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Integrated interposer solutions for 2D and 3D IC packaging
Grant 11,302,616 - Shen , et al. April 12, 2 | 2022-04-12 |
Structures and methods for reliable packages
Grant 11,056,390 - Uzoh , et al. July 6, 2 | 2021-07-06 |
Bonded Structures
App 20210202428 - Wang; Liang ; et al. | 2021-07-01 |
Stacked Dies And Methods For Forming Bonded Structures
App 20210183847 - Uzoh; Cyprian Emeka ; et al. | 2021-06-17 |
Capacitive Coupling In A Direct-bonded Interface For Microelectronic Devices
App 20210035954 - Haba; Belgacem ; et al. | 2021-02-04 |
Bonded structures
Grant 10,879,207 - Wang , et al. December 29, 2 | 2020-12-29 |
Stacked dies and methods for forming bonded structures
Grant 10,879,226 - Uzoh , et al. December 29, 2 | 2020-12-29 |
Bonded structures
Grant 10,879,210 - Enquist , et al. December 29, 2 | 2020-12-29 |
Sealed Bonded Structures And Methods For Forming The Same
App 20200395321 - Katkar; Rajesh ; et al. | 2020-12-17 |
Capacitive coupling in a direct-bonded interface for microelectronic devices
Grant 10,811,388 - Haba , et al. October 20, 2 | 2020-10-20 |
Bonded Structures
App 20200144217 - Enquist; Paul M. ; et al. | 2020-05-07 |
Structures And Methods For Reliable Packages
App 20200126861 - Uzoh; Cyprian Emeka ; et al. | 2020-04-23 |
Bonded Structures
App 20200126945 - Wang; Liang ; et al. | 2020-04-23 |
HD color imaging using monochromatic CMOS image sensors integrated in 3D package
Grant 10,623,710 - Shen , et al. | 2020-04-14 |
Ultrathin layer for forming a capacitive interface between joined integrated circuit component
Grant 10,600,760 - Haba , et al. | 2020-03-24 |
Bonded structures
Grant 10,546,832 - Wang , et al. Ja | 2020-01-28 |
Structures and methods for reliable packages
Grant 10,535,564 - Uzoh , et al. Ja | 2020-01-14 |
Bonded structures
Grant 10,522,499 - Enquist , et al. Dec | 2019-12-31 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,522,457 - Uzoh , et al. Dec | 2019-12-31 |
Integrated circuits protected by substrates with cavities, and methods of manufacture
Grant 10,446,456 - Shen , et al. Oc | 2019-10-15 |
Interposers with electrically conductive features having different porosities
Grant 10,440,822 - Lee , et al. O | 2019-10-08 |
Structure and method for integrated circuits packaging with increased density
Grant 10,381,326 - Woychik , et al. A | 2019-08-13 |
Integrated Interposer Solutions For 2d And 3d Ic Packaging
App 20190198435 - Shen; Hong ; et al. | 2019-06-27 |
Stacked Dies And Methods For Forming Bonded Structures
App 20190189607 - Uzoh; Cyprian Emeka ; et al. | 2019-06-20 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Th
App 20190157199 - UZOH; Cyprian Emeka ; et al. | 2019-05-23 |
Low cost substrates
Grant 10,283,484 - Uzoh , et al. | 2019-05-07 |
Capacitive Coupling In A Direct-bonded Interface For Microelectronic Devices
App 20190115323 - Haba; Belgacem ; et al. | 2019-04-18 |
Integrated interposer solutions for 2D and 3D IC packaging
Grant 10,256,177 - Shen , et al. | 2019-04-09 |
Hd Color Imaging Using Monochromatic Cmos Image Sensors Integrated In 3d Package
App 20190098271 - Shen; Hong ; et al. | 2019-03-28 |
Stacked dies and methods for forming bonded structures
Grant 10,204,893 - Uzoh , et al. Feb | 2019-02-12 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 10,177,086 - Uzoh , et al. J | 2019-01-08 |
HD color imaging using monochromatic CMOS image sensors integrated in 3D package
