loadpatents
Patent applications and USPTO patent grants for Sio; Kam-Tou.The latest application filed is for "fin field-effect transistor and method of forming the same".
Patent | Date |
---|---|
Fin Field-effect Transistor And Method Of Forming The Same App 20220293599 - Chiu; Te-Hsin ;   et al. | 2022-09-15 |
Power distribution network Grant 11,444,073 - Sio , et al. September 13, 2 | 2022-09-13 |
Integrated circuit including back side conductive lines for clock signals Grant 11,437,998 - Sio , et al. September 6, 2 | 2022-09-06 |
Integrated Circuit And Manufacturing Method Of The Same App 20220254769 - SIO; Kam-Tou ;   et al. | 2022-08-11 |
Semiconductor Devices And Methods Of Manufacturing Thereof App 20220238442 - Sio; Kam-Tou ;   et al. | 2022-07-28 |
Integrated Circuit Including Supervia And Method Of Making App 20220157714 - SIO; Kam-Tou ;   et al. | 2022-05-19 |
Integrated Circuit With Mixed Row Heights App 20220149033 - SIO; Kam-Tou ;   et al. | 2022-05-12 |
Semiconductor Structure With Nanosheets App 20220130822 - CHIU; Te-Hsin ;   et al. | 2022-04-28 |
Power Distribution Network App 20220130817 - SIO; Kam-Tou ;   et al. | 2022-04-28 |
Integrated Circuit, System And Method Of Forming Same App 20220115324 - CHIU; Te-Hsin ;   et al. | 2022-04-14 |
Semiconductor Device Including a Layer Between a Source/Drain Region and a Substrate App 20220108991 - Sio; Kam-Tou ;   et al. | 2022-04-07 |
Method Of Making Semiconductor Device Which Includes Fins App 20220108990 - CHEN; Chih-Liang ;   et al. | 2022-04-07 |
Integrated circuit with mixed row heights Grant 11,282,829 - Sio , et al. March 22, 2 | 2022-03-22 |
Integrated circuit including supervia and method of making Grant 11,270,936 - Sio , et al. March 8, 2 | 2022-03-08 |
Semiconductor Device And Manufacturing Method Thereof App 20220068791 - CHIU; Te-Hsin ;   et al. | 2022-03-03 |
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via App 20220045011 - Sio; Kam-Tou ;   et al. | 2022-02-10 |
Partial buried insulator nano-sheet device Grant 11,239,244 - Sio , et al. February 1, 2 | 2022-02-01 |
Semiconductor device which includes fins and method of making same Grant 11,222,899 - Chen , et al. January 11, 2 | 2022-01-11 |
Pin access hybrid cell height design Grant 11,222,157 - Sio , et al. January 11, 2 | 2022-01-11 |
Integrated Circuit Structure And Method Of Forming The Same App 20210391328 - SIO; Kam-Tou ;   et al. | 2021-12-16 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method App 20210384351 - CHEN; CHIH-LIANG ;   et al. | 2021-12-09 |
Via Rail Solution For High Power Electromigration App 20210366844 - Sio; Kam-Tou ;   et al. | 2021-11-25 |
Hybrid Sheet Layout, Method, System, And Structure App 20210357565 - FANG; Shang-Wei ;   et al. | 2021-11-18 |
Gate Structure For Semiconductor Devices App 20210351174 - Sio; Kam-Tou ;   et al. | 2021-11-11 |
Integrated Circuit Including Back Side Conductive Lines For Clock Signals App 20210344346 - SIO; Kam-Tou ;   et al. | 2021-11-04 |
Semiconductor devices with backside power distribution network and frontside through silicon via Grant 11,158,580 - Sio , et al. October 26, 2 | 2021-10-26 |
Integrated circuit with mixed row heights Grant 11,152,348 - Sio , et al. October 19, 2 | 2021-10-19 |
Pin Access Hybrid Cell Height Design App 20210286927 - SIO; Kam-Tou ;   et al. | 2021-09-16 |
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method Grant 11,121,256 - Chen , et al. September 14, 2 | 2021-09-14 |
