrical Interconnection Bridge
App 20210066198 - CHEN; Yong ; et al. | 2021-03-04 |
Multi-chip Package
App 20210035952 - CHEN; Yong ; et al. | 2021-02-04 |
Semiconductor package with protected sidewall and method of forming the same
Grant 10,910,287 - Liu , et al. February 2, 2 | 2021-02-02 |
Flexible electrochemical micro-sensor
Grant 10,905,362 - Le Neel , et al. February 2, 2 | 2021-02-02 |
Method Of Manufacturing A Thin Semiconductor Chip Using A Dummy Sidewall Layer And A Device Thereof
App 20210020555 - HERARD; Laurent ; et al. | 2021-01-21 |
Wafer Level Chip Scale Package Having Varying Thicknesses
App 20200395324 - LUAN; Jing-En | 2020-12-17 |
Semiconductor Device With A Dielectric Between Portions
App 20200381320 - LUAN; Jing-En | 2020-12-03 |
Image sensing device with cap and related methods
Grant 10,854,651 - Grebet , et al. December 1, 2 | 2020-12-01 |
Package With Lead Frame With Improved Lead Design For Discrete Electrical Components And Manufacturing The Same
App 20200365492 - RODRIGUEZ; Rennier ; et al. | 2020-11-19 |
Molded Range And Proximity Sensor With Optical Resin Lens
App 20200301042 - WONG; Wing Shenq ; et al. | 2020-09-24 |
Integrated SMO gas sensor module
Grant 10,768,133 - Shankar , et al. Sep | 2020-09-08 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
Grant 10,763,194 - Rodriguez , et al. Sep | 2020-09-01 |
Optical sensor package including a cavity formed in an image sensor die
Grant 10,749,067 - Renard , et al. A | 2020-08-18 |
Crack Detection Integrity Check
App 20200241068 - PERALTA; Pedro Jr Santos ; et al. | 2020-07-30 |
Molded range and proximity sensor with optical resin lens
Grant 10,684,389 - Wong , et al. | 2020-06-16 |
Semiconductor Sensor Package
App 20200185356 - ZHOU; Jian | 2020-06-11 |
Electronic Device Comprising A Support Substrate And Stacked Electronic Chips
App 20200168582 - GANI; David ; et al. | 2020-05-28 |
Method For Removing A Sacrificial Layer On Semiconductor Wafers
App 20200168464 - LOH; Tien Choy | 2020-05-28 |
Semiconductor packages having an electric device with a recess
Grant 10,658,238 - Goh , et al. | 2020-05-19 |
Gas Sensors
App 20200110051 - LE NEEL; Olivier ; et al. | 2020-04-09 |
Semiconductor sensor package
Grant 10,600,758 - Zhou | 2020-03-24 |
Solder Mask For Thermal Pad Of A Printed Circuit Board To Provide Reliable Solder Contact To An Integrated Circuit
App 20200075475 - Yap; Daniel ; et al. | 2020-03-05 |
Gas sensors
Grant 10,557,812 - Le Neel , et al. Feb | 2020-02-11 |
Selective Multi-gas Detection Through Pulse Heating In A Gas Sensor
App 20200033309 - YUAN; Fangxing ; et al. | 2020-01-30 |
Integrated circuit (IC) package with a solder receiving area and associated methods
Grant 10,529,652 - Wong J | 2020-01-07 |
Molded Proximity Sensor
App 20190391264 - LUAN; Jing-En ; et al. | 2019-12-26 |
Image Sensing Device With Cap And Related Methods
App 20190363123 - Grebet; Jean-Michel ; et al. | 2019-11-28 |
Proximity Sensor With Integrated Als
App 20190361093 - GANI; David | 2019-11-28 |
Durable miniature gas composition detector having fast response time
Grant 10,475,992 - Le Neel , et al. Nov | 2019-11-12 |
Electronic Device Comprising Electronic Chips
App 20190319157 - COFFY; Romain ; et al. | 2019-10-17 |
Molded proximity sensor
Grant 10,429,509 - Luan , et al. O | 2019-10-01 |
Gas analyzer that detects gases, humidity, and temperature
Grant 10,429,330 - Le Neel , et al. October 1, 2 | 2019-10-01 |
Proximity sensor with integrated ALS
Grant 10,422,860 - Gani Sept | 2019-09-24 |
Optical Sensor Package Including A Cavity Formed In An Image Sensor Die