Grant 10,178,363 - Shen , et al. J | 2019-01-08 |
Ultrathin Layer for Forming a Capacitive Interface Between Joined Integrated Circuit Component
App 20180366446 - Haba; Belgacem ; et al. | 2018-12-20 |
Bonded Structures
App 20180337157 - Wang; Liang ; et al. | 2018-11-22 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20180233447 - UZOH; Cyprian Emeka ; et al. | 2018-08-16 |
Bonded Structures
App 20180226375 - Enquist; Paul M. ; et al. | 2018-08-09 |
Ultrathin layer for forming a capacitive interface between joined integrated circuit components
Grant 10,032,751 - Haba , et al. July 24, 2 | 2018-07-24 |
Bonded Structures
App 20180174995 - Wang; Liang ; et al. | 2018-06-21 |
Bonded structures
Grant 10,002,844 - Wang , et al. June 19, 2 | 2018-06-19 |
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture
App 20180130717 - SHEN; Hong ; et al. | 2018-05-10 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,947,618 - Uzoh , et al. April 17, 2 | 2018-04-17 |
Microelectronic assemblies formed using metal silicide, and methods of fabrication
Grant 9,905,523 - Shen , et al. February 27, 2 | 2018-02-27 |
Integrated circuits protected by substrates with cavities, and methods of manufacture
Grant 9,899,281 - Shen , et al. February 20, 2 | 2018-02-20 |
Integrated circuit assemblies with reinforcement frames, and methods of manufacture
Grant 9,887,166 - Katkar , et al. February 6, 2 | 2018-02-06 |
Polymer member based interconnect
Grant 9,865,548 - Uzoh , et al. January 9, 2 | 2018-01-09 |
Methods and structures to repair device warpage
Grant 9,859,234 - Uzoh , et al. January 2, 2 | 2018-01-02 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170374738 - Lee; Bong-Sub ; et al. | 2017-12-28 |
Stacked Dies And Methods For Forming Bonded Structures
App 20170338214 - Uzoh; Cyprian Emeka ; et al. | 2017-11-23 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,824,974 - Gao , et al. November 21, 2 | 2017-11-21 |
Integrated Interposer Solutions For 2d And 3d Ic Packaging
App 20170317019 - Shen; Hong ; et al. | 2017-11-02 |
Structures and Methods for Reliable Packages
App 20170309518 - Uzoh; Cyprian Emeka ; et al. | 2017-10-26 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20170278787 - UZOH; Cyprian Emeka ; et al. | 2017-09-28 |
Interposers
Grant 9,769,923 - Lee , et al. September 19, 2 | 2017-09-19 |
Integrated interposer solutions for 2D and 3D IC packaging
Grant 9,741,649 - Shen , et al. August 22, 2 | 2017-08-22 |
Thermal vias disposed in a substrate proximate to a well thereof
Grant 9,741,696 - Katkar , et al. August 22, 2 | 2017-08-22 |
Structures and methods for reliable packages
Grant 9,741,620 - Uzoh , et al. August 22, 2 | 2017-08-22 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,691,702 - Uzoh , et al. June 27, 2 | 2017-06-27 |
Localized sealing of interconnect structures in small gaps
Grant 9,685,420 - Katkar , et al. June 20, 2 | 2017-06-20 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170099733 - Lee; Bong-Sub ; et al. | 2017-04-06 |
HD Color Imaging Using Monochromatic CMOS Image Sensors Integrated In 3D Package
App 20170099474 - Shen; Hong ; et al. | 2017-04-06 |
Capacitive Coupling of Integrated Circuit Die Components
App 20170092620 - Haba; Belgacem ; et al. | 2017-03-30 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20170084539 - GAO; Guilian ; et al. | 2017-03-23 |
Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
Grant 9,570,385 - Lee , et al. February 14, 2 | 2017-02-14 |
