| Patent | Date |
|---|
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
Grant RE47,923 - Camacho , et al. | 2020-03-31 |
Semiconductor device and method of forming high routing density interconnect sites on substrate
Grant 10,580,749 - Pendse | 2020-03-03 |
Semiconductor device and method of forming double-sided fan-out wafer level package
Grant 10,453,785 - Shim , et al. Oc | 2019-10-22 |
Semiconductor device and method of forming dual fan-out semiconductor package
Grant 10,418,298 - Lin Sept | 2019-09-17 |
Semiconductor device and method of forming electrical interconnect with stress relief void
Grant RE47,600 - Pendse Sept | 2019-09-10 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
Grant 10,297,518 - Lin , et al. | 2019-05-21 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 10,211,183 - Lin , et al. Feb | 2019-02-19 |
Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics
Grant 10,204,879 - Lin , et al. Feb | 2019-02-12 |
Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
Grant 10,192,796 - Lin , et al. Ja | 2019-01-29 |
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer
Grant 10,163,815 - Lin , et al. Dec | 2018-12-25 |
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
Grant 10,141,222 - Lin , et al. Nov | 2018-11-27 |
Semiconductor device and method of forming conductive vias by backside via reveal with CMP
Grant 10,115,701 - Zhao , et al. October 30, 2 | 2018-10-30 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 10,083,916 - Shim , et al. September 25, 2 | 2018-09-25 |
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
Grant 10,068,877 - Lee , et al. September 4, 2 | 2018-09-04 |
Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
Grant 10,068,843 - Pagaila September 4, 2 | 2018-09-04 |
Semiconductor device and method of forming a package in-fan out package
Grant 10,068,862 - Do , et al. September 4, 2 | 2018-09-04 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 10,049,964 - Shim , et al. August 14, 2 | 2018-08-14 |
Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
Grant 9,978,654 - Lin , et al. May 22, 2 | 2018-05-22 |
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
Grant 9,978,700 - Lin May 22, 2 | 2018-05-22 |
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
Grant 9,966,335 - Cho , et al. May 8, 2 | 2018-05-08 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield
Grant 9,941,207 - Lin April 10, 2 | 2018-04-10 |
Bump-on-lead flip chip interconnection
Grant 9,922,915 - Pendse March 20, 2 | 2018-03-20 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 9,893,045 - Pagaila , et al. February 13, 2 | 2018-02-13 |
Double-sided semiconductor package and dual-mold method of making same
Grant 9,893,017 - Shim , et al. February 13, 2 | 2018-02-13 |
Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
Grant 9,881,894 - Pendse January 30, 2 | 2018-01-30 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
Grant 9,875,973 - Lin , et al. January 23, 2 | 2018-01-23 |
Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
Grant 9,865,556 - Pendse January 9, 2 | 2018-01-09 |
Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
Grant 9,865,524 - Na , et al. January 9, 2 | 2018-01-09 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
Grant 9,865,525 - Lin , et al. January 9, 2 | 2018-01-09 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,847,324 - Lin , et al. December 19, 2 | 2017-12-19 |
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
Grant 9,842,798 - Marimuthu , et al. December 12, 2 | 2017-12-12 |
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
Grant 9,842,808 - Shin , et al. December 12, 2 | 2017-12-12 |
Semiconductor device and method of forming substrate including embedded component with symmetrical structure
Grant 9,837,484 - Jung , et al. December 5, 2 | 2017-12-05 |
Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units
Grant 9,837,303 - Lin , et al. December 5, 2 | 2017-12-05 |
Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
Grant 9,837,336 - Choi , et al. December 5, 2 | 2017-12-05 |
Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
Grant 9,824,975 - Pagaila , et al. November 21, 2 | 2017-11-21 |
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
Grant 9,818,734 - Lin , et al. November 14, 2 | 2017-11-14 |
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package
Grant 9,799,590 - Lee , et al. October 24, 2 | 2017-10-24 |
Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces
Grant 9,799,621 - Lee , et al. October 24, 2 | 2017-10-24 |
