| Patent | Date |
|---|
Solder material, solder paste, and solder joint
Grant 11,344,976 - Kawasaki , et al. May 31, 2 | 2022-05-31 |
Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball
Grant 11,185,950 - Kawasaki , et al. November 30, 2 | 2021-11-30 |
Cu core ball, solder joint, solder paste and formed solder
Grant 10,888,959 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
Solder Material, Solder Paste, And Solder Joint
App 20200376607 - Kawasaki; Hiroyoshi ; et al. | 2020-12-03 |
Cu column, Cu core column, solder joint, and through-silicon via
Grant 10,811,376 - Kawasaki , et al. October 20, 2 | 2020-10-20 |
Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, Formed Solder, and Method for Manufacturing Cu Ball
App 20200298349 - Kawasaki; Hiroyoshi ; et al. | 2020-09-24 |
Solder material, solder paste, solder preform, solder joint and method of managing the solder material
Grant 10,717,157 - Hattori , et al. | 2020-07-21 |
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
Grant 10,675,719 - Kawasaki , et al. | 2020-06-09 |
Cu core ball, solder joint, solder paste and formed solder
Grant 10,639,749 - Kawasaki , et al. | 2020-05-05 |
Flux composition for solder applications
Grant 10,610,979 - Maruko , et al. | 2020-04-07 |
Solder Material, Solder Paste, Formed Solder And Solder Joint
App 20200061757 - NISHINO; Tomoaki ; et al. | 2020-02-27 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
App 20190375054 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
App 20190375053 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
App 20190376161 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
Core material, semiconductor package, and forming method of bump electrode
Grant 10,381,319 - Nishino , et al. A | 2019-08-13 |
Method of manufacturing cu core ball
Grant 10,370,771 - Kawasaki , et al. | 2019-08-06 |
Cu core ball, solder paste, formed solder, Cu core column, and solder joint
Grant 10,322,472 - Hattori , et al. | 2019-06-18 |
Solder material, solder joint, and method of manufacturing the solder material
Grant 10,173,287 - Kawasaki , et al. J | 2019-01-08 |
Method for producing metal ball, joining material, and metal ball
Grant 10,150,185 - Kawasaki , et al. Dec | 2018-12-11 |
Cu core ball
Grant 10,147,695 - Kawasaki , et al. De | 2018-12-04 |
Flux
App 20180339375 - Maruko; Daisuke ; et al. | 2018-11-29 |
Cu ball, Cu core ball, solder joint, solder paste, and solder foam
Grant 10,137,535 - Kawasaki , et al. November 27, 2 | 2018-11-27 |
Core Material, Semiconductor Package, and Forming Method of Bump Electrode
App 20180174991 - Nishino; Tomoaki ; et al. | 2018-06-21 |
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint
App 20180015572 - Kawasaki; Hiroyoshi ; et al. | 2018-01-18 |
Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material
App 20170312860 - Hattori; Takahiro ; et al. | 2017-11-02 |
Ni ball, Ni core ball, solder joint, solder paste, and solder foam
Grant 9,802,251 - Kawasaki , et al. October 31, 2 | 2017-10-31 |
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
App 20170287862 - Kawasaki; Hiroyoshi ; et al. | 2017-10-05 |
Solder Material, Solder Joint, and Method of Manufacturing the Solder Material
App 20170252871 - Kawasaki; Hiroyoshi ; et al. | 2017-09-07 |
Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam
App 20170246711 - Kawasaki; Hiroyoshi ; et al. | 2017-08-31 |
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
App 20170233884 - KAWASAKI; Hiroyoshi ; et al. | 2017-08-17 |
Method for Producing Metal Ball, Joining Material, and Metal Ball
App 20170182600 - Kawasaki; Hiroyoshi ; et al. | 2017-06-29 |
Bump electrode, board which has bump electrodes, and method for manufacturing the board
Grant 9,662,730 - Hattori , et al. May 30, 2 | 2017-05-30 |
Cu ball
Grant 9,668,358 - Kawasaki , et al. May 30, 2 | 2017-05-30 |
Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam
App 20170080491 - Kawasaki; Hiroyoshi ; et al. | 2017-03-23 |
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Solder Joint
App 20160368105 - Hattori; Takahiro ; et al. | 2016-12-22 |
Cu Core Ball
App 20160148885 - Kawasaki; Hiroyoshi ; et al. | 2016-05-26 |
Core ball, solder paste, formed-solder, flux-coated core ball and solder joint
Grant 9,278,409 - Kawasaki , et al. March 8, 2 | 2016-03-08 |
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste
Grant 9,266,196 - Akagawa , et al. February 23, 2 | 2016-02-23 |
Cu BALL
App 20150336216 - HATTORI; Takahiro ; et al. | 2015-11-26 |
Cu BALL
App 20150313025 - KAWASAKI; Hiroyoshi ; et al. | 2015-10-29 |
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE
App 20150217409 - AKAGAWA; Takashi ; et al. | 2015-08-06 |
Core Ball, Solder Paste, Formed-solder, Flux-coated Core Ball And Solder Joint
App 20150217408 - KAWASAKI; Hiroyoshi ; et al. | 2015-08-06 |
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
App 20150209912 - KAWASAKI; Hiroyoshi ; et al. | 2015-07-30 |
Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board
App 20150061129 - Hattori; Takahiro ; et al. | 2015-03-05 |
Method of soldering portions plated by electroless Ni plating
Grant 8,887,980 - Kurata , et al. November 18, 2 | 2014-11-18 |
Lead-free solder alloy
Grant 8,691,143 - Ohnishi , et al. April 8, 2 | 2014-04-08 |
Lead-free solder alloy
App 20090232696 - Ohnishi; Tsukasa ; et al. | 2009-09-17 |
Method of soldering portions plated by electroless ni plating
App 20090218387 - Kurata; Ryoichi ; et al. | 2009-09-03 |
Solder for use on surfaces coated with nickel by electroless plating
Grant 7,132,020 - Nozawa , et al. November 7, 2 | 2006-11-07 |
Solder for use on surfaces coated with nickel by electroless plating
App 20040126269 - Nozawa, Iwao ; et al. | 2004-07-01 |
Image recording and replaying apparatus
App 20030175010 - Nomura, Kenji ; et al. | 2003-09-18 |
| 