Patent | Date |
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Nitride-based transistors with a protective layer and a low-damage recess Grant 11,316,028 - Sheppard , et al. April 26, 2 | 2022-04-26 |
Nitride-based transistors with a cap layer and a recessed gate Grant 9,666,707 - Sheppard , et al. May 30, 2 | 2017-05-30 |
Methods of fabricating thick semi-insulating or insulating epitaxial gallium nitride layers Grant 9,224,596 - Saxler , et al. December 29, 2 | 2015-12-29 |
Methods of passivating surfaces of wide bandgap semiconductor devices Grant 9,166,033 - Saxler , et al. October 20, 2 | 2015-10-20 |
Nitride-based transistors having laterally grown active region and methods of fabricating same Grant 8,946,777 - Saxler , et al. February 3, 2 | 2015-02-03 |
Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions Grant 8,803,198 - Smith , et al. August 12, 2 | 2014-08-12 |
Methods of Fabricating Thick Semi-Insulating or Insulating Epitaxial Gallium Nitride Layers App 20130344687 - Saxler; Adam William ;   et al. | 2013-12-26 |
Devices having thick semi-insulating epitaxial gallium nitride layer Grant 8,575,651 - Saxler , et al. November 5, 2 | 2013-11-05 |
Group III Nitride Field Effect Transistors (FETS) Capable of Withstanding High Temperature Reverse Bias Test Conditions App 20120235159 - Smith; Richard Peter ;   et al. | 2012-09-20 |
Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions Grant 8,212,289 - Smith , et al. July 3, 2 | 2012-07-03 |
Methods of fabricating transistors including dielectrically-supported gate electrodes and related devices Grant 8,049,252 - Smith , et al. November 1, 2 | 2011-11-01 |
Nitride-Based Transistors With a Protective Layer and a Low-Damage Recess App 20110140123 - Sheppard; Scott T. ;   et al. | 2011-06-16 |
Nitride-based transistors with a protective layer and a low-damage recess Grant 7,906,799 - Sheppard , et al. March 15, 2 | 2011-03-15 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,858,460 - Ring , et al. December 28, 2 | 2010-12-28 |
Methods Of Fabricating Transistors Including Dielectrically-supported Gate Electrodes And Related Devices App 20100171150 - Smith; Richard Peter ;   et al. | 2010-07-08 |
Methods of Fabricating Nitride-Based Transistors with a Cap Layer and a Recessed Gate and Related Devices App 20100140664 - Sheppard; Scott ;   et al. | 2010-06-10 |
Methods of fabricating transistors including dielectrically-supported gate electrodes Grant 7,709,269 - Smith , et al. May 4, 2 | 2010-05-04 |
Cap layers including aluminum nitride for nitride-based transistors Grant 7,709,859 - Smith , et al. May 4, 2 | 2010-05-04 |
Methods of fabricating nitride-based transistors with a cap layer and a recessed gate Grant 7,678,628 - Sheppard , et al. March 16, 2 | 2010-03-16 |
Nitride-Based Transistors Having Laterally Grown Active Region and Methods of Fabricating Same App 20100012952 - Saxler; Adam William ;   et al. | 2010-01-21 |
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides App 20090215280 - Ring; Zoltan ;   et al. | 2009-08-27 |
Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses Grant 7,550,784 - Saxler , et al. June 23, 2 | 2009-06-23 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,525,122 - Ring , et al. April 28, 2 | 2009-04-28 |
Group III Nitride Field Effect Transistors (FETS) Capable of Withstanding High Temperature Reverse Bias Test Conditions App 20090101939 - Smith; Richard Peter ;   et al. | 2009-04-23 |
Methods of Fabricating Transistors Having Buried N-Type and P-Type Regions Beneath the Source Region App 20090042345 - Saxler; Adam William ;   et al. | 2009-02-12 |
Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions Grant 7,465,967 - Smith , et al. December 16, 2 | 2008-12-16 |
Transistors having buried n-type and p-type regions beneath the source region Grant 7,456,443 - Saxler , et al. November 25, 2 | 2008-11-25 |
Methods of fabricating nitride-based transistors having regrown ohmic contact regions Grant 7,432,142 - Saxler , et al. October 7, 2 | 2008-10-07 |
Dielectric passivation for semiconductor devices Grant 7,332,795 - Smith , et al. February 19, 2 | 2008-02-19 |
Methods of fabricating nitride-based transistors with a cap layer and a recessed gate App 20070254418 - Sheppard; Scott ;   et al. | 2007-11-01 |
Cap Layers Including Aluminum Nitride for Nitride-Based Transistors and Methods of Fabricating Same App 20070164315 - Smith; Richard Peter ;   et al. | 2007-07-19 |
Methods of fabricating transistors including dielectrically-supported gate electrodes and related devices App 20070164322 - Smith; Richard Peter ;   et al. | 2007-07-19 |
Methods of fabricating nitride-based transistors with a cap layer and a recessed gate Grant 7,238,560 - Sheppard , et al. July 3, 2 | 2007-07-03 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides App 20070001174 - Ring; Zoltan ;   et al. | 2007-01-04 |
Nitride-based transistors with a protective layer and a low-damage recess App 20060255366 - Sheppard; Scott T. ;   et al. | 2006-11-16 |
Thick semi-insulating or insulating epitaxial gallium nitride layers and devices incorporating same App 20060226412 - Saxler; Adam William ;   et al. | 2006-10-12 |
Group III nitride field effect transistors (FETS) capable of withstanding high temperature reverse bias test conditions App 20060208280 - Smith; Richard Peter ;   et al. | 2006-09-21 |
Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabricating same App 20060108606 - Saxler; Adam William ;   et al. | 2006-05-25 |
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof Grant 7,045,404 - Sheppard , et al. May 16, 2 | 2006-05-16 |
Nitride-based transistors having laterally grown active region and methods of fabricating same App 20060017064 - Saxler; Adam William ;   et al. | 2006-01-26 |
Methods of fabricating nitride-based transistors with a cap layer and a recessed gate App 20060019435 - Sheppard; Scott ;   et al. | 2006-01-26 |
Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses App 20060006435 - Saxler; Adam William ;   et al. | 2006-01-12 |
Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses Grant 6,982,204 - Saxler , et al. January 3, 2 | 2006-01-03 |
Dielectric passivation for semiconductor devices App 20050258431 - Smith, Richard Peter ;   et al. | 2005-11-24 |
Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions App 20050258451 - Saxler, Adam William ;   et al. | 2005-11-24 |
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof App 20050170574 - Sheppard, Scott T. ;   et al. | 2005-08-04 |
Methods of fabricating aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment Grant 6,777,278 - Smith August 17, 2 | 2004-08-17 |
Nitride-based transistors and methods of fabrication thereof using non-etched contact recesses App 20040061129 - Saxler, Adam William ;   et al. | 2004-04-01 |
Methods of fabricating aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment App 20030157776 - Smith, Richard Peter | 2003-08-21 |
Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment Grant 6,548,333 - Smith April 15, 2 | 2003-04-15 |
Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment and methods of fabricating same App 20020066908 - Smith, Richard Peter | 2002-06-06 |