Semiconductor device and method of forming PoP semiconductor device with RDL over top package
Grant 9,786,623 - Lin October 10, 2 | 2017-10-10 |
Semiconductor device and method of forming pad layout for flipchip semiconductor die
Grant 9,780,057 - Pendse October 3, 2 | 2017-10-03 |
Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
Grant 9,780,063 - Choi , et al. October 3, 2 | 2017-10-03 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,768,155 - Lin , et al. September 19, 2 | 2017-09-19 |
Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation
Grant 9,768,066 - Zhao , et al. September 19, 2 | 2017-09-19 |
Semiconductor device and method of making embedded wafer level chip scale packages
Grant 9,768,038 - Lin September 19, 2 | 2017-09-19 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
Grant 9,754,897 - Lin , et al. September 5, 2 | 2017-09-05 |
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
Grant 9,754,858 - Pagaila , et al. September 5, 2 | 2017-09-05 |
Semiconductor device and method of wafer thinning involving edge trimming and CMP
Grant 9,728,415 - Chockanathan , et al. August 8, 2 | 2017-08-08 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
Grant 9,721,921 - Kim , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
Grant 9,721,862 - Han , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
Grant 9,721,925 - Bathan , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package
Grant 9,721,922 - Marimuthu , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming a dual UBM structure for lead free bump connections
Grant 9,711,438 - Lin , et al. July 18, 2 | 2017-07-18 |
Semiconductor device and method of forming embedded wafer level chip scale packages
Grant 9,704,824 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
Grant 9,704,857 - Kim , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
Grant 9,704,780 - Marimuthu , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming MEMS package
Grant 9,701,534 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)
Grant 9,704,769 - Strothmann , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
Grant 9,691,707 - Chi , et al. June 27, 2 | 2017-06-27 |
Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect
Grant 9,685,415 - Lin , et al. June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
Grant 9,685,350 - Lin , et al. June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer
Grant 9,685,403 - Pagaila June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
Grant 9,679,824 - Pagaila , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material
Grant 9,679,881 - Pagaila , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of confining conductive bump material with solder mask patch
Grant 9,679,811 - Pendse June 13, 2 | 2017-06-13 |
Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids
Grant 9,679,846 - Lee , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of making wafer level chip scale package
Grant 9,673,093 - Hsieh , et al. June 6, 2 | 2017-06-06 |
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
Grant 9,666,540 - Dahilig , et al. May 30, 2 | 2017-05-30 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,666,500 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield
Grant 9,653,445 - Lin May 16, 2 | 2017-05-16 |
Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
Grant 9,640,504 - Pagaila , et al. May 2, 2 | 2017-05-02 |
Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material
Grant 9,627,229 - Lan , et al. April 18, 2 | 2017-04-18 |
Semiconductor device and method of forming ultra high density embedded semiconductor die package
Grant 9,627,338 - Lim , et al. April 18, 2 | 2017-04-18 |
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
Grant 9,620,557 - Chow , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 9,620,413 - Strothmann , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 9,607,965 - Heng , et al. March 28, 2 | 2017-03-28 |
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
Grant 9,607,958 - Lin , et al. March 28, 2 | 2017-03-28 |
Semiconductor device and method of forming conductive vias with trench in saw street
Grant 9,601,369 - Do , et al. March 21, 2 | 2017-03-21 |
Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer
Grant 9,601,462 - Choi , et al. March 21, 2 | 2017-03-21 |
Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die
Grant 9,589,910 - Pagaila , et al. March 7, 2 | 2017-03-07 |
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection
Grant 9,589,876 - Camacho , et al. March 7, 2 | 2017-03-07 |