App 20190288155 - RENARD; Loic Pierre Louis ; et al. | 2019-09-19 |
Battery Swap System For Mobile Stations
App 20190273384 - JYOTI; Prabhu ; et al. | 2019-09-05 |
Image sensing device with cap and related methods
Grant 10,403,661 - Grebet , et al. Sep | 2019-09-03 |
Semiconductor Package With Protected Sidewall And Method Of Forming The Same
App 20190267302 - LIU; Yun ; et al. | 2019-08-29 |
Flexible Electrochemical Micro-sensor
App 20190261899 - LE NEEL; Olivier ; et al. | 2019-08-29 |
Gas Sensor Device For Detecting Gases With Large Molecules
App 20190257804 - BRAHEM; Malek ; et al. | 2019-08-22 |
Integrated Multi-sensor Module
App 20190257780 - LE NEEL; Olivier ; et al. | 2019-08-22 |
Wafer level packaging, optical detection sensor and method of forming same
Grant 10,381,504 - Jin , et al. A | 2019-08-13 |
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods
App 20190237393 - Wong; Wing Shenq | 2019-08-01 |
Glue bleeding prevention cap for optical sensor packages
Grant 10,355,146 - Luan , et al. July 16, 2 | 2019-07-16 |
Optical sensor package including a cavity formed in an image sensor die
Grant 10,347,786 - Renard , et al. July 9, 2 | 2019-07-09 |
Ambient Light Sensor With Light Protection
App 20190195685 - HERARD; Laurent ; et al. | 2019-06-27 |
Adaptive Test Method And Designs For Low Power Mox Sensor
App 20190195818 - BRAHEM; Malek ; et al. | 2019-06-27 |
Integrated multi-sensor module
Grant 10,317,357 - Le Neel , et al. | 2019-06-11 |
Flexible electrochemical micro-sensor
Grant 10,299,711 - Le Neel , et al. | 2019-05-28 |
Proximity Sensor With Integrated Als
App 20190154801 - GANI; David | 2019-05-23 |
Integrated circuit (IC) package with a solder receiving area and associated methods
Grant 10,297,534 - Wong | 2019-05-21 |
Semiconductor die attachment with embedded stud bumps in attachment material
Grant 10,269,583 - Luan | 2019-04-23 |
Integrated air quality sensor that detects multiple gas species
Grant 10,254,261 - Le Neel , et al. | 2019-04-09 |
Package With Lead Frame With Improved Lead Design For Discrete Electrical Components And Manufacturing The Same
App 20190096788 - Rodriguez; Rennier ; et al. | 2019-03-28 |
Proximity sensor and manufacturing method therefor
Grant 10,244,638 - Luan | 2019-03-26 |
Semiconductor Sensor Package
App 20190081022 - ZHOU; Jian | 2019-03-14 |
Integrated Multi-sensor Module
App 20190025236 - Le Neel; Olivier ; et al. | 2019-01-24 |
Semiconductor sensor package
Grant 10,181,453 - Zhou Ja | 2019-01-15 |
Molded Range And Proximity Sensor With Optical Resin Lens
App 20190004207 - Wong; Wing Shenq ; et al. | 2019-01-03 |
Overmold proximity sensor and associated methods
Grant 10,147,834 - Herard , et al. De | 2018-12-04 |
Glue Bleeding Prevention Cap For Optical Sensor Packages
App 20180331236 - LUAN; Jing-En ; et al. | 2018-11-15 |
Semiconductor packages with pillar and bump structures
Grant 10,128,207 - Liu , et al. November 13, 2 | 2018-11-13 |
Proximity sensor, electronic apparatus and method for manufacturing proximity sensor
Grant 10,126,462 - Luan November 13, 2 | 2018-11-13 |
Semiconductor optical package and method
Grant 10,115,842 - Jin , et al. October 30, 2 | 2018-10-30 |
Integrated multi-sensor module
Grant 10,094,797 - Le Neel , et al. October 9, 2 | 2018-10-09 |
Wafer Level Packaging, Optical Detection Sensor And Method Of Forming Same
App 20180248068 - Jin; Yonggang ; et al. | 2018-08-30 |
Molded range and proximity sensor with optical resin lens
Grant 10,061,057 - Wong , et al. August 28, 2 | 2018-08-28 |
Cored Solder Wire With Rosin Flux And Thermoset Material
