| Patent | Date |
|---|
Vertical Memory Devices
App 20220271090 - SINGH; Sunil Kumar ; et al. | 2022-08-25 |
Vertical memory devices
Grant 11,367,750 - Singh , et al. June 21, 2 | 2022-06-21 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20220059404 - Singh; Sunil Kumar ; et al. | 2022-02-24 |
Etch damage and ESL free dual damascene metal interconnect
Grant 11,171,041 - Singh , et al. November 9, 2 | 2021-11-09 |
Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product
Grant 11,094,585 - Tran , et al. August 17, 2 | 2021-08-17 |
Conductive Structures For Contacting A Top Electrode Of An Embedded Memory Device And Methods Of Making Such Contact Structures On An Ic Product
App 20210066126 - Ramanathan; Eswar ; et al. | 2021-03-04 |
Methods Of Forming A Conductive Contact Structure To A Top Electrode Of An Embedded Memory Device On An Ic Product And A Corresponding Ic Product
App 20210013095 - Tran; Xuan Anh ; et al. | 2021-01-14 |
Multiple-time programmable (MTP) memory device with a wrap-around control gate
Grant 10,886,287 - Tran , et al. January 5, 2 | 2021-01-05 |
Vertical Memory Devices
App 20200395541 - SINGH; Sunil Kumar ; et al. | 2020-12-17 |
Multiple-time Programmable (mtp) Memory Device With A Wrap-around Control Gate
App 20200227424 - Tran; Xuan Anh ; et al. | 2020-07-16 |
Interconnect structures with reduced capacitance
Grant 10,672,710 - Singh , et al. | 2020-06-02 |
Self-aligned single diffusion break for fully depleted silicon-on-insulator and method for producing the same
Grant 10,580,684 - Wallner , et al. | 2020-03-03 |
Interconnect Structures With Reduced Capacitance
App 20190371736 - SINGH; Sunil Kumar ; et al. | 2019-12-05 |
Self-aligned Single Diffusion Break For Fully Depleted Silicon-on-insulator And Method For Producing The Same
App 20190318955 - WALLNER; Jin ; et al. | 2019-10-17 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20190279896 - Singh; Sunil Kumar ; et al. | 2019-09-12 |
Etch damage and ESL free dual damascene metal interconnect
Grant 10,312,136 - Singh , et al. | 2019-06-04 |
Dual Developing Methods For Lithography Patterning
App 20190079408 - Mehta; Sohan Singh ; et al. | 2019-03-14 |
Formulation for improving the yield and quality of fiber in cotton plants
Grant 10,111,427 - Sawant , et al. October 30, 2 | 2018-10-30 |
Low resistance conductive contacts
Grant 10,084,093 - Mishra , et al. September 25, 2 | 2018-09-25 |
Metholodogy for profile control and capacitance reduction
Grant 10,083,904 - Singh , et al. September 25, 2 | 2018-09-25 |
Method to fabricate a high performance capacitor in a back end of line (BEOL)
Grant 9,960,113 - Singh , et al. May 1, 2 | 2018-05-01 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20180033684 - Singh; Sunil Kumar ; et al. | 2018-02-01 |
A Novel Formulation For Improving The Yield And Quality Of Fiber In Cotton Plants
App 20180027811 - SAWANT; Samir Viswanath ; et al. | 2018-02-01 |
Method To Fabricate A High Performance Capacitor In A Back End Of Line (beol)
App 20170294378 - SINGH; Sunil Kumar ; et al. | 2017-10-12 |
Etch damage and ESL free dual damascene metal interconnect
Grant 9,786,549 - Singh , et al. October 10, 2 | 2017-10-10 |
Reducing defects and improving reliability of BEOL metal fill
Grant 9,741,605 - Singh August 22, 2 | 2017-08-22 |
Method to fabricate a high performance capacitor in a back end of line (BEOL)
Grant 9,711,346 - Singh , et al. July 18, 2 | 2017-07-18 |
Metholodogy For Profile Control And Capacitance Reduction
App 20170200674 - Singh; Sunil Kumar ; et al. | 2017-07-13 |
Methods And Devices For Metal Filling Processes
App 20170186688 - SINGH; Sunil Kumar ; et al. | 2017-06-29 |
Methods and devices for back end of line via formation
Grant 9,691,654 - Singh , et al. June 27, 2 | 2017-06-27 |
Methods And Devices For Back End Of Line Via Formation
App 20170178953 - SINGH; Sunil Kumar ; et al. | 2017-06-22 |
Methods and devices for metal filling processes
Grant 9,613,909 - Singh , et al. April 4, 2 | 2017-04-04 |
Process for the preparation of dipeptidylpeptidase inhibitors
