Simon; Andrew

Patent Applications and Registrations

Patent applications and USPTO patent grants for Simon; Andrew.The latest application filed is for "system and method for wireless power transfer using time reversed electromagnetic wave propagation".

Company Profile

1.13.16

Simon; Andrew - Gaithersburg MD
Simon; Andrew - Marlborough MA
Simon; Andrew - Hopewell Junction NY US
Simon; Andrew - Fishkill NY
Simon; Andrew - Worcester MA US
Simon, Andrew - Sandwich GB
Simon; Andrew - Carluke ML84QQ Lanarkshire GB6

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System and method for wireless power transfer using time reversed electromagnetic wave propagation Grant 11,101,915 - Anlage , et al. August 24, 2	2021-08-24
System And Method For Wireless Power Transfer Using Time Reversed Electromagnetic Wave Propagation App 20190140766 - ANLAGE; STEVEN MARK ; et al.	2019-05-09
Moisture Retention Seal App 20140158687 - Honan; David ; et al.	2014-06-12
Nickel-silicide formation with differential Pt composition Grant 8,741,773 - Frye , et al. June 3, 2	2014-06-03
Sandwiched Diffusion Barrier And Metal Liner For An Interconnect Structure App 20140138837 - Niu; Chengyu ; et al.	2014-05-22
Copper Seed Layer For An Interconnect Structure Having A Doping Concentration Level Gradient App 20140138832 - Niu; Chengyu ; et al.	2014-05-22
Copper seed layer for an interconnect structure having a doping concentration level gradient Grant 8,729,702 - Niu , et al. May 20, 2	2014-05-20
Nickel-silicide formation with differential Pt composition Grant 8,637,925 - Frye , et al. January 28, 2	2014-01-28
Strip Dispenser App 20130020347 - Gieda; Christopher ; et al.	2013-01-24
Nickel-silicide Formation With Differential Pt Composition App 20120153359 - Frye; Asa ; et al.	2012-06-21
Nickel-silicide Formation With Differential Pt Composition App 20110169058 - Frye; Asa ; et al.	2011-07-14
Metered Dispenser App 20110163118 - Gieda; Christopher ; et al.	2011-07-07
Dual damascene interconnect structures having different materials for line and via conductors Grant 7,704,876 - Gambino , et al. April 27, 2	2010-04-27
Dual Damascene Interconnect Structures Having Different Materials For Line And Via Conductors App 20080026566 - Gambino; Jeffrey ; et al.	2008-01-31
Dual damascene interconnect structures having different materials for line and via conductors Grant 7,300,867 - Gambino , et al. November 27, 2	2007-11-27
Constant emissivity deposition member Grant 7,037,834 - McFeely , et al. May 2, 2	2006-05-02
Constant emissivity deposition member App 20050260833 - McFeely, Fenton Read ; et al.	2005-11-24
Dual damascene interconnect structures having different materials for line and via conductors App 20050245068 - Gambino, Jeffrey ; et al.	2005-11-03
Dual damascene interconnect structures having different materials for line and via conductors Grant 6,958,540 - Gambino , et al. October 25, 2	2005-10-25
Dual Damascene Interconnect Structures Having Different Materials For Line And Via Conductors App 20040262764 - Gambino, Jeffrey P. ; et al.	2004-12-30
Simultaneous native oxide removal and metal neutral deposition method Grant 6,784,105 - Yang , et al. August 31, 2	2004-08-31
Alkylamide compounds App 20030105097 - Simon, Andrew ; et al.	2003-06-05
Microstructure liner having improved adhesion Grant 6,380,628 - Miller , et al. April 30, 2	2002-04-30
Method And Structure For Improving Electromigration Of Chip Interconnects App 20020047208 - UZOH, CYPRIAN EMEKA ; et al.	2002-04-25
Microstructure Liner Having Improved Adhesion App 20010019884 - MILLER, JOHN A. ; et al.	2001-09-06
Performing maintenance operations on heat exchanger tube bundles Grant 4,323,398 - Simon April 6, 1	1982-04-06

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