Semiconductor device and method of forming a shielding layer between stacked semiconductor die
Grant 9,583,446 - Pagaila , et al. February 28, 2 | 2017-02-28 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 9,559,039 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 9,558,958 - Lin , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,559,029 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
Grant 9,553,162 - Strothmann , et al. January 24, 2 | 2017-01-24 |
Semiconductor device and method of forming an inductor on polymer matrix composite substrate
Grant 9,548,347 - Lin January 17, 2 | 2017-01-17 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
Grant 9,548,240 - Lin , et al. January 17, 2 | 2017-01-17 |
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
Grant 9,543,258 - Kim , et al. January 10, 2 | 2017-01-10 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
Grant 9,527,723 - Lin , et al. December 27, 2 | 2016-12-27 |
Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
Grant 9,530,738 - Chua , et al. December 27, 2 | 2016-12-27 |
Package-in-package using through-hole via die on saw streets
Grant 9,524,938 - Do , et al. December 20, 2 | 2016-12-20 |
Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding
Grant 9,524,958 - Choi , et al. December 20, 2 | 2016-12-20 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
Grant 9,520,365 - Lin , et al. December 13, 2 | 2016-12-13 |
Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
Grant 9,515,016 - Huang , et al. December 6, 2 | 2016-12-06 |
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure
App 20160351486 - Jung; JinHee ; et al. | 2016-12-01 |
Methods of forming conductive jumper traces
Grant 9,508,635 - Shin , et al. November 29, 2 | 2016-11-29 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 9,508,621 - Lin , et al. November 29, 2 | 2016-11-29 |
Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
Grant 9,496,195 - Lin , et al. November 15, 2 | 2016-11-15 |
Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
Grant 9,484,334 - Frye , et al. November 1, 2 | 2016-11-01 |
Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP
Grant 9,478,485 - Bao , et al. October 25, 2 | 2016-10-25 |
Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
Grant 9,478,486 - Kim , et al. October 25, 2 | 2016-10-25 |
Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
Grant 9,478,513 - Chen , et al. October 25, 2 | 2016-10-25 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
Grant 9,472,452 - Lin , et al. October 18, 2 | 2016-10-18 |
Semiconductor device and method of forming wire bondable fan-out EWLB package
Grant 9,472,533 - Pendse October 18, 2 | 2016-10-18 |
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
App 20160300797 - Shim; Il Kwon ; et al. | 2016-10-13 |
Semiconductor Device and Method of Forming a Package In-Fan Out Package
App 20160300817 - Do; Byung Tai ; et al. | 2016-10-13 |
Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection
Grant 9,460,972 - Park , et al. October 4, 2 | 2016-10-04 |
Semiconductor Device and Method of Forming POP Semiconductor Device with RDL Over Top Package
App 20160276307 - Lin; Yaojian | 2016-09-22 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 9,449,943 - Lin , et al. September 20, 2 | 2016-09-20 |
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
Grant 9,449,932 - Do , et al. September 20, 2 | 2016-09-20 |
Integrated passive devices
Grant 9,449,925 - Lin , et al. September 20, 2 | 2016-09-20 |
Semiconductor device having wire studs as vertical interconnect in FO-WLP
Grant 9,443,797 - Marimuthu , et al. September 13, 2 | 2016-09-13 |
Semiconductor device and method of forming a thin wafer without a carrier
Grant 9,443,762 - Marimuthu , et al. September 13, 2 | 2016-09-13 |
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
Grant 9,443,828 - Pagaila , et al. September 13, 2 | 2016-09-13 |
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
Grant 9,443,829 - Pagaila September 13, 2 | 2016-09-13 |
Semiconductor device and method of forming shielding layer over active surface of semiconductor die
Grant 9,437,482 - Pagaila September 6, 2 | 2016-09-06 |
Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
Grant 9,437,538 - Pagaila , et al. September 6, 2 | 2016-09-06 |
Semiconductor device and method of forming insulating layer around semiconductor die
Grant 9,437,552 - Lin , et al. September 6, 2 | 2016-09-06 |
Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
Grant 9,431,331 - Do , et al. August 30, 2 | 2016-08-30 |
Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers
Grant 9,418,962 - Pagaila August 16, 2 | 2016-08-16 |
Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
Grant 9,418,913 - Shim , et al. August 16, 2 | 2016-08-16 |
Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP
Grant 9,418,878 - Pagaila , et al. August 16, 2 | 2016-08-16 |
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
App 20160233168 - Chi; HeeJo ; et al. | 2016-08-11 |
Integrated circuit packaging system with insulated trace and method of manufacture thereof
Grant 9,406,642 - Chi , et al. August 2, 2 | 2016-08-02 |
Extended redistribution layers bumped wafer
Grant 9,406,647 - Do , et al. August 2, 2 | 2016-08-02 |
Methods of forming conductive and insulating layers
Grant 9,406,533 - Chi , et al. August 2, 2 | 2016-08-02 |
Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded Within Interconnect Structure
App 20160218089 - Lee; KyungHoon ; et al. | 2016-07-28 |
Semiconductor Device and Method of Forming MEMS Package
App 20160214857 - Lin; Yaojian ; et al. | 2016-07-28 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,401,331 - Lin , et al. July 26, 2 | 2016-07-26 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
Grant 9,401,347 - Lee , et al. July 26, 2 | 2016-07-26 |
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
Grant 9,397,058 - Bao , et al. July 19, 2 | 2016-07-19 |
Optical semiconductor device having pre-molded leadframe with window and method therefor
Grant 9,397,236 - Camacho , et al. July 19, 2 | 2016-07-19 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20160197022 - Pagaila; Reza A. ; et al. | 2016-07-07 |
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
App 20160197059 - Lin; Yaojian ; et al. | 2016-07-07 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
Grant 9,385,052 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor package with embedded die
Grant 9,385,074 - Pendse July 5, 2 | 2016-07-05 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
Grant 9,385,102 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor device and method of forming bump-on-lead interconnection
Grant 9,385,101 - Pendse July 5, 2 | 2016-07-05 |
Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
Grant 9,378,983 - Choi , et al. June 28, 2 | 2016-06-28 |
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
Grant 9,379,064 - Oh , et al. June 28, 2 | 2016-06-28 |
Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
Grant 9,379,084 - Pendse June 28, 2 | 2016-06-28 |
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
Grant 9,373,578 - Choi , et al. June 21, 2 | 2016-06-21 |
Solder joint flip chip interconnection
Grant 9,373,573 - Pendse , et al. June 21, 2 | 2016-06-21 |
Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer
Grant 9,368,563 - Lin , et al. June 14, 2 | 2016-06-14 |
Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
Grant 9,368,423 - Do , et al. June 14, 2 | 2016-06-14 |
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form
App 20160163675 - Kim; KyungMoon ; et al. | 2016-06-09 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
Grant 9,362,161 - Chi , et al. June 7, 2 | 2016-06-07 |
Integrated circuit package stacking system with redistribution and method of manufacture thereof
Grant 9,355,962 - Lee , et al. May 31, 2 | 2016-05-31 |
Integrated circuit packaging system with interposer structure and method of manufacture thereof
Grant 9,355,983 - Camacho , et al. May 31, 2 | 2016-05-31 |
Integrated circuit package stacking system with shielding and method of manufacture thereof
Grant 9,355,939 - Cho , et al. May 31, 2 | 2016-05-31 |
Integrated circuit system with debonding adhesive and method of manufacture thereof
Grant 9,355,993 - Choi , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device and Method of Forming Holes in Substrate to Interconnect Top Shield and Ground Shield
App 20160148882 - Kim; OhHan ; et al. | 2016-05-26 |
Semiconductor device and method of forming passive devices
Grant 9,349,723 - Lin , et al. May 24, 2 | 2016-05-24 |
Integrated circuit packaging system with package stacking
Grant 9,349,666 - Bae , et al. May 24, 2 | 2016-05-24 |
Semiconductor device and method of forming stress-reduced conductive joint structures
Grant 9,349,700 - Hsieh , et al. May 24, 2 | 2016-05-24 |
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
Grant 9,349,616 - Lee , et al. May 24, 2 | 2016-05-24 |
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP)
App 20160141238 - Yoon; Seung Wook ; et al. | 2016-05-19 |
Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
Grant 9,345,148 - Pendse May 17, 2 | 2016-05-17 |
Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
Grant 9,343,396 - Lin , et al. May 17, 2 | 2016-05-17 |
Semiconductor device and method of forming double-sided through vias in saw streets
Grant 9,343,429 - Pagaila , et al. May 17, 2 | 2016-05-17 |
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
Grant 9,337,161 - Camacho , et al. May 10, 2 | 2016-05-10 |
Method of forming an inductor on a semiconductor wafer
Grant 9,337,141 - Lin , et al. May 10, 2 | 2016-05-10 |
Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
Grant 9,337,116 - Pagaila , et al. May 10, 2 | 2016-05-10 |
Semiconductor device and method of forming through vias with reflowed conductive material
Grant 9,331,002 - Pagaila , et al. May 3, 2 | 2016-05-03 |
Integrated circuit package system with multi-chip module
Grant 9,330,945 - Song , et al. May 3, 2 | 2016-05-03 |
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring
Grant 9,330,994 - Camacho , et al. May 3, 2 | 2016-05-03 |
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
Grant 9,331,007 - Yoon , et al. May 3, 2 | 2016-05-03 |
Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
Grant 9,331,003 - Camacho , et al. May 3, 2 | 2016-05-03 |
Semiconductor Device and Method of Fabricating 3D Package With Short Cycle Time and High Yield
App 20160118332 - Lin; Yaojian | 2016-04-28 |
Semiconductor Device and Method of Fabricating 3D Package with Short Cycle Time and High Yield
App 20160118333 - Lin; Yaojian | 2016-04-28 |
Integrated circuit packaging system with transferable trace lead frame
Grant 9,324,584 - Do , et al. April 26, 2 | 2016-04-26 |
Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package
Grant 9,324,672 - Pagaila April 26, 2 | 2016-04-26 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 9,324,700 - Lin , et al. April 26, 2 | 2016-04-26 |
Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die
Grant 9,324,659 - Cho , et al. April 26, 2 | 2016-04-26 |
Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof
Grant 9,324,673 - Camacho April 26, 2 | 2016-04-26 |
Integrated circuit packaging system with external interconnect and method of manufacture thereof
Grant 9,324,641 - Do , et al. April 26, 2 | 2016-04-26 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20160111410 - Pagaila; Reza A. ; et al. | 2016-04-21 |
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package
Grant 9,318,404 - Lin , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant
Grant 9,318,380 - Kim , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
Grant 9,318,441 - Pagaila , et al. April 19, 2 | 2016-04-19 |
Integrated circuit packaging system with magnetic film and method of manufacture thereof
Grant 9,318,403 - Kim , et al. April 19, 2 | 2016-04-19 |
Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die
App 20160104681 - Dahilig; Frederick R. ; et al. | 2016-04-14 |
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region
App 20160104731 - Chow; Seng Guan ; et al. | 2016-04-14 |
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
Grant 9,312,150 - Ahmad , et al. April 12, 2 | 2016-04-12 |
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die
Grant 9,312,218 - Choi , et al. April 12, 2 | 2016-04-12 |
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
Grant 9,305,854 - Shim , et al. April 5, 2 | 2016-04-05 |
Integrated circuit packaging system with electrical interface and method of manufacture thereof
Grant 9,305,873 - Do , et al. April 5, 2 | 2016-04-05 |
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
Grant 9,305,897 - Choi , et al. April 5, 2 | 2016-04-05 |
Integrated circuit packaging system with coreless substrate and method of manufacture thereof
Grant 9,305,809 - Espiritu , et al. April 5, 2 | 2016-04-05 |
Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
Grant 9,299,644 - Do , et al. March 29, 2 | 2016-03-29 |
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof
Grant 9,299,650 - Chi , et al. March 29, 2 | 2016-03-29 |
Integrated circuit packaging system with patterned substrate and method of manufacture thereof
Grant 9,299,648 - Shim , et al. March 29, 2 | 2016-03-29 |
Semiconductor package system with cavity substrate and manufacturing method therefor
Grant 9,293,350 - Chow , et al. March 22, 2 | 2016-03-22 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
Grant 9,293,401 - Yoon , et al. March 22, 2 | 2016-03-22 |
RDL patterning with package on package system