App 20180229334 - JIN; Yonggang ; et al. | 2018-08-16 |
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods
App 20180226325 - Wong; Wing Shenq | 2018-08-09 |
Glue bleeding prevention cap for optical sensor packages
Grant 10,038,108 - Luan , et al. July 31, 2 | 2018-07-31 |
Semiconductor Sensor Package
App 20180190616 - ZHOU; Jian | 2018-07-05 |
Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same
Grant 9,997,554 - Grebet , et al. June 12, 2 | 2018-06-12 |
Gas Sensors
App 20180156747 - LE NEEL; Olivier ; et al. | 2018-06-07 |
Wafer level packaging, optical detection sensor and method of forming same
Grant 9,991,409 - Jin , et al. June 5, 2 | 2018-06-05 |
Optical Sensor Package Including A Cavity Formed In An Image Sensor Die
App 20180151772 - RENARD; Loic Pierre Louis ; et al. | 2018-05-31 |
Flexible Electrochemical Micro-sensor
App 20180140234 - LE NEEL; Olivier ; et al. | 2018-05-24 |
Integrated circuit (IC) package with a solder receiving area and associated methods
Grant 9,972,557 - Wong May 15, 2 | 2018-05-15 |
Semiconductor Packages And Methods For Forming Same
App 20180122728 - LUAN; Jing-En | 2018-05-03 |
Durable Miniature Gas Composition Detector Having Fast Response Time
App 20180090678 - Le Neel; Olivier ; et al. | 2018-03-29 |
Flexible electrochemical micro-sensor
Grant 9,918,667 - Le Neel , et al. March 20, 2 | 2018-03-20 |
Compact Microelectronic Integrated Gas Sensor
App 20180067074 - Teysseyre; Jerome ; et al. | 2018-03-08 |
Optical sensor package including a cavity formed in an image sensor die
Grant 9,911,890 - Renard , et al. March 6, 2 | 2018-03-06 |
Glue Bleeding Prevention Cap For Optical Sensor Packages
App 20180062003 - LUAN; Jing-En ; et al. | 2018-03-01 |
Semiconductor Optical Package And Method
App 20180053861 - JIN; Yonggang ; et al. | 2018-02-22 |
Semiconductor Packages Having An Electric Device With A Recess
App 20180040514 - Goh; Kim-Yong ; et al. | 2018-02-08 |
Integrated Smo Gas Sensor Module
App 20180031506 - Shankar; Ravi ; et al. | 2018-02-01 |
Integrated Air Quality Sensor
App 20180017536 - Le Neel; Olivier ; et al. | 2018-01-18 |
Miniature Gas Analyzer
App 20180017513 - Le Neel; Olivier ; et al. | 2018-01-18 |
Optical Sensor Package Including A Cavity Formed In An Image Sensor Die
App 20180006182 - RENARD; Loic Pierre Louis ; et al. | 2018-01-04 |
Compact microelectronic integrated gas sensor
Grant 9,851,328 - Teysseyre , et al. December 26, 2 | 2017-12-26 |
Semiconductor optical package and method
Grant 9,831,357 - Jin , et al. November 28, 2 | 2017-11-28 |
Semiconductor packages having an electric device with a recess
Grant 9,824,924 - Goh , et al. November 21, 2 | 2017-11-21 |
Durable miniature gas composition detector having fast response time
Grant 9,818,937 - Le Neel , et al. November 14, 2 | 2017-11-14 |
Integrated SMO gas sensor module
Grant 9,810,653 - Shankar , et al. November 7, 2 | 2017-11-07 |
Air venting on proximity sensor
Grant 9,793,427 - Gani October 17, 2 | 2017-10-17 |
Wafer Level Proximity Sensor
App 20170287886 - Gani; David | 2017-10-05 |
Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity
Grant 9,780,080 - Jin October 3, 2 | 2017-10-03 |
Image Sensing Device With Cap And Related Methods
App 20170278885 - GREBET; Jean-Michel ; et al. | 2017-09-28 |
Image sensor device with different width cell layers and related methods
Grant 9,768,216 - Delacruz , et al. September 19, 2 | 2017-09-19 |
Integrated Circuit (ic) Package With A Grounded Electrically Conductive Shield Layer And Associated Methods