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture
App 20170040237 - SHEN; Hong ; et al. | 2017-02-09 |
Methods And Structures To Repair Device Warpage
App 20170040270 - Uzoh; Cyprian Emeka ; et al. | 2017-02-09 |
Microelectronic Assemblies Formed Using Metal Silicide, And Methods Of Fabrication
App 20170018517 - SHEN; Hong ; et al. | 2017-01-19 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,548,273 - Gao , et al. January 17, 2 | 2017-01-17 |
Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
Grant 9,536,862 - Shen , et al. January 3, 2 | 2017-01-03 |
Structures And Methods For Reliable Packages
App 20160379885 - UZOH; Cyprian Emeka ; et al. | 2016-12-29 |
Microelectronic assemblies formed using metal silicide, and methods of fabrication
Grant 9,502,347 - Shen , et al. November 22, 2 | 2016-11-22 |
Method For Preparing Low Cost Substrates
App 20160329301 - Uzoh; Cyprian Emeka ; et al. | 2016-11-10 |
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates
App 20160315047 - Uzoh; Cyprian Emeka ; et al. | 2016-10-27 |
Thermal Vias Disposed In A Substrate Proximate To A Well Thereof
App 20160284672 - Katkar; Rajesh ; et al. | 2016-09-29 |
Polymer Member Based Interconnect
App 20160268205 - Uzoh; Cyprian Emeka ; et al. | 2016-09-15 |
Microelectronic Assemblies Formed Using Metal Silicide, And Methods Of Fabrication
App 20160247758 - Shen; Hong ; et al. | 2016-08-25 |
Localized sealing of interconnect structures in small gaps
App 20160247778 - Katkar; Rajesh ; et al. | 2016-08-25 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20160218057 - Lee; Bong-Sub ; et al. | 2016-07-28 |
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
Grant 9,397,038 - Uzoh , et al. July 19, 2 | 2016-07-19 |
Polymer member based interconnect
Grant 9,373,585 - Uzoh , et al. June 21, 2 | 2016-06-21 |
Thermal vias disposed in a substrate proximate to a well thereof
Grant 9,368,479 - Katkar , et al. June 14, 2 | 2016-06-14 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20160163650 - GAO; Guilian ; et al. | 2016-06-09 |
Microelectronic Assemblies With Integrated Circuits And Interposers With Cavities, And Methods Of Manufacture
App 20160133600 - Shen; Hong ; et al. | 2016-05-12 |
Localized sealing of interconnect structures in small gaps
Grant 9,331,043 - Katkar , et al. May 3, 2 | 2016-05-03 |
Polymer Member Based Interconnect
App 20160079169 - Uzoh; Cyprian Emeka ; et al. | 2016-03-17 |
Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
Grant 9,252,127 - Shen , et al. February 2, 2 | 2016-02-02 |
Microelectronic Assemblies With Integrated Circuits And Interposers With Cavities, And Methods Of Manufacture
App 20160013151 - SHEN; Hong ; et al. | 2016-01-14 |
Integrated Interposer Solutions For 2d And 3d Ic Packaging
App 20150357272 - Shen; Hong ; et al. | 2015-12-10 |
Structure And Method For Integrated Circuits Packaging With Increased Density
App 20150348940 - WOYCHIK; Charles G. ; et al. | 2015-12-03 |
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture
App 20150262902 - SHEN; Hong ; et al. | 2015-09-17 |
Method for forming self-aligned silicide in a semiconductor device using vapor phase reaction
Grant 5,605,865 - Maniar , et al. February 25, 1 | 1997-02-25 |
Method of forming conductive interconnect structure
Grant 5,441,914 - Taft , et al. August 15, 1 | 1995-08-15 |
Method for forming a transistor having silicided regions
Grant 5,352,631 - Sitaram , et al. October 4, 1 | 1994-10-04 |
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