Grant 9,293,385 - Pagaila , et al. March 22, 2 | 2016-03-22 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
Grant 9,287,204 - Kim , et al. March 15, 2 | 2016-03-15 |
Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
App 20160071813 - Pendse; Rajendra D. | 2016-03-10 |
Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof
Grant 9,281,274 - Zhao , et al. March 8, 2 | 2016-03-08 |
Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage
Grant 9,279,673 - Ko , et al. March 8, 2 | 2016-03-08 |
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP
Grant 9,281,259 - Lin , et al. March 8, 2 | 2016-03-08 |
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
Grant 9,281,228 - Choi , et al. March 8, 2 | 2016-03-08 |
Chip scale module package in BGA semiconductor package
Grant 9,281,300 - Merilo , et al. March 8, 2 | 2016-03-08 |
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
App 20160043047 - Shim; Il Kwon ; et al. | 2016-02-11 |
Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics
App 20160013148 - Lin; Yaojian ; et al. | 2016-01-14 |
Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP
App 20150380339 - Zhao; Xing ; et al. | 2015-12-31 |
Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation
App 20150380310 - Zhao; Xing ; et al. | 2015-12-31 |
Semiconductor Device and Method of Forming a Dampening Structure to Improve Board Level Reliability
App 20150364430 - Lin; Yaojian | 2015-12-17 |
Method for Building Up a Fan-Out RDL Structure with Fine Pitch Line-Width and Line-Spacing
App 20150364394 - Lin; Yaojian | 2015-12-17 |
Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV
App 20150357274 - Choi; DaeSik ; et al. | 2015-12-10 |
Semiconductor Device And Method Of Forming Adhesive Layer Over Insulating Layer For Bonding Carrier To Mixed Surfaces Of Semiconductor Die And Encapsulant
App 20150348861 - Chia; Lai Yee ; et al. | 2015-12-03 |
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits
App 20150348936 - Lin; Yaojian ; et al. | 2015-12-03 |
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP
App 20150325553 - Park; DongSam ; et al. | 2015-11-12 |
Semiconductor Device and Method of Forming Bump-on-Lead Interconnection
App 20150311172 - Pendse; Rajendra D. | 2015-10-29 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20150294962 - Lin; Yaojian ; et al. | 2015-10-15 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20150287708 - Lin; Yaojian ; et al. | 2015-10-08 |
Semiconductor Device and Method of Forming RDL and Vertical Interconnect by Laser Direct Structuring
App 20150279778 - Camacho; Zigmund R. ; et al. | 2015-10-01 |
Semiconductor Device and Method of Forming Substrate Having Conductive Columns
App 20150279815 - Do; Byung Tai ; et al. | 2015-10-01 |
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
App 20150270237 - Chi; HeeJo ; et al. | 2015-09-24 |
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure
App 20150262977 - Pagaila; Reza A. | 2015-09-17 |
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20150259194 - Lin; Yaojian ; et al. | 2015-09-17 |
Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers
App 20150249065 - Pagaila; Reza A. | 2015-09-03 |
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
App 20150243575 - Strothmann; Thomas J. ; et al. | 2015-08-27 |
Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation
App 20150228628 - Pagaila; Reza A. ; et al. | 2015-08-13 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20150228552 - Lin; Yaojian ; et al. | 2015-08-13 |
Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die
App 20150228590 - Oh; JiHoon ; et al. | 2015-08-13 |
Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
App 20150214182 - Pendse; Rajendra D. | 2015-07-30 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20150179587 - Shim; Il Kwon ; et al. | 2015-06-25 |
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package
App 20150179570 - Marimuthu; Pandi C. ; et al. | 2015-06-25 |
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
App 20150179616 - Lin; Yaojian ; et al. | 2015-06-25 |
Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages
App 20150179481 - Lin; Yaojian | 2015-06-25 |
Semiconductor Device and Method of Wafer Thinning Involving Edge Trimming and CMP
App 20150179544 - Chockanathan; Vinoth Kanna ; et al. | 2015-06-25 |
Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio
App 20150171024 - Choi; Won Kyoung ; et al. | 2015-06-18 |
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App 20150155248 - Lin; Yaojian ; et al. | 2015-06-04 |
Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die