App 20170263565 - RENARD; Loic Pierre Louis ; et al. | 2017-09-14 |
Integrated Multi-sensor Module
App 20170261458 - Le Neel; Olivier ; et al. | 2017-09-14 |
Vacuum integrated electronic device and manufacturing process thereof
Grant 9,754,756 - Patti , et al. September 5, 2 | 2017-09-05 |
Patterned lead frame
Grant 9,754,861 - Wong September 5, 2 | 2017-09-05 |
Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
Grant 9,754,916 - Luan September 5, 2 | 2017-09-05 |
Electronic device with redistribution layer and stiffeners and related methods
Grant 9,698,105 - Luan July 4, 2 | 2017-07-04 |
High throughput programming system and method for a phase change non-volatile memory device
Grant 9,697,896 - Conte , et al. July 4, 2 | 2017-07-04 |
Semiconductor Packages And Methods For Forming Same
App 20170186674 - Luan; Jing-En | 2017-06-29 |
Method For Making An Integrated Circuit (ic) Package With An Electrically Conductive Shield Layer
App 20170186644 - HERARD; Laurent ; et al. | 2017-06-29 |
Integrated multi-sensor module
Grant 9,689,824 - Le Neel , et al. June 27, 2 | 2017-06-27 |
Image sensing device with cap and related methods
Grant 9,691,801 - Grebet , et al. June 27, 2 | 2017-06-27 |
Integrated circuit device with shaped leads and method of forming the device
Grant 9,679,870 - Ma , et al. June 13, 2 | 2017-06-13 |
Optical assembly including electrically conductive coupling member and related methods
Grant 9,671,671 - Lim , et al. June 6, 2 | 2017-06-06 |
Vacuum Integrated Electronic Device And Manufacturing Process Thereof
App 20170148604 - Patti; Davide Giuseppe ; et al. | 2017-05-25 |
Accumulated power consumption sensor: application in smart batteries systems
Grant 9,651,627 - Le Neel , et al. May 16, 2 | 2017-05-16 |
Proximity sensor, electronic apparatus and method for manufacturing proximity sensor
Grant 9,645,238 - Luan May 9, 2 | 2017-05-09 |
Proximity Sensor, Electronic Apparatus And Method For Manufacturing Proximity Sensor
App 20170123064 - LUAN; Jing-En | 2017-05-04 |
Proximity Sensor, Electronic Apparatus And Method For Manufacturing Proximity Sensor
App 20170123101 - Luan; Jing-En | 2017-05-04 |
Selective component bonding technique
Grant 9,638,884 - Tun May 2, 2 | 2017-05-02 |
Image sensor circuit, system, and method
Grant 9,640,574 - Luan , et al. May 2, 2 | 2017-05-02 |
Overmold Proximity Sensor And Associated Methods
App 20170110618 - HERARD; Laurent ; et al. | 2017-04-20 |
Electronic device with heat dissipater
Grant 9,620,438 - Duca , et al. April 11, 2 | 2017-04-11 |
Optical package with recess in transparent cover
Grant 9,608,029 - Wong March 28, 2 | 2017-03-28 |
Lens mount with conductive glue pocket for grounding to a circuit board
Grant 9,596,748 - Lim March 14, 2 | 2017-03-14 |
Wafer level packaging for proximity sensor
Grant 9,583,666 - Luan February 28, 2 | 2017-02-28 |
Semiconductor Die Attachment With Embedded Stud Bumps In Attachment Material
App 20170053856 - LUAN; Jing-En | 2017-02-23 |
Molded Range And Proximity Sensor With Optical Resin Lens
App 20170052277 - Wong; Wing Shenq ; et al. | 2017-02-23 |
Proximity Sensor And Manufacturing Method Therefor
App 20170052040 - LUAN; Jing-En | 2017-02-23 |
Wafer level chip scale package (WLCSP) having edge protection
Grant 9,576,912 - Ma , et al. February 21, 2 | 2017-02-21 |
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device
App 20170040286 - LUAN; Jing-En | 2017-02-09 |
Optical sensor package
Grant 9,543,282 - Wong January 10, 2 | 2017-01-10 |
Wafer handling station including cassette members with lateral wafer confining brackets and associated methods