Cell Structures And Power Routing For Integrated Circuits App 20210272605 - PENG; Shih-Wei ;   et al. | 2021-09-02 |
Via rail solution for high power electromigration Grant 11,088,092 - Sio , et al. August 10, 2 | 2021-08-10 |
Method And System Of Manufacturing Conductors And Semiconductor Device Which Includes Conductors App 20210225831 - SIO; Kam-Tou ;   et al. | 2021-07-22 |
Via rail solution for high power electromigration Grant 11,063,005 - Sio , et al. July 13, 2 | 2021-07-13 |
Integrated Circuit Device With High Mobility And System Of Forming The Integrated Circuit App 20210210488 - SIO; KAM-TOU ;   et al. | 2021-07-08 |
Dummy MOL removal for performance enhancement Grant 11,043,426 - Yang , et al. June 22, 2 | 2021-06-22 |
High-Density Semiconductor Device App 20210166947 - Chou; Lei-Chun ;   et al. | 2021-06-03 |
Dual power structure with connection pins Grant 11,024,579 - Peng , et al. June 1, 2 | 2021-06-01 |
Finfet Switch App 20210159120 - Sio; Kam-Tou ;   et al. | 2021-05-27 |
Integrated Circuit Structure And Method For Manufacturing The Same App 20210143150 - CHANG; WEI-LING ;   et al. | 2021-05-13 |
Middle-end-of-line Strap For Standard Cell App 20210118793 - SHEN; Meng-Hung ;   et al. | 2021-04-22 |
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via App 20210118805 - SIO; Kam-Tou ;   et al. | 2021-04-22 |
Integrated Circuit Structure And Method Of Forming The Same App 20210118868 - SIO; Kam-Tou ;   et al. | 2021-04-22 |
System for and method of manufacturing an integrated circuit Grant 10,977,421 - Lin , et al. April 13, 2 | 2021-04-13 |
Method and system of manufacturing conductors and semiconductor device which includes conductors Grant 10,978,439 - Sio , et al. April 13, 2 | 2021-04-13 |
Integrated circuit device with high mobility and system of forming the integrated circuit Grant 10,971,493 - Sio , et al. April 6, 2 | 2021-04-06 |
Semiconductor Device Including Source/drain Contact Having Height Below Gate Stack App 20210082903 - YOUNG; Charles Chew-Yuen ;   et al. | 2021-03-18 |
High-density semiconductor device Grant 10,950,456 - Chou , et al. March 16, 2 | 2021-03-16 |
Advanced Metal Connection With Metal Cut App 20210066182 - Chen; Chih-Liang ;   et al. | 2021-03-04 |
FinFET switch Grant 10,937,695 - Sio , et al. March 2, 2 | 2021-03-02 |
Metal Rail Conductors For Non-planar Semiconductor Devices App 20210028311 - Chen; Chih-Liang ;   et al. | 2021-01-28 |
Partial Buried Insulator Nano-Sheet Device App 20200411531 - Sio; Kam-Tou ;   et al. | 2020-12-31 |
Middle-end-of-line strap for standard cell Grant 10,879,173 - Shen , et al. December 29, 2 | 2020-12-29 |
Self aligned via and method for fabricating the same Grant 10,879,120 - Chen , et al. December 29, 2 | 2020-12-29 |
Integrated circuit, system for and method of forming an integrated circuit Grant 10,879,229 - Sio , et al. December 29, 2 | 2020-12-29 |
System and method for calculating cell edge leakage Grant 10,867,115 - Peng , et al. December 15, 2 | 2020-12-15 |
Power strap structure for high performance and low current density Grant 10,861,790 - Chen , et al. December 8, 2 | 2020-12-08 |
Pin Access Hydrid Cell Height Design App 20200380193 - SIO; Kam-Tou ;   et al. | 2020-12-03 |
Advanced metal connection with metal cut Grant 10,847,460 - Chen , et al. November 24, 2 | 2020-11-24 |
Integrated Circuit, System For And Method Of Forming An Integrated Circuit App 20200357793 - SIO; Kam-Tou ;   et al. | 2020-11-12 |