App 20150145128 - Pagaila; Reza A. ; et al. | 2015-05-28 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20150145126 - Lin; Yaojian ; et al. | 2015-05-28 |
Semiconductor Device and Method of Forming Wire Bondable Fan-Out EWLB Package
App 20150140736 - Pendse; Rajendra D. | 2015-05-21 |
Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
App 20150137322 - Pagaila; Reza A. ; et al. | 2015-05-21 |
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV
App 20150137334 - Lee; SinJae ; et al. | 2015-05-21 |
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die
App 20150123273 - Cho; NamJu ; et al. | 2015-05-07 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20150115465 - Lin; Yaojian ; et al. | 2015-04-30 |
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die
App 20150115394 - Pagaila; Reza A. ; et al. | 2015-04-30 |
Semiconductor Device and Method of Forming Conductive Layer Over Substrate with Vents to Channel Bump Material and Reduce Interconnect Voids
App 20150097295 - Lee; JaeHyun ; et al. | 2015-04-09 |
Semiconductor Device and Method of Forming Conductive Vias Through Interconnect Structures and Encapsulant of WLCSP
App 20150091145 - Lin; Yaojian ; et al. | 2015-04-02 |
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
App 20150091157 - Chi; HeeJo ; et al. | 2015-04-02 |
Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration
App 20150091165 - Bao; Xusheng ; et al. | 2015-04-02 |
Semiconductor Device and Method of Forming Dual Fan-Out Semiconductor Package
App 20150084206 - Lin; Yaojian | 2015-03-26 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20150084213 - Heng; Kian Meng ; et al. | 2015-03-26 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20150061124 - Shim; Il Kwon ; et al. | 2015-03-05 |
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
App 20150061123 - Lin; Yaojian ; et al. | 2015-03-05 |
Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
App 20150054151 - Choi; Won Kyoung ; et al. | 2015-02-26 |
Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die
App 20150054167 - Pendse; Rajendra D. | 2015-02-26 |
Semiconductor Device and Method of Making Wafer Level Chip Scale Package
App 20150041985 - Hsieh; Ming-Che ; et al. | 2015-02-12 |
Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure
App 20150028496 - Bathan; Henry D. ; et al. | 2015-01-29 |
Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control
App 20150028471 - Lin; Yaojian ; et al. | 2015-01-29 |
Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management
App 20150021754 - Lin; Yaojian ; et al. | 2015-01-22 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20150008597 - Lin; Yaojian ; et al. | 2015-01-08 |
Semiconductor Device and Method of Forming Trench and Disposing Semiconductor Die Over Substrate to Control Outward Flow of Underfill Material
App 20150001729 - Lan; Hoang ; et al. | 2015-01-01 |
Semiconductor Device and Method of Forming Low Profile 3D Fan-Out Package
App 20150001708 - Lin; Yaojian | 2015-01-01 |
Semiconductor Device and Method of Stacking Semiconductor Die on a Fan-Out WLCSP
App 20150001709 - Bao; XuSheng ; et al. | 2015-01-01 |
Methods of Forming Conductive Materials on Contact Pads
App 20150004750 - Chi; HeeJo ; et al. | 2015-01-01 |
Methods of Forming Conductive Jumper Traces
App 20150004748 - Shin; HanGil ; et al. | 2015-01-01 |
Semiconductor Device and Method of Individual Die Bonding Followed by Simultaneous Multiple Die Thermal Compression Bonding
App 20150001703 - Choi; JoonYoung ; et al. | 2015-01-01 |
Semiconductor Device and Method of Using Substrate With Conductive Posts and Protective Layers to Form Embedded Sensor Die Package
App 20150001707 - Do; Byung Tai ; et al. | 2015-01-01 |
Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge
App 20150001741 - Lee; Koo Hong ; et al. | 2015-01-01 |
Methods of Forming Conductive and Insulating Layers
App 20150004756 - Chi; HeeJo ; et al. | 2015-01-01 |
Semiconductor package and method of forming similar structure for top and bottom bonding pads
Grant 08921983 - | 2014-12-30 |
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
App 20140367848 - Chi; HeeJo ; et al. | 2014-12-18 |
Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
App 20140361423 - Chi; HeeJo ; et al. | 2014-12-11 |
Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
App 20140353846 - Chua; Linda Pei Ee ; et al. | 2014-12-04 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20140339683 - Lin; Yaojian ; et al. | 2014-11-20 |