Grant 9,530,675 - Bactasa December 27, 2 | 2016-12-27 |
Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
Grant 9,530,681 - Leung , et al. December 27, 2 | 2016-12-27 |
Flexible smart glove
Grant 9,529,433 - Shankar , et al. December 27, 2 | 2016-12-27 |
Electronic Device with Redistribution Layer and Stiffeners and Related Methods
App 20160372426 - Luan; Jing-En | 2016-12-22 |
Image Sensor Device With An Electromagnetic Compatibility Shield (emc) And Associated Methods
App 20160373674 - DE LA CRUZ; DAVE ALEXIS | 2016-12-22 |
Method for making semiconductor devices including reactant treatment of residual surface portion
Grant 9,524,866 - Chew December 20, 2 | 2016-12-20 |
Proximity and ranging sensor
Grant 9,525,094 - Saugier , et al. December 20, 2 | 2016-12-20 |
Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods
Grant 9,525,832 - De La Cruz December 20, 2 | 2016-12-20 |
Image sensor device with sensing surface cavity and related methods
Grant 9,525,002 - Wong December 20, 2 | 2016-12-20 |
Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
Grant 9,502,381 - Luan November 22, 2 | 2016-11-22 |
Semiconductor Packages With Pillar And Bump Structures
App 20160293559 - Liu; Yun ; et al. | 2016-10-06 |
Electronic Device With Dummy Ic Die And Related Methods
App 20160293512 - MA; Yiyi ; et al. | 2016-10-06 |
Proximity And Ranging Sensor
App 20160284920 - SAUGIER; Eric ; et al. | 2016-09-29 |
Image sensing device with interconnect layer gap
Grant 9,455,292 - Luan September 27, 2 | 2016-09-27 |
Integrated circuit package and method of forming the same
Grant 9,455,241 - Jin , et al. September 27, 2 | 2016-09-27 |
Gas sensor device with frame passageways and related methods
Grant 9,448,216 - Jin , et al. September 20, 2 | 2016-09-20 |
Microsensor with integrated temperature control
Grant 9,448,198 - Le Neel , et al. September 20, 2 | 2016-09-20 |
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
Grant 9,449,912 - Zhang , et al. September 20, 2 | 2016-09-20 |
Absolute temperature method for disposable glucose strip
Grant 9,435,763 - Le Neel , et al. September 6, 2 | 2016-09-06 |
Combo bio and temperature disposable sensor on flexible foil
Grant 9,437,798 - Le Neel , et al. September 6, 2 | 2016-09-06 |
Error correction in memory devices by multiple readings with different references
Grant 9,430,328 - Conte , et al. August 30, 2 | 2016-08-30 |
Integrated circuit (IC) package with thick die pad functioning as a heat sink
Grant 9,418,920 - Wong August 16, 2 | 2016-08-16 |
Image Sensor Device With Sensing Surface Cavity And Related Methods
App 20160197113 - WONG; Wing Shenq | 2016-07-07 |
Integrated Circuit (ic) Package With Thick Die Pad, And Associated Methods
App 20160197030 - WONG; Wing Shenq | 2016-07-07 |
Image sensor device with flexible interconnect layer and related methods
Grant 9,385,153 - Luan July 5, 2 | 2016-07-05 |
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device
App 20160190097 - LUAN; Jing-En | 2016-06-30 |
Molded Proximity Sensor
App 20160187483 - LUAN; Jing-En ; et al. | 2016-06-30 |
Chip Scale Package Camera Module With Glass Interposer And Method For Making The Same
App 20160190192 - GREBET; Jean-Michel ; et al. | 2016-06-30 |
Cored Solder Wire With Rosin Flux And Thermoset Material
App 20160184938 - JIN; Yonggang ; et al. | 2016-06-30 |
Wafer Level Packaging For Proximity Sensor
App 20160190380 - LUAN; Jing-En | 2016-06-30 |
Flexible Smart Glove
App 20160187973 - SHANKAR; Ravi ; et al. | 2016-06-30 |
Method Of Making An Electronic Device Including Two-step Encapsulation And Related Devices