Integrated Circuit With Mixed Row Heights App 20200357786 - SIO; Kam-Tou ;   et al. | 2020-11-12 |
Semiconductor device including source/drain contact having height below gate stack Grant 10,833,061 - Young , et al. November 10, 2 | 2020-11-10 |
Semiconductor Device Which Includes Fins And Method Of Making Same App 20200335507 - CHEN; Chih-Liang ;   et al. | 2020-10-22 |
Metal rail conductors for non-planar semiconductor devices Grant 10,804,402 - Chen , et al. October 13, 2 | 2020-10-13 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method App 20200303551 - CHEN; CHIH-LIANG ;   et al. | 2020-09-24 |
Dummy MOL removal for performance enhancement Grant 10,784,168 - Yang , et al. Sept | 2020-09-22 |
Pin access hybrid cell height design Grant 10,769,342 - Sio , et al. Sep | 2020-09-08 |
Integrated circuit, system for and method of forming an integrated circuit Grant 10,734,377 - Sio , et al. | 2020-08-04 |
Semiconductor device which includes Fins Grant 10,714,485 - Chen , et al. | 2020-07-14 |
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method Grant 10,700,207 - Chen , et al. | 2020-06-30 |
System For And Method Of Manufacturing An Integrated Circuit App 20200184139 - LIN; Wei-Cheng ;   et al. | 2020-06-11 |
Pin Access Hydrid Cell Height Design App 20200134119 - SIO; Kam-Tou ;   et al. | 2020-04-30 |
Integrated Circuit Including Supervia And Method Of Making App 20200135640 - SIO; Kam-Tou ;   et al. | 2020-04-30 |
Finfet Switch App 20200118875 - Sio; Kam-Tou ;   et al. | 2020-04-16 |
Contact Structure, Method, Layout, And System App 20200105660 - SIO; Kam-Tou ;   et al. | 2020-04-02 |
Via Rail Solution For High Power Electromigration App 20200083182 - Sio; Kam-Tou ;   et al. | 2020-03-12 |
System for and method of fabricating an integrated circuit Grant 10,565,348 - Lin , et al. Feb | 2020-02-18 |
High-Density Semiconductor Device App 20200043741 - Chou; Lei-Chun ;   et al. | 2020-02-06 |
Advanced Metal Connection With Metal Cut App 20200020625 - Chen; Chih-Liang ;   et al. | 2020-01-16 |
System and Method for Calculating Cell Edge Leakage App 20200019673 - Peng; Shih-Wei ;   et al. | 2020-01-16 |
Dummy Mol Removal For Performance Enhancement App 20200020588 - Yang; Hui-Ting ;   et al. | 2020-01-16 |
Structure and formation method of semiconductor device structure Grant 10,516,047 - Sio , et al. Dec | 2019-12-24 |
Via rail solution for high power electromigration Grant 10,510,688 - Sio , et al. Dec | 2019-12-17 |
FinFET switch Grant 10,510,599 - Sio , et al. Dec | 2019-12-17 |
Method And System Of Manufacturing Conductors And Semiconductor Device Which Includes Conductors App 20190371784 - SIO; Kam-Tou ;   et al. | 2019-12-05 |
Advanced metal connection with metal cut Grant 10,468,349 - Chen , et al. No | 2019-11-05 |
System and method for calculating cell edge leakage Grant 10,467,374 - Peng , et al. No | 2019-11-05 |
System For And Method Of Fabricating An Integrated Circuit App 20190325109 - LIN; Wei-Cheng ;   et al. | 2019-10-24 |
High-density semiconductor device Grant 10,446,406 - Chou , et al. Oc | 2019-10-15 |
Method of manufacturing conductors and semiconductor device which includes conductors Grant 10,388,644 - Sio , et al. A | 2019-08-20 |
Dual Power Structure With Connection Pins App 20190244901 - Peng; Shih-Wei ;   et al. | 2019-08-08 |
System for and method of manufacturing a layout design of an integrated circuit Grant 10,366,200 - Lin , et al. July 30, 2 | 2019-07-30 |