Grant 9,593,119 - Singh , et al. March 14, 2 | 2017-03-14 |
Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same
Grant 9,576,894 - Singh , et al. February 21, 2 | 2017-02-21 |
Methods And Devices For Metal Filling Processes
App 20170047290 - SINGH; Sunil Kumar ; et al. | 2017-02-16 |
Filling Cavities In An Integrated Circuit And Resulting Devices
App 20170047248 - RULLAN; Jonathan Lee ; et al. | 2017-02-16 |
Method To Fabricate A High Performance Capacitor In A Back End Of Line (beol)
App 20170025270 - SINGH; Sunil Kumar ; et al. | 2017-01-26 |
Filling cavities in an integrated circuit and resulting devices
Grant 9,524,935 - Rullan , et al. December 20, 2 | 2016-12-20 |
Integrated Circuits Including Organic Interlayer Dielectric Layers And Methods For Fabricating The Same
App 20160358851 - Singh; Sunil Kumar ; et al. | 2016-12-08 |
Filling Cavities In An Integrated Circuit And Resulting Devices
App 20160336264 - RULLAN; Jonathan Lee ; et al. | 2016-11-17 |
Process For The Preparation Of Dipeptidylpeptidase Inhibitors
App 20160272642 - Singh; Sunil Kumar ; et al. | 2016-09-22 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20160211174 - Singh; Sunil Kumar ; et al. | 2016-07-21 |
Reducing Defects And Improving Reliability Of Beol Metal Fill
App 20160190003 - SINGH; Sunil Kumar | 2016-06-30 |
Methods of fabricating BEOL interlayer structures
Grant 9,362,162 - Singh , et al. June 7, 2 | 2016-06-07 |
Process for the preparation of dipeptidylpeptidase inhibitors
Grant 9,353,114 - Singh , et al. May 31, 2 | 2016-05-31 |
Etch damage and ESL free dual damascene metal interconnect
Grant 9,318,377 - Singh , et al. April 19, 2 | 2016-04-19 |
Methods Of Fabricating Beol Interlayer Structures
App 20160049327 - SINGH; Sunil Kumar ; et al. | 2016-02-18 |
Reduced Capacitance Interlayer Structures And Fabrication Methods
App 20150348907 - SINGH; Sunil Kumar ; et al. | 2015-12-03 |
Reduced capacitance interlayer structures and fabrication methods
Grant 9,142,451 - Singh , et al. September 22, 2 | 2015-09-22 |
Process For The Preparation Of Dipeptidylpeptidase Inhibitors
App 20150239887 - Singh; Sunil Kumar ; et al. | 2015-08-27 |
Interconnection wires of semiconductor devices
Grant 9,093,501 - Singh , et al. July 28, 2 | 2015-07-28 |
Reduced Capacitance Interlayer Structures And Fabrication Methods
App 20150076705 - SINGH; Sunil Kumar ; et al. | 2015-03-19 |
Addition of carboxyl groups plasma during etching for interconnect reliability enhancement
Grant 8,901,007 - Tsai , et al. December 2, 2 | 2014-12-02 |
Interconnection Wires of Semiconductor Devices
App 20140315382 - Singh; Sunil Kumar ; et al. | 2014-10-23 |
Interconnection wires of semiconductor devices
Grant 8,778,794 - Singh , et al. July 15, 2 | 2014-07-15 |
Addition Of Carboxyl Groups Plasma During Etching For Interconnect Reliability Enhancement
App 20140187044 - Tsai; Cheng-Hsiung ; et al. | 2014-07-03 |
Interconnection Wires Of Semiconductor Devices
App 20140175650 - Singh; Sunil Kumar ; et al. | 2014-06-26 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20140117561 - Singh; Sunil Kumar ; et al. | 2014-05-01 |
Etch damage and ESL free dual damascene metal interconnect
Grant 8,652,962 - Singh , et al. February 18, 2 | 2014-02-18 |
Etch Damage And Esl Free Dual Damascene Metal Interconnect
App 20130334700 - Singh; Sunil Kumar ; et al. | 2013-12-19 |
Air gap for interconnect application
Grant 7,682,963 - Chen , et al. March 23, 2 | 2010-03-23 |
Air Gap For Interconnect Application
App 20090091038 - Chen; Hai-Ching ; et al. | 2009-04-09 |
Fibrate Compounds Having Ppar Agonist Activity
App 20080114005 - Das; Saibal Kumar ; et al. | 2008-05-15 |
Process for the preparation of optically pure isomers of 2-(4-hydroxy phenoxy)-2-methyl-butyric acid methyl ester
Grant 7,230,129 - Kumar , et al. June 12, 2 | 2007-06-12 |
Process for the preparation of optically pure isomers of 2-(4-hydroxy phenoxy)-2-methyl-butyric acid methyl ester
App 20060194980 - Kumar; Potlapally Rejender ; et al. | 2006-08-31 |
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