App 20160190029 - GOH; Kim-Yong ; et al. | 2016-06-30 |
Method of making an electronic device including two-step encapsulation and related devices
Grant 9,379,034 - Goh , et al. June 28, 2 | 2016-06-28 |
Method of processing a semiconductor wafer such as to make prototypes and related apparatus
Grant 9,377,678 - Lee , et al. June 28, 2 | 2016-06-28 |
Image Sensing Device With Cap And Related Methods
App 20160181299 - GREBET; Jean-Michel ; et al. | 2016-06-23 |
Integrated Circuit Device With Shaped Leads And Method Of Forming The Device
App 20160172262 - MA; Yiyi ; et al. | 2016-06-16 |
Integrated Circuit (ic) Package With A Solder Receiving Area And Associated Methods
App 20160172272 - WONG; Wing Shenq | 2016-06-16 |
Image Sensor Device With Different Width Cell Layers And Related Methods
App 20160133662 - DELACRUZ; Dave Alexis ; et al. | 2016-05-12 |
Apparatus and method to attach a wireless communication device into a semiconductor package
Grant 9,337,111 - Bintang May 10, 2 | 2016-05-10 |
Method To Provide The Thinnest And Variable Substrate Thickness For Reliable Plastic And Flexible Electronic Device
App 20160118289 - LEUNG; Calvin ; et al. | 2016-04-28 |
Durable Miniature Gas Composition Detector Having Fast Response Time
App 20160111635 - Le Neel; Olivier ; et al. | 2016-04-21 |
Patterned Lead Frame
App 20160104663 - WONG; Wing Shenq | 2016-04-14 |
Gas Sensor Device With Frame Passageways And Related Methods
App 20160103109 - JIN; Yonggang ; et al. | 2016-04-14 |
Method For Making An Optical Proximity Sensor
App 20160104698 - Jin; Yonggang | 2016-04-14 |
Image Sensing Device With Interconnect Layer Gap And Related Methods
App 20160104738 - LUAN; Jing-En | 2016-04-14 |
Electronic Device With Redistribution Layer And Stiffeners And Related Methods
App 20160104656 - LUAN; Jing-En | 2016-04-14 |
Optical Semiconductor Device Including Blackened Tarnishable Bond Wires And Related Methods
App 20160104805 - Renard; Loic Pierre Louis ; et al. | 2016-04-14 |
Image Sensor Device With Flexible Interconnect Layer And Related Methods
App 20160104737 - LUAN; Jing-En | 2016-04-14 |
Wafer Level Packaging, Optical Detection Sensor And Method Of Forming Same
App 20160099373 - Jin; Yonggang ; et al. | 2016-04-07 |
Method For Making Semiconductor Devices Including Reactant Treatment Of Residual Surface Portion
App 20160093490 - CHEW; CHONG JIEH | 2016-03-31 |
Compact Microelectronic Integrated Gas Sensor
App 20160047774 - Teysseyre; Jerome ; et al. | 2016-02-18 |
Integrated Multi-sensor Module
App 20160041114 - Le Neel; Olivier ; et al. | 2016-02-11 |
System-in-packages And Methods For Forming Same
App 20160035590 - Jin; Yonggang | 2016-02-04 |
Integrated Smo Gas Sensor Module
App 20160018356 - Shankar; Ravi ; et al. | 2016-01-21 |
Selective Component Bonding Technique
App 20160004029 - Tun; Tin | 2016-01-07 |
Electronic Device Including Components In Component Receiving Cavity And Related Methods
App 20150332995 - GOH; Kim-Yong ; et al. | 2015-11-19 |
Integrated Circuit Package And Method Of Forming The Same
App 20150303168 - JIN; YONGGANG ; et al. | 2015-10-22 |
Flexible Electrochemical Micro-sensor
App 20150253276 - Le Neel; Olivier ; et al. | 2015-09-10 |
High Throughput Programming System And Method For A Phase Change Non-volatile Memory Device
App 20150243356 - CONTE; Antonino ; et al. | 2015-08-27 |
Low Profile Camera Module With Image Compensation
App 20150237245 - Renard; Loic Pierre Louis ; et al. | 2015-08-20 |
Electronic Device With Heat Dissipater
App 20150235929 - Duca; Roseanne ; et al. | 2015-08-20 |