Integrated Circuit Package System with Removable Backing Element Having Plated Terminal Leads and Method of Manufacture Thereof
App 20140332955 - Camacho; Zigmund R. ; et al. | 2014-11-13 |
Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
App 20140332986 - Pagaila; Reza A. ; et al. | 2014-11-13 |
Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench in Substrate
App 20140327107 - Padmanathan; Meenakshi ; et al. | 2014-11-06 |
Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
App 20140327135 - Lee; Soo Won ; et al. | 2014-11-06 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20140327145 - Pagaila; Reza A. ; et al. | 2014-11-06 |
Semiconductor Device and Method of Forming Stacked Semiconductor Die and Conductive Interconnect Structure Through an Encapsulant
App 20140322865 - Kim; YoungJoon ; et al. | 2014-10-30 |
Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units
App 20140319679 - Lin; Yaojian ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
App 20140319692 - Pendse; Rajendra D. | 2014-10-30 |
Stackable Package by Using Internal Stacking Modules
App 20140319702 - Yang; JoungIn ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer
App 20140319661 - Pagaila; Reza A. | 2014-10-30 |
Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer
App 20140319680 - Choi; JoonYoung ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
App 20140319678 - Pagaila; Reza A. ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming Stress-Reduced Conductive Joint Structures
App 20140319695 - Hsieh; Ming-Che ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer
App 20140312512 - Choi; DaeSik | 2014-10-23 |
Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation
App 20140300002 - Na; Duk Ju ; et al. | 2014-10-09 |
Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die
App 20140291820 - Pagaila; Reza A. | 2014-10-02 |
Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding
App 20140295618 - Kim; KyungMoon ; et al. | 2014-10-02 |
Solder Joint Flip Chip Interconnection
App 20140291839 - Pendse; Rajendra D. ; et al. | 2014-10-02 |
Semiconductor Device And Method Of Forming Pip With Inner Known Good Die Interconnected With Conductive Bumps
App 20140284788 - Camacho; Zigmund R. ; et al. | 2014-09-25 |
Semiconductor Device Including RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect
App 20140264786 - Pagaila; Reza A. ; et al. | 2014-09-18 |
Semiconductor Device and Method of Calibrating Warpage Testing System to Accurately Measure Semiconductor Package Warpage
App 20140269810 - Ko; WonJun ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded within Interconnect Structure
App 20140264905 - Lee; KyungHoon ; et al. | 2014-09-18 |
Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System in Package
App 20140264817 - Lee; KyungHoon ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections
App 20140264850 - Lin; Li-Jen ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate
App 20140264736 - Lin; Yaojian | 2014-09-18 |
Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer
App 20140264851 - Choi; Won Kyoung ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20140252654 - Lin; Yaojian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20140252631 - Pagaila; Reza A. ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
App 20140252573 - Lin; Yaojian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package
App 20140252641 - Lim; See Chian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20140246779 - Lin; Yaojian ; et al. | 2014-09-04 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20140239495 - Lin; Yaojian ; et al. | 2014-08-28 |
Integrated circuit package system with wafer scale heat slug
Grant 08618653 - | 2013-12-31 |
Stacked integrated circuit package-in-package system and method of manufacture thereof
Grant 08617924 - | 2013-12-31 |
Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation
App 20120326297A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die
App 20120326303A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure
App 20120326329A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming PIP with Inner Known Good Die Interconnected with Conductive Bumps
App 20120326302A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
App 20120326296A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming EWLB Package With Standoff Conductive Layer Over Encapsulant Bumps
App 20120326337A1 - | 2012-12-27 |
Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
App 20100327406A1 - | 2010-12-30 |
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