Metal Rail Conductors For Non-planar Semiconductor Devices App 20190165178 - CHEN; Chih-Liang ;   et al. | 2019-05-30 |
Semiconductor Device Integrating Backside Power Grid And Related Integrated Circuit And Fabrication Method App 20190164882 - CHEN; CHIH-LIANG ;   et al. | 2019-05-30 |
Middle-end-of-line Strap For Standard Cell App 20190164883 - SHEN; Meng-Hung ;   et al. | 2019-05-30 |
Integrated Circuit With Mixed Row Heights App 20190164949 - SIO; Kam-Tou ;   et al. | 2019-05-30 |
Integrated Circuit Device With High Mobility And System Of Forming The Integrated Circuit App 20190164962 - SIO; KAM-TOU ;   et al. | 2019-05-30 |
Dual power structure with connection pins Grant 10,276,499 - Peng , et al. | 2019-04-30 |
Semiconductor Device Including Source/drain Contact Having Height Below Gate Stack App 20190123036 - YOUNG; Charles Chew-Yuen ;   et al. | 2019-04-25 |
Power Strap Structure For High Performance And Low Current Density App 20190122987 - Chen; Chih-Liang ;   et al. | 2019-04-25 |
Advanced Metal Connection With Metal Cut App 20190051595 - Chen; Chih-Liang ;   et al. | 2019-02-14 |
Middle end-of-line strap for standard cell Grant 10,204,857 - Shen , et al. Feb | 2019-02-12 |
Dummy Mol Removal For Performance Enhancement App 20190043759 - Yang; Hui-Ting ;   et al. | 2019-02-07 |
Semiconductor Device Which Includes Fins App 20190019797 - CHEN; Chih-Liang ;   et al. | 2019-01-17 |
Semiconductor device including source/drain contact having height below gate stack Grant 10,177,133 - Young , et al. J | 2019-01-08 |
System and Method for Calculating Cell Edge Leakage App 20190005181 - Peng; Shih-Wei ;   et al. | 2019-01-03 |
Layout modification method and system Grant 10,169,515 - Sio , et al. J | 2019-01-01 |
Power strap structure for high performance and low current density Grant 10,170,422 - Chen , et al. J | 2019-01-01 |
Method of adjusting metal line pitch Grant 10,162,930 - Lin , et al. Dec | 2018-12-25 |
Interconnect metal layout for integrated circuit Grant 10,157,922 - Lin , et al. Dec | 2018-12-18 |
Via Rail Solution For High Power Electromigration App 20180358309 - Sio; Kam-Tou ;   et al. | 2018-12-13 |
Advanced metal connection with metal cut Grant 10,109,582 - Chen , et al. October 23, 2 | 2018-10-23 |
Dummy MOL removal for performance enhancement Grant 10,096,522 - Yang , et al. October 9, 2 | 2018-10-09 |
Method of manufacturing fins and semiconductor device which includes fins Grant 10,074,657 - Chen , et al. September 11, 2 | 2018-09-11 |
High-density semiconductor device Grant 10,032,759 - Chen , et al. July 24, 2 | 2018-07-24 |
Power Strap Structure For High Performance And Low Current Density App 20180174967 - Chen; Chih-Liang ;   et al. | 2018-06-21 |
High-Density Semiconductor Device App 20180151381 - Chou; Lei-Chun ;   et al. | 2018-05-31 |
Interconnect Metal Layout For Integrated Circuit App 20180151567 - LIN; Wei-Cheng ;   et al. | 2018-05-31 |
High-Density Semiconductor Device App 20180151551 - Chen; Chih-Liang ;   et al. | 2018-05-31 |
Integrated Circuit, System For And Method Of Forming An Integrated Circuit App 20180151559 - SIO; Kam-Tou ;   et al. | 2018-05-31 |
Method Of Manufacturing Conductors And Semiconductor Device Which Includes Conductors App 20180151552 - SIO; Kam-Tou ;   et al. | 2018-05-31 |
Self Aligned Via and Method for Fabricating the Same App 20180151432 - Chen; Chih-Liang ;   et al. | 2018-05-31 |
Structure And Formation Method Of Semiconductor Device Structure App 20180151729 - SIO; Kam-Tou ;   et al. | 2018-05-31 |