Method Of Making A Suspended Membrane Device
App 20150210539 - LE NEEL; Olivier ; et al. | 2015-07-30 |
Error Correction In Memory Devices By Multiple Readings With Different References
App 20150212881 - CONTE; Antonino ; et al. | 2015-07-30 |
Method For Making Semiconductor Devices Including Reactant Treatment Of Residual Surface Portion
App 20150194303 - CHEW; ChongJieh | 2015-07-09 |
Method To Provide The Thinnest And Variable Substrate Thickness For Reliable Plastic And Flexible Electronic Device
App 20150145137 - Leung; Calvin ; et al. | 2015-05-28 |
Optical Sensor Package
App 20150137148 - Wong; Wing Shenq | 2015-05-21 |
Camera Module
App 20150138436 - Wong; Wing Shenq | 2015-05-21 |
Liquid Crystal Cell Connection To Lens Mount Of Camera Module
App 20150138420 - Looi; Hk ; et al. | 2015-05-21 |
Method Of Processing A Semiconductor Wafer Such As To Make Prototypes And Related Apparatus
App 20150140479 - Lee; Alan ; et al. | 2015-05-21 |
Optical Assembly Including Electrically Conductive Coupling Member And Related Methods
App 20150103297 - LIM; WeeChinJudy ; et al. | 2015-04-16 |
No-lead Semiconductor Package And Method Of Manufacturing The Same
App 20150084171 - Ma; Yiyi ; et al. | 2015-03-26 |
Through Via Package
App 20150069607 - Hwang; How Yuan ; et al. | 2015-03-12 |
Optoelectronics Assembly And Method Of Making Optoelectronics Assembly
App 20150060891 - Jin; Yonggang | 2015-03-05 |
Electronic Modules And Methods Of Making Electronic Modules
App 20150035133 - Wong; Wing Shenq | 2015-02-05 |
Image Sensor Device With Infrared Filter Adhesively Secured To Image Sensor Integrated Circuit And Related Methods
App 20150028187 - JIN; Yonggang ; et al. | 2015-01-29 |
Combo Bio And Temperature Disposable Sensor On Flexible Foil
App 20150001075 - Le Neel; Olivier ; et al. | 2015-01-01 |
Optical Package With Recess In Transparent Cover
App 20150001111 - Wong; Wing Shenq | 2015-01-01 |
Infrared Camera Sensor
App 20150001659 - Le Neel; Olivier ; et al. | 2015-01-01 |
Absolute Temperature Method For Disposable Glucose Strip
App 20150001071 - Le Neel; Olivier ; et al. | 2015-01-01 |
Through via package
Grant 08922013 - | 2014-12-30 |
Semiconductor Optical Package And Method
App 20140353788 - Jin; Yonggang ; et al. | 2014-12-04 |
Ink Jet Printhead With Polarity-changing Driver For Thermal Resistors
App 20140340452 - Kunnavakkam; Madanagopal ; et al. | 2014-11-20 |
Methods And Devices For Packaging Integrated Circuits
App 20140291782 - Goh; Kim-Yong ; et al. | 2014-10-02 |
Semiconductor Packages Having An Electric Device With A Recess
App 20140291812 - Goh; Kim-Yong ; et al. | 2014-10-02 |
Integrated Multi-sensor Module
App 20140291677 - Le Neel; Olivier ; et al. | 2014-10-02 |
Adhesive Bonding Technique For Use With Capacitive Micro-sensors
App 20140291829 - Le Neel; Olivier ; et al. | 2014-10-02 |
Apparatus And Method To Attach A Wireless Communication Device Into A Semiconductor Package
App 20140291867 - Bintang; Yohanes | 2014-10-02 |
Durable Miniature Gas Composition Detector Having Fast Response Time
App 20140292317 - Le Neel; Olivier ; et al. | 2014-10-02 |
Contact Having An Angled Portion
App 20140293120 - Looi; Hk ; et al. | 2014-10-02 |
Lens Mount With Conductive Glue Pocket For Grounding To A Circuit Board
App 20140293558 - Lim; Wee Chin Judy | 2014-10-02 |
Accumulated Power Consumption Sensor: Application In Smart Batteries Systems
App 20140292344 - Le Neel; Olivier ; et al. | 2014-10-02 |
Microelectronic Environmental Sensing Module
App 20140294046 - Le Neel; Olivier ; et al. | 2014-10-02 |
| 