Middle-end-of-line Strap For Standard Cell App 20180096930 - SHEN; Meng-Hung ;   et al. | 2018-04-05 |
Semiconductor device including source/drain contact having height below gate stack Grant 9,917,050 - Chen , et al. March 13, 2 | 2018-03-13 |
System For And Method Of Manufacturing A Layout Design Of An Integrated Circuit App 20180068050 - LIN; Wei-Cheng ;   et al. | 2018-03-08 |
Power strap structure for high performance and low current density Grant 9,911,697 - Chen , et al. March 6, 2 | 2018-03-06 |
Method Of Adjusting Metal Line Pitch App 20180039723 - LIN; WEI-CHENG ;   et al. | 2018-02-08 |
Dual Power Structure With Connection Pins App 20180019207 - Peng; Shih-Wei ;   et al. | 2018-01-18 |
Middle end-of-line strap for standard cell Grant 9,837,353 - Shen , et al. December 5, 2 | 2017-12-05 |
Dummy Mol Removal For Performance Enhancement App 20170323832 - Yang; Hui-Ting ;   et al. | 2017-11-09 |
Power Strap Structure For High Performance And Low Current Density App 20170317027 - Chen; Chih-Liang ;   et al. | 2017-11-02 |
Method Of Manufacturing Fins And Semiconductor Device Which Includes Fins App 20170317089 - CHEN; Chih-Liang ;   et al. | 2017-11-02 |
Advanced Metal Connection With Metal Cut App 20170301618 - Chen; Chih-Liang ;   et al. | 2017-10-19 |
Finfet Switch App 20170301586 - Sio; Kam-Tou ;   et al. | 2017-10-19 |
Dual power structure with connection pins Grant 9,793,211 - Peng , et al. October 17, 2 | 2017-10-17 |
Middle-end-of-line Strap For Standard Cell App 20170256484 - SHEN; Meng-Hung ;   et al. | 2017-09-07 |
Designed-based interconnect structure in semiconductor structure Grant 9,754,881 - Chen , et al. September 5, 2 | 2017-09-05 |
High fin cut fabrication process Grant 9,679,994 - Chou , et al. June 13, 2 | 2017-06-13 |
Layout Modification Method And System App 20170140086 - SIO; KAM-TOU ;   et al. | 2017-05-18 |
Via Rail Solution for High Power Electromigration App 20170117272 - Sio; Kam-Tou ;   et al. | 2017-04-27 |
Dual Power Structure with Connection Pins App 20170110405 - Peng; Shih-Wei ;   et al. | 2017-04-20 |
Structure And Method For Semiconductor Device App 20170040259 - Chen; Chih-Liang ;   et al. | 2017-02-09 |
Method of forming semiconductor device including source/drain contact having height below gate stack Grant 9,478,636 - Chen , et al. October 25, 2 | 2016-10-25 |
Structure And Method For Semiconductor Device App 20160268244 - YOUNG; Charles Chew-Yuen ;   et al. | 2016-09-15 |
Designed-based Interconnect Structure In Semiconductor Structure App 20160172297 - CHEN; Chih-Liang ;   et al. | 2016-06-16 |
Designed-based interconnect structure in semiconductor structure Grant 9,281,273 - Chen , et al. March 8, 2 | 2016-03-08 |
Designed-based Interconnect Structure In Semiconductor Structure App 20160064322 - CHEN; Chih-Liang ;   et al. | 2016-03-03 |
Semiconductor Arrangement And Formation Thereof App 20150349071 - Chen; Chih-Liang ;   et al. | 2015-12-03 |
Structure and Method for Semiconductor Device App 20150332962 - Chen; Chih-Liang ;   et al. | 2015-11-19 |
Semiconductor arrangement and formation thereof Grant 9,184,250 - Chen , et al. November 10, 2 | 2015-11-10 |
Integrated circuit layout having mixed track standard cell Grant 8,698,205 - Tzeng , et al. April 15, 2 | 2014-04-15 |
Integrated Circuit Layout Having Mixed Track Standard Cell App 20130313615 - TZENG; Jiann-Tyng ;   et al. | 2013-